公开(公告)号：US20080314507A1

公开(公告)日：2008-12-25

申请号：US11658880

申请日：2004-08-02

申请人： Munehiro Hatai ,  Satoshi Hayashi ,  Masateru Fukuoka ,  Shigeru Danjo ,  Yasuhiko Oyama ,  Kazuhiro Shimomura ,  Daihei Sugita ,  Yoshikazu Kitajima

发明人： Munehiro Hatai ,  Satoshi Hayashi ,  Masateru Fukuoka ,  Shigeru Danjo ,  Yasuhiko Oyama ,  Kazuhiro Shimomura ,  Daihei Sugita ,  Yoshikazu Kitajima

IPC分类号： B32B38/10

CPC分类号： C09J5/00 ,  C08K5/23 ,  C09J5/08 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  C09J2433/00 ,  H01L21/67115

摘要： It is an object of the invention to provide a method for producing an IC chip capable of producing an IC chip with a thickness as extremely thin as 50 μm or thinner, for example, about 25 to 30 μm at a high productivity.The invention is a method for producing an IC chip, which comprises; at least a step 1 of fixing a wafer in a support plate by sticking the wafer to the gas generating agent-containing face of a pressure sensitive adhesive double-faced tape having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by light radiation in at least one face; a step 2 of grinding the wafer in a state of being fixed in the support plate through the pressure sensitive adhesive double-faced tape; a step 3 of radiating light to the pressure sensitive adhesive double-faced tape; and a step 4 of separating the pressure sensitive adhesive double-faced tape from the wafer, a gas releasing speed from the pressure sensitive adhesive double-faced tape being 5 L/cm2·min or higher in the step 3.

摘要翻译： 本发明的目的是提供一种制造IC芯片的方法，所述IC芯片能够以高生产率制造厚度极薄至50μm或更薄，例如约25至30μm的IC芯片。 本发明是一种制造IC芯片的方法，包括： 至少步骤1，通过将晶片粘贴到具有压敏粘合剂层的压敏粘合剂双面胶带的气体发生剂含有面上，将晶片固定在支撑板中，该压敏粘合剂层含有用于产生气体的气体发生剂 至少一面的光辐射; 在通过压敏双面胶带固定在支撑板上的状态下研磨晶片的步骤2; 向压敏胶双面胶带照射光的步骤3; 以及在步骤3中将压敏粘合剂双面胶带从晶片分离的步骤4，压敏粘合剂双面胶带的气体释放速度为5L / cm2.min以上。

公开(公告)号：US20070037364A1

公开(公告)日：2007-02-15

申请号：US10577442

申请日：2004-12-02

申请人： Daihei Sugita ,  Masateru Fukuoka ,  Munehiro Hatai ,  Satoshi Hayashi ,  Kazuhiro Shimomura ,  Yoshikazu Kitajima ,  Yasuhiko Oyama

发明人： Daihei Sugita ,  Masateru Fukuoka ,  Munehiro Hatai ,  Satoshi Hayashi ,  Kazuhiro Shimomura ,  Yoshikazu Kitajima ,  Yasuhiko Oyama

IPC分类号： H01L21/00

CPC分类号： H01L21/67132

摘要： It is the object of the invention to provide a method for manufacturing a semiconductor chip capable of obtaining a semiconductor chip at a high manufacturing efficiency without damages. The invention is a method for manufacturing a semiconductor chip, which comprises a tape adhesion step of sticking a pressure sensitive adhesive tape for dicing having a pressure sensitive adhesive layer containing a gas generating agent for generating a gas by radiating light to a semiconductor wafer with a circuit formed; a dicing step for dicing the wafer with the pressure sensitive adhesive tape for dicing stuck and dividing the semiconductor wafer into each semiconductor chip; a separation step of separating at least a portion of the pressure sensitive adhesive tape for dicing from the semiconductor chip by radiating light to the divided each semiconductor chip; and a pickup step of picking the semiconductor chip up by a needle-less pickup method.

摘要翻译： 本发明的目的是提供一种能够以高制造效率获得半导体芯片而不损坏的半导体芯片的制造方法。 本发明是一种半导体芯片的制造方法，其特征在于，包括粘贴粘合带的粘合步骤，该粘合带具有粘合层，该压敏粘合带具有含有用于产生气体的气体发生剂的压敏粘合剂层， 电路形成; 切割步骤，用用于切割粘合的压敏粘合带切割晶片并将半导体晶片分成每个半导体芯片; 分离步骤，通过向所述分割的每个半导体芯片照射光来将用于切割的所述压敏粘合带的至少一部分与所述半导体芯片分离; 以及通过无针拾取方法拾取半导体芯片的拾取步骤。

公开(公告)号：US20130220533A1

公开(公告)日：2013-08-29

申请号：US13822731

申请日：2011-09-14

申请人： Toru Tonegawa ,  Takahiro Asao ,  Yuichi Sumii ,  Shigeru Nomura ,  Masateru Fukuoka ,  Daihei Sugita

发明人： Toru Tonegawa ,  Takahiro Asao ,  Yuichi Sumii ,  Shigeru Nomura ,  Masateru Fukuoka ,  Daihei Sugita

IPC分类号： H01L21/683 ,  C09J133/10 ,  C09J183/04 ,  B32B38/10

CPC分类号： H01L21/6836 ,  B32B38/10 ,  C08G77/20 ,  C08L83/04 ,  C09J7/38 ,  C09J133/02 ,  C09J133/10 ,  C09J183/04 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2483/00 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/2891

摘要： The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200° C. or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.

摘要翻译： 本发明的目的在于提供一种粘合剂组合物，其具有高的初始粘合性并且可以强烈固定被粘物，同时即使在200℃或更高温度下进行高温处理，也可以通过光照射容易地剥离。 本发明的目的还在于提供一种由粘合剂组合物制造的胶带以及使用粘合剂组合物的晶片处理方法。 本发明提供一种粘合剂组合物，其包含粘合剂组分，光引发剂和含有可与粘合剂组分交联的官能团的硅氧烷化合物。

公开(公告)号：US20120037223A1

公开(公告)日：2012-02-16

申请号：US13254914

申请日：2010-06-25

申请人： Isao Yamanaka ,  Shintaro Moriguchi ,  Kenji Yamauchi ,  Hiroshi Hiraike ,  Kazuhiro Omori ,  Daihei Sugita

发明人： Isao Yamanaka ,  Shintaro Moriguchi ,  Kenji Yamauchi ,  Hiroshi Hiraike ,  Kazuhiro Omori ,  Daihei Sugita

IPC分类号： H01L31/0224 ,  H01B1/20 ,  H01B1/22 ,  C08F30/02

CPC分类号： H01L31/022433 ,  C08F220/14 ,  C08F220/18 ,  C08F230/02 ,  H01B1/22 ,  Y02E10/50

摘要： An object of the present invention is to provide a binder resin for a conductive paste, which can be used to obtain a conductive paste having a high conductive powder dispersibility, an ability to form high-aspect-ratio lines, and a low residual carbon content after firing. Further objects of the invention are to provide a conductive paste and a solar cell element produced using such a binder resin for a conductive paste.The invention provides a binder resin for a conductive paste, which includes a polymer having a main chain composed of a segment derived from a (meth)acrylate monomer and having also a phosphoric acid-based component represented by general formula (1) below at an ω position thereon. In general formula (1), X is an oxygen atom or a sulfur atom, and R1 and R2 are each a hydrogen atom, a hydrocarbon group having 1 to 13 carbon atoms, a hydroxyl group-containing group having 1 to 13 carbon atoms or an ester bond-containing group having 1 to 13 carbon atoms.

摘要翻译： 本发明的目的是提供一种用于导电浆料的粘合剂树脂，其可用于获得具有高导电粉末分散性，形成高纵横比线的能力和低残留碳含量的导电浆料 射击后 本发明的另外的目的是提供使用这种用于导电浆料的粘合剂树脂制备的导电浆料和太阳能电池元件。 本发明提供了一种用于导电浆料的粘合剂树脂，其包括具有由（甲基）丙烯酸酯单体衍生的链段的主链的聚合物，并且还具有以下通式（1）表示的磷酸基组分： ω位置。 在通式（1）中，X是氧原子或硫原子，R 1和R 2各自为氢原子，碳原子数1〜13的烃基，碳原子数1〜13的含羟基的基团， 含有1〜13个碳原子的含有酯键的基团。

公开(公告)号：US20130071658A1

公开(公告)日：2013-03-21

申请号：US13636566

申请日：2011-03-17

申请人： Shigeru Nomura ,  Daihei Sugita ,  Toru Tonegawa

发明人： Shigeru Nomura ,  Daihei Sugita ,  Toru Tonegawa

IPC分类号： C09J11/06 ,  C09J7/02 ,  H01L21/027

CPC分类号： C09J11/06 ,  C08K5/3472 ,  C09J7/20 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/027 ,  H01L21/6836 ,  H01L21/76898 ,  H01L2221/68372 ,  H01L2221/68381 ,  Y10T428/2852

摘要： The present invention aims to provide an adhesive composition having high adhesive strength, as well as being easily detachable and having excellent heat resistance, an adhesive tape comprising the adhesive composition, a method for treating a semiconductor wafer using the adhesive tape, and a method for producing a TSV wafer. The present invention relates to an adhesive composition comprising: an adhesive component; and a tetrazole compound represented by the following formula (1), formula (2), or formula (3), or its salt: wherein R1 and R2 each may be hydrogen, a hydroxy group, an amino group, or a C1-C7 alkyl group, alkylene group, phenyl group, or mercapto group; and the C1-C7 alkyl group, alkylene group, phenyl group, and mercapto group may be substituted.

摘要翻译： 本发明的目的在于提供一种粘合剂组合物，其粘合强度高，易于拆卸，耐热性优异，粘合剂组合物的粘合带，使用该粘合带的半导体晶片的处理方法， 生产TSV晶片。 本发明涉及一种粘合剂组合物，其包含：粘合剂组分; 和由下式（1），式（2）或式（3）表示的四唑化合物或其盐：其中R 1和R 2各自可以是氢，羟基，氨基或C 1 -C 7 烷基，亚烷基，苯基或巯基; 并且C 1 -C 7烷基，亚烷基，苯基和巯基可以被取代。