公开(公告)号：US20190292364A1

公开(公告)日：2019-09-26

申请号：US16316775

申请日：2017-06-30

申请人： DOOSAN CORPORATION

发明人： Moo Hyun KIM ,  Jeong Don KWON ,  Dong Hee JUNG ,  Ji Hong SHIN

IPC分类号： C08L71/12 ,  C08L27/18 ,  C08J5/24 ,  H05K1/03 ,  H05K1/02 ,  B32B15/14 ,  B32B27/12 ,  B32B5/02 ,  B32B15/20

摘要： The present invention relates to a thermosetting resin composition, and a prepreg, a laminate sheet and a printed circuit board, which use the same. The thermosetting resin composition comprises: (a) a polyphenylene ether having two or more unsaturated substituents, selected from the group consisting of vinyl and allyl groups, at both ends of its molecular chain, or an oligomer thereof; and (b) a polytetrafluoroethylene (PTFE) filler.

公开(公告)号：US20170342264A1

公开(公告)日：2017-11-30

申请号：US15538488

申请日：2015-12-21

申请人： DOOSAN CORPORATION

发明人： Dong Hee JUNG ,  Jeong Don KWON ,  Moo Hyun KIM ,  Do Woong HONG

IPC分类号： C08L71/02 ,  C08J5/04 ,  H05K3/02 ,  B32B27/28 ,  C08K3/28 ,  C08J5/24 ,  C08K5/00 ,  C08K9/06 ,  H05K1/03

摘要： The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

公开(公告)号：US20160297967A1

公开(公告)日：2016-10-13

申请号：US15036097

申请日：2014-11-25

申请人： DOOSAN CORPORATION

发明人： Dong Hee JUNG ,  Duk Sang HAN ,  Jeong Don KWON ,  Moo Hyun KIM ,  Do Woong HONG

IPC分类号： C08L71/12 ,  H05K1/02 ,  C08J5/24

CPC分类号： C08L71/12 ,  C08J3/246 ,  C08J5/24 ,  C08J2371/12 ,  C08J2463/02 ,  C08J2479/00 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0353 ,  H05K2201/0129 ,  C08L71/126 ,  C08L79/04

摘要： The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.

摘要翻译： 本公开内容提供：热固性树脂组合物，其包含：（a）双酚M型环氧树脂; （b）双酚M型氰酸酯树脂; （c）在支链两端具有两个以上乙烯基的聚苯醚或其低聚物; 和（d）交联固化剂，包含该组合物的预浸料和印刷电路板。 印刷电路板同时具有优异的低介电损耗特性，大的吸湿和耐热特性，低热膨胀特性，热稳定性等。

公开(公告)号：US20190284393A1

公开(公告)日：2019-09-19

申请号：US16424251

申请日：2019-05-28

申请人： DOOSAN CORPORATION

发明人： Dong Hee JUNG ,  Jeong Don KWON ,  Moo Hyun KIM ,  Do Woong HONG

IPC分类号： C08L71/02 ,  C08J5/24 ,  C08J5/04 ,  B32B27/28 ,  C08G65/48 ,  C08K3/28 ,  H05K3/02 ,  C08J5/08 ,  C08K9/06 ,  C08K5/00

摘要： A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.