ELECTRONIC DEVICE CASE HAVING ANTENNA PATTERN EMBEDDED THEREIN, METHOD FOR MANUFACTURING THE SAME, MOLD FOR MANUFACTURING ANTENNA PATTERN FRAME, AND ELECTRONIC DEVICE
    1.
    发明申请
    ELECTRONIC DEVICE CASE HAVING ANTENNA PATTERN EMBEDDED THEREIN, METHOD FOR MANUFACTURING THE SAME, MOLD FOR MANUFACTURING ANTENNA PATTERN FRAME, AND ELECTRONIC DEVICE 审中-公开
    具有嵌入天线图案的电子设备壳体,其制造方法,用于制造天线图案的模具和电子设备

    公开(公告)号:US20120001807A1

    公开(公告)日:2012-01-05

    申请号:US13091850

    申请日:2011-04-21

    IPC分类号: H01Q1/24 B29C45/14 B29C45/04

    CPC分类号: H01Q1/40 H01Q1/243 H01Q1/38

    摘要: An electronic device case includes: a radiator including an antenna pattern part transmitting or receiving a signal and a connection terminal part allowing the signal to be transmitted to or received from a circuit board of an electronic device; a radiator frame including the radiator injection-molded thereon, separated from the connection terminal part so that the connection part can have elasticity, and having a radiator support protruded from the opposite surface of one surface on which the antenna pattern part is formed; and a case frame covering one surface of the radiator frame to allow the antenna pattern part to be embedded between the case frame and the radiator frame.

    摘要翻译: 电子设备壳体包括:辐射器,包括发送或接收信号的天线图案部分和允许信号发送到电子设备的电路板或从电子设备的电路板接收的连接端子部分; 散热器框架,其包括注射在其上的散热器,与连接端子部分分离,使得连接部分具有弹性,并且具有从形成有天线图案部分的一个表面的相对表面突出的散热器支撑件; 以及覆盖散热器框架的一个表面的壳体框架,以允许天线图案部分嵌入在壳体框架和散热器框架之间。