公开(公告)号：US20230049939A1

公开(公告)日：2023-02-16

申请号：US17794064

申请日：2020-12-14

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Hyungrae ROH ,  Kwangseok PARK ,  Sanghwa KIM

IPC: H05K3/28 ,  B32B37/00 ,  B32B37/06 ,  B32B41/00 ,  B32B38/18 ,  B32B27/28 ,  B32B15/08 ,  B32B15/20 ,  B32B37/20 ,  B65H23/188

Abstract: A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

公开(公告)号：US20220251433A1

公开(公告)日：2022-08-11

申请号：US17622489

申请日：2020-06-25

Applicant: DOOSAN CORPORATION

Inventor： Sungmoon KIM ,  Kwangseok PARK ,  Inki JEONG ,  Subyung PARK

IPC: C09J163/00 ,  C09J11/04 ,  C09J7/38 ,  H05K3/28

Abstract: An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.

公开(公告)号：US20230135423A1

公开(公告)日：2023-05-04

申请号：US17910703

申请日：2021-03-12

Applicant: DOOSAN CORPORATION

Inventor： Kwangseok PARK ,  Euidock RYU ,  Inki JEONG ,  Subyung PARK ,  Dongho CHAE

IPC: C09J163/00 ,  C09J109/02 ,  H05K3/28 ,  C09J7/30

Abstract: An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.