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公开(公告)号：US09556327B2
公开(公告)日：2017-01-31
申请号：US14906579
申请日：2014-09-02
发明人： Don L Kleyer , Randall G Schmidt , Adam C Tomasik , Shengqing Xu
IPC分类号： C08K5/5419 , C07F15/02 , H01L23/29
CPC分类号： C08K5/5419 , C07F15/025 , C08K5/5406 , H01L23/296 , H01L2924/0002 , C08L83/04 , H01L2924/00
摘要： An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
摘要翻译： 用于硅酮密封剂的添加剂具有以下结构：式（I）其中R 1和R 2各自为-O-Si（R 4）（R 5）（R 6），并且R 4，R 5和R 6各自独立地选自C 1 -C 10烃基 基团，C 1 -C 10烷基，C 2 -C 10烯基和C 6 -C 10芳基，其中R 3独立地选自C 1 -C 10烃基，C 1 -C 10烷基，C 2 -C 10烯基和C 6 -C 10 芳基。 使用包括使铁金属或铁（III）化合物与羟基官能的有机硅氧烷反应的步骤的方法形成添加剂。 密封剂包括添加剂和聚有机硅氧烷。 密封剂可用于形成包括电子部件和设置在电子部件上的密封剂的装置。 该装置使用包括将密封剂设置在电子设备上的步骤的方法形成。
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公开(公告)号：US09963546B2
公开(公告)日：2018-05-08
申请号：US15115321
申请日：2015-03-10
IPC分类号： C08G77/38 , C08G65/00 , C08L33/08 , C09D183/08 , C08G77/395 , C08G77/48 , C08G77/50 , C08G77/385 , C08L35/02 , C09D135/02
CPC分类号： C08G65/007 , C08G77/38 , C08G77/385 , C08G77/395 , C08G77/48 , C08G77/50 , C08G2650/04 , C08G2650/16 , C08G2650/64 , C08L33/08 , C08L35/02 , C08L2203/16 , C08L2205/03 , C09D135/02 , C09D183/08 , C08K3/36 , C08K5/5425
摘要： A fluorinated compound having at least one (meth)acrylate functional group disclosed. A curable composition comprising the fluorinated compound and polyfunctional acrylate, a cured product formed from the curable composition, and method of forming the cured product are also disclosed.
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公开(公告)号：US09493634B2
公开(公告)日：2016-11-15
申请号：US14906575
申请日：2014-09-02
IPC分类号： C08K5/5419 , C07F7/08 , C09D183/04
摘要： An additive for a silicone encapsulant has the structure: (I) R1Ce(OSi—R2) I I a R3 wherein a is 3 or 4, wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.
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公开(公告)号：US20160177061A1
公开(公告)日：2016-06-23
申请号：US14906579
申请日：2014-09-02
IPC分类号： C08K5/5419 , H01L23/29 , C07F15/02
CPC分类号： C08K5/5419 , C07F15/025 , C08K5/5406 , H01L23/296 , H01L2924/0002 , C08L83/04 , H01L2924/00
摘要： An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
摘要翻译： 用于硅酮密封剂的添加剂具有以下结构：式（I）其中R 1和R 2各自为-O-Si（R 4）（R 5）（R 6），并且R 4，R 5和R 6各自独立地选自C 1 -C 10烃基 基团，C 1 -C 10烷基，C 2 -C 10烯基和C 6 -C 10芳基，其中R 3独立地选自C 1 -C 10烃基，C 1 -C 10烷基，C 2 -C 10烯基和C 6 -C 10 芳基。 使用包括使铁金属或铁（III）化合物与羟基官能的有机硅氧烷反应的步骤的方法形成添加剂。 密封剂包括添加剂和聚有机硅氧烷。 密封剂可用于形成包括电子部件和设置在电子部件上的密封剂的装置。 该装置使用包括将密封剂设置在电子设备上的步骤的方法形成。
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