公开(公告)号：US20050221534A1

公开(公告)日：2005-10-06

申请号：US10815968

申请日：2004-03-31

申请人： Daewoong Suh ,  Saikumar Jayaraman ,  Mohd Bin Basiron ,  Sheau Lim ,  Yoong P. Chin

发明人： Daewoong Suh ,  Saikumar Jayaraman ,  Mohd Bin Basiron ,  Sheau Lim ,  Yoong P. Chin

IPC分类号： H01L21/44 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2224/05599

摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a solder bump that is disposed upon the lower surface. The stress-relief layer flows against the solder bump. A stress-compensation collar is formed on a board to which the substrate is mated and the SCC partially embeds the solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes a stress-relief layer and a stress-compensation collar is also included.

摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的焊料凸块的条件来形成应力消除层。 应力消除层流向焊料凸块。 应力补偿轴环形成在与基板配合的板上，并且SCC部分地嵌入焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括一个包括应力消除层和应力补偿环的计算系统。