公开(公告)号：US20170145190A1

公开(公告)日：2017-05-25

申请号：US15300012

申请日：2015-03-23

Applicant: DSM IP ASSETS B.V.

Inventor： Hans Klaas VAN DIJK ,  Xubo XU

IPC: C08K7/14 ,  C08L77/06 ,  C08K5/03 ,  C08K3/34

CPC classification number: C08K7/14 ,  C08K3/34 ,  C08K3/346 ,  C08K5/03 ,  C08K2201/001 ,  C08L77/06 ,  C08L77/02

Abstract: The present invention relates to a thermoconductive polymer composition comprising: a) 10-30 wt. % of glass fibers; b) 40-45 wt. % of talc; c) 20-50 wt. % of a thermoplastic polymer comprising at least one polyamide selected from the group consisting of PA46, PA6, PA66 and mixtures thereof; wherein the sum of a) and b) is at least 50 wt. % and at most 70 wt. % and wherein the weight percentages (wt. %) are relative to the total weight of the composition.

公开(公告)号：US20210002481A1

公开(公告)日：2021-01-07

申请号：US16982782

申请日：2019-03-21

Applicant: DSM IP ASSETS B.V.

Inventor： Hans Klaas VAN DIJK ,  Martin WOLFFS

IPC: C08L77/06 ,  C08G69/26 ,  C08K7/06 ,  C08K7/12

Abstract: The invention relates to a polyamide polymer; to a polymer composition comprising the polyamide polymer and a fibrous reinforcing agent or a filler, or a combination thereof; to a molded part made of the polymer composition; and to an automotive vehicle comprising a load-bearing structural part made of the molded part. Herein the polyamide polymer has a glass transition temperature (Tg) of at least 145° C. and a dynamic modulus (E′), measured at a temperature (Tmod) equal to Tg+15° C., in the range of 100 MPa-700 MPa.

公开(公告)号：US20160083638A1

公开(公告)日：2016-03-24

申请号：US14785494

申请日：2014-04-25

Applicant: DSM IP ASSETS B.V.

Inventor： Patrick Gerardus DUIS ,  Adnan HASANOVIC ,  Hans Klaas VAN DIJK

IPC: C09K5/08 ,  C08L77/02

CPC classification number: C09K5/08 ,  C08K3/016 ,  C08K3/38 ,  C08K5/0066 ,  C08K7/14 ,  C08L77/02 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/025 ,  C09K21/08 ,  C09K21/10 ,  C09K21/12

Abstract: The invention relates to a smart junction box made from a thermally conductive thermoplastic polymer composition comprising a thermoplastic polymer, between 10 and 40 wt. % of a thermally conductive (TC) filler, between 15 and 30 wt. % of a flame retardant (FR) and between 20 and 45 wt. % of glass fibres (GF). The invention also relates to a polymer composition comprising between 25 and 67.5 wt. % of at least one aliphatic polyamide, between 10 and 40 wt. % of a thermally conductive (TC) filler, between 15 and 30 wt. % of a flame retardant (FR) and between 7.5 and 40 wt. % of glass fibres (GF), wherein the weight percentages (wt. %) are relative to the total weight of the composition.

Abstract translation: 本发明涉及由导热热塑性聚合物组合物制成的智能接线盒，该组合物包含10至40wt。 ％的导热（TC）填料，在15和30wt。 阻燃剂（FR）的％和20至45wt。 ％的玻璃纤维（GF）。 本发明还涉及包含25-67.5重量％ ％至少一种脂族聚酰胺，10至40wt。 ％的导热（TC）填料，在15和30wt。 阻燃剂（FR）的％和7.5至40wt。 ％的玻璃纤维（GF），其中重量百分比（wt。％）相对于组合物的总重量。

公开(公告)号：US20180201731A1

公开(公告)日：2018-07-19

申请号：US15744263

申请日：2016-07-22

Applicant: DSM IP ASSETS B.V.

Inventor： Hans Klaas VAN DIJK ,  Michiel Gerardus Henricus Maria BALTUSSEN

IPC: C08G69/30

CPC classification number: C08G69/30 ,  C08G69/46

Abstract: The invention relates to a process for preparing a polymer composition, comprising a blending step wherein a first polymer (component A1) and at least one further component are dosed into and mixed in a mixing apparatus, and wherein the first polymer A1 is a granulate polyamide material directly obtained by direct solid state polymerization of a diammonium dicarboxylate salt prepared by fluidized bed spray granulation. The invention also relates to a dry-blend obtainable by said process.

公开(公告)号：US20170217063A1

公开(公告)日：2017-08-03

申请号：US15489653

申请日：2017-04-17

Applicant: DSM IP ASSETS B.V.

Inventor： Hans Klaas VAN DIJK ,  Joseph Johannes Franciscus Marie KERSEMAKERS ,  Paulus Hubertus Helena DORMANS

IPC: B29C45/16 ,  B32B7/02

CPC classification number: B29C45/16 ,  B29K2077/00 ,  B29K2995/0013 ,  B29L2011/0083 ,  B32B7/02 ,  Y10T428/24942

Abstract: The invention relates to an assembly of parts comprising a first part containing a first polymer composition and a second part containing a second polymer composition, both compositions comprising a semi-crystalline polymer and optionally one or more other components, the first part and the second part being fastened to each other through an interface between the first polymer composition and the second polymer composition, wherein the interface is free from mechanically interlocking elements and the thermal conductivity of the second polymer composition (TC2) is higher than the thermal conductivity of the first polymer composition (TC1) with a factor TC2/TC1 of at least 1.5. The invention further relates to a process for manufacturing such an assembly and to various uses of said assembly.