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公开(公告)号：US07825676B2
公开(公告)日：2010-11-02
申请号：US11798188
申请日：2007-05-10
IPC分类号： G01R31/02
CPC分类号： H05K3/308 , G01R1/0466 , G01R1/0483 , G01R1/06716 , H01R12/52 , H01R12/57 , H01R13/2485 , H01R2201/20 , H05K3/325 , H05K3/4623 , H05K2201/0311 , H05K2201/096 , H05K2201/10734
摘要： A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that contacts a terminal of an electronic part and a second contact part that contacts the electrically conductive part in a middle portion. When the contact terminal bends by the first contact part being pressed, the second contact part contacts the electrically conductive part of the contactor substrate and an appropriate degree of contact pressure is obtained.
摘要翻译： 由导电材料形成的接触端子布置在接触器基板的多个孔中的每一个中。 导电部分形成在每个孔的内表面上。 接触端子具有接触电子部件的端子的第一接触部分和在中间部分中与导电部件接触的第二接触部分。 当接触端子被第一接触部分按压时，第二接触部分接触接触器基板的导电部分并获得适当的接触压力。
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公开(公告)号：US20070252608A1
公开(公告)日：2007-11-01
申请号：US11798188
申请日：2007-05-10
IPC分类号： G01R31/02
CPC分类号： H05K3/308 , G01R1/0466 , G01R1/0483 , G01R1/06716 , H01R12/52 , H01R12/57 , H01R13/2485 , H01R2201/20 , H05K3/325 , H05K3/4623 , H05K2201/0311 , H05K2201/096 , H05K2201/10734
摘要： A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that contacts a terminal of an electronic part and a second contact part that contacts the electrically conductive part in a middle portion. When the contact terminal bends by the first contact part being pressed, the second contact part contacts the electrically conductive part of the contactor substrate and an appropriate degree of contact pressure is obtained.
摘要翻译： 由导电材料形成的接触端子布置在接触器基板的多个孔中的每一个中。 导电部分形成在每个孔的内表面上。 接触端子具有接触电子部件的端子的第一接触部分和在中间部分中与导电部件接触的第二接触部分。 当接触端子被第一接触部分按压时，第二接触部分接触接触器基板的导电部分并获得适当的接触压力。
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3.发明授权Semiconductor device protection cover, and semiconductor device unit including the cover 有权半导体器件保护盖和包括盖的半导体器件单元公开(公告)号：US07382046B2
公开(公告)日：2008-06-03
申请号：US10800630
申请日：2004-03-16
IPC分类号： H01L23/12
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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公开(公告)号：US08164181B2
公开(公告)日：2012-04-24
申请号：US12872131
申请日：2010-08-31
IPC分类号： H01L23/12
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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5.发明申请公开(公告)号：US20080203558A1
公开(公告)日：2008-08-28
申请号：US12081961
申请日：2008-04-24
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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6.发明授权Contactor, method for manufacturing such contactor, and testing method using such contactor 失效接触器，制造这种接触器的方法以及使用这种接触器的测试方法公开(公告)号：US06767219B2
公开(公告)日：2004-07-27
申请号：US10292839
申请日：2002-11-13
申请人： Shigeyuki Maruyama , Naoyuki Watanabe , Kazuhiro Tashiro , Naohito Kohashi , Osamu Igawa , Tetsuya Fujisawa
发明人： Shigeyuki Maruyama , Naoyuki Watanabe , Kazuhiro Tashiro , Naohito Kohashi , Osamu Igawa , Tetsuya Fujisawa
IPC分类号： H01R1200
CPC分类号： G01R1/0675 , G01R3/00 , H05K7/1069
摘要： A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An inclined plane is formed by a cutting surface. A fracture surface formed by a tension fracture is formed at the apex portion of the contact electrode.
摘要翻译： 接触器具有接触器基板和形成在接触器基板上的多个接触电极。 每个接触电极由在连接到接触器基板的一端和另一端之间弯曲的金属线形成。 倾斜平面由切割面形成。 在接触电极的顶点处形成由张力断裂形成的断裂面。
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公开(公告)号：US08268670B2
公开(公告)日：2012-09-18
申请号：US13240508
申请日：2011-09-22
IPC分类号： H01L21/44
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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8.发明申请公开(公告)号：US20110049699A1
公开(公告)日：2011-03-03
申请号：US12872131
申请日：2010-08-31
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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9.发明申请公开(公告)号：US20050072972A1
公开(公告)日：2005-04-07
申请号：US10800630
申请日：2004-03-16
IPC分类号： G01R31/26 , H01L21/50 , H01L21/66 , H01L21/673 , H01L23/00 , H01L23/04 , H01L23/544 , H01L23/58
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。
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10.发明授权公开(公告)号：US07977961B2
公开(公告)日：2011-07-12
申请号：US12358522
申请日：2009-01-23
申请人： Daisuke Koizumi , Naohito Kohashi , Yuji Akasaki
发明人： Daisuke Koizumi , Naohito Kohashi , Yuji Akasaki
IPC分类号： G01R31/00
CPC分类号： G01R31/2863 , G01R31/2865
摘要： A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.
摘要翻译： 用于电子部件的测试装置的部件包括测试板; 投影电极，设置在测试板的主表面上; 所述定位部设置在所述测试板的主表面上，所述定位部被配置为定位所述电子部件; 以及按压部，被构造成按压由所述定位部定位的所述电子部件，并且使所述电子部件的引导部与所述突起电极接触，使得所述引线部弹性变形并与所述突起电极接触。
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