公开(公告)号：US20170145190A1

公开(公告)日：2017-05-25

申请号：US15300012

申请日：2015-03-23

Applicant: DSM IP ASSETS B.V.

Inventor： Hans Klaas VAN DIJK ,  Xubo XU

IPC: C08K7/14 ,  C08L77/06 ,  C08K5/03 ,  C08K3/34

CPC classification number: C08K7/14 ,  C08K3/34 ,  C08K3/346 ,  C08K5/03 ,  C08K2201/001 ,  C08L77/06 ,  C08L77/02

Abstract: The present invention relates to a thermoconductive polymer composition comprising: a) 10-30 wt. % of glass fibers; b) 40-45 wt. % of talc; c) 20-50 wt. % of a thermoplastic polymer comprising at least one polyamide selected from the group consisting of PA46, PA6, PA66 and mixtures thereof; wherein the sum of a) and b) is at least 50 wt. % and at most 70 wt. % and wherein the weight percentages (wt. %) are relative to the total weight of the composition.

公开(公告)号：US20170240727A1

公开(公告)日：2017-08-24

申请号：US15519610

申请日：2015-10-21

Applicant: DSM IP ASSETS B.V.

Inventor： Frank Peter Theodorus J. VAN DER BURGT ,  Xubo XU

IPC: C08K7/14 ,  C08L77/06

CPC classification number: C08K7/14 ,  C08G69/265 ,  C08K2201/003 ,  C08K2201/014 ,  C08L77/06 ,  C08L2203/20 ,  C08L2205/025 ,  C08L77/00

Abstract: The present invention relates to a reinforced polyamide molding composition, comprising a thermoplastic polyamide and a fibrous reinforcing agent, wherein the fibrous reinforcing agent comprises a mixture of glass fibers made of E-glass and glass fibers made of High Strength-glass. The present invention also relates to a molded part, made of the reinforced polyamide molding composition, as well as to an electrical or electronic device, comprising the molded part.