公开(公告)号：US20220251433A1

公开(公告)日：2022-08-11

申请号：US17622489

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Kwangseok PARK ,  Inki JEONG ,  Subyung PARK

IPC: C09J163/00 ,  C09J11/04 ,  C09J7/38 ,  H05K3/28

Abstract: An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

公开(公告)号：US20230135423A1

公开(公告)日：2023-05-04

申请号：US17910703

申请日：2021-03-12

Applicant: DOOSAN CORPORATION

Inventor： Kwangseok PARK ,  Euidock RYU ,  Inki JEONG ,  Subyung PARK ,  Dongho CHAE

IPC: C09J163/00 ,  C09J109/02 ,  H05K3/28 ,  C09J7/30

Abstract: An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.