公开(公告)号：US20110163823A1

公开(公告)日：2011-07-07

申请号：US12983073

申请日：2010-12-31

Applicant: Dae-Hyun PARK ,  Han Kim ,  Myung-Sam Kang

Inventor： Dae-Hyun PARK ,  Han Kim ,  Myung-Sam Kang

IPC: H04B3/28

CPC classification number: H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/097

Abstract: In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other.

Abstract translation: 在包括多个导电板和缝合通孔部分的电磁带隙结构中，其中多个导电板被放置在第一平坦表面上，该缝合通孔部分包括第一通孔，该第一通孔的一个端部连接到两个 导电板，具有连接到两个导电板中的另一个的一个端部的第二通孔，在垂直于第一平坦表面的至少一个垂直平面上形成螺旋形串联结构的螺旋形连接器，第一导电 螺旋连接器的一个端部和第一通孔的另一个端部彼此连接的图案，以及将螺旋形连接器的另一个端部和第二通孔的另一个端部彼此连接的第二导电连接图案。

公开(公告)号：US20130048365A1

公开(公告)日：2013-02-28

申请号：US13590760

申请日：2012-08-21

Applicant: Han KIM ,  Dae-Hyun PARK ,  Young-Min Ban

Inventor： Han KIM ,  Dae-Hyun PARK ,  Young-Min Ban

IPC: H05K9/00

CPC classification number: H01L23/64 ,  H01L23/552 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0224 ,  H05K1/0236 ,  H01L2924/00014

Abstract: An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area and having unit structures arranged repeatedly therein, the unit structures configured for inhibiting EMI noise from being radiated to an outside through the lateral side of the first area. The unit structure can include: a top conductive plate and a bottom conductive plate, formed, respectively, on the top layer and the bottom layer of the second area to face each other in a pair; and a via, connecting the top conductive plate with the bottom conductive plate.

Abstract translation: 具有顶层和底层的EMI噪声降低封装板，其中一个具有安装在其上的半导体器件，其可以包括：具有布置在其一个表面上的信号层的第一区域; 以及放置在所述第一区域的横向侧上并具有重复排列的单元结构的第二区域，所述单元结构被配置为用于抑制EMI噪声通过第一区域的侧面辐射到外部。 该单元结构可以包括：顶部导电板和底部导电板，分别形成在第一区域的顶层和底层上，以便成对地彼此面对; 以及将顶部导电板与底部导电板连接的通孔。