-
公开(公告)号：US20050146923A1
公开(公告)日：2005-07-07
申请号：US10746173
申请日：2003-12-24
申请人： Daniel Diana , Douglas Janousek , Ebrahim Andideh , Mark Richards , Hitesh Windlass , Michael Deangelis
发明人： Daniel Diana , Douglas Janousek , Ebrahim Andideh , Mark Richards , Hitesh Windlass , Michael Deangelis
CPC分类号： G11C11/22
摘要： By using a plurality of relatively thin stacked diffusion layers interposed between a conductive line and a polymer layer, the diffusion of contaminates into a polymer layer from the conductive line may be reduced. This may reduce part failure during fatigue or disturb testing, for example, in ferroelectric polymer memories.
摘要翻译： 通过使用介于导电线和聚合物层之间的多个相对薄的堆叠扩散层，可以减少污染物从导电线扩散到聚合物层中。 这可以减少疲劳或干扰测试中的部件故障，例如在铁电聚合物存储器中。
-
公开(公告)号：US20060105100A1
公开(公告)日：2006-05-18
申请号：US11304046
申请日：2005-12-15
申请人： Daniel Diana , Hitesh Windlass , William Hicks , Timothy Lanfri , Michael Deangelis , Ebrahim Andideh
发明人： Daniel Diana , Hitesh Windlass , William Hicks , Timothy Lanfri , Michael Deangelis , Ebrahim Andideh
IPC分类号： B05D5/12
CPC分类号： H01L27/285 , B82Y10/00 , G11C13/0014 , G11C13/0016 , H01L51/0021
摘要： An electrode layer for a polymer memory may be implanted to increase the number of defects in the material. As a result, that same material may be utilized for the upper and lower electrodes. In particular, defects may be introduced into a TiOx layer within the electrode to match the work functions of the upper and lower electrodes.
摘要翻译： 可以植入用于聚合物存储器的电极层以增加材料中的缺陷数量。 结果，可以使用相同的材料用于上电极和下电极。 特别地，可以将缺陷引入电极内的TiO 2层以匹配上电极和下电极的功函数。
-
公开(公告)号：US20050139879A1
公开(公告)日：2005-06-30
申请号：US10746073
申请日：2003-12-24
申请人： Daniel Diana , Hitesh Windlass , William Hicks , Timothy Lanfri , Michael Deangelis , Ebrahim Andideh
发明人： Daniel Diana , Hitesh Windlass , William Hicks , Timothy Lanfri , Michael Deangelis , Ebrahim Andideh
CPC分类号： H01L27/285 , B82Y10/00 , G11C13/0014 , G11C13/0016 , H01L51/0021
摘要： An electrode layer for a polymer memory may be implanted to increase the number of defects in the material. As a result, that same material may be utilized for the upper and lower electrodes. In particular, defects may be introduced into a TiOx layer within the electrode to match the work functions of the upper and lower electrodes.
摘要翻译： 可以植入用于聚合物存储器的电极层以增加材料中的缺陷数量。 结果，可以使用相同的材料用于上电极和下电极。 特别地，可以将缺陷引入电极内的TiO 2层以匹配上电极和下电极的功函数。
-
公开(公告)号：US20050145907A1
公开(公告)日：2005-07-07
申请号：US10749500
申请日：2003-12-31
申请人： Hitesh Windlass , Ebrahim Andideh , Daniel Diana , Mark Richards , William Hicks
发明人： Hitesh Windlass , Ebrahim Andideh , Daniel Diana , Mark Richards , William Hicks
CPC分类号： C23C14/5833 , C23C14/205 , H01L28/55
摘要： Methods of depositing various metal layers adjacent to a ferroelectric polymer layer are disclosed. In one embodiment, a collimator may be used during a sputtering process to filter out charged particles from the material that may be deposited as a metal layer. In various embodiments, a metal layer may contain at least one of an intermetallic layer, an amorphous intermetallic layer, and an amorphized intermetallic layer.
摘要翻译： 公开了沉积与铁电聚合物层相邻的各种金属层的方法。 在一个实施例中，可以在溅射过程期间使用准直器来从可以作为金属层沉积的材料中滤出带电粒子。 在各种实施例中，金属层可以包含金属间化合物层，非晶态金属间化合物层和非晶化金属间化合物层中的至少一个。
-
公开(公告)号：US20060076593A1
公开(公告)日：2006-04-13
申请号：US11255282
申请日：2005-10-20
申请人： Hitesh Windlass , Ebrahim Andideh , Daniel Diana , Mark Richards , William Hicks
发明人： Hitesh Windlass , Ebrahim Andideh , Daniel Diana , Mark Richards , William Hicks
IPC分类号： H01L29/94
CPC分类号： C23C14/5833 , C23C14/205 , H01L28/55
摘要： Methods of depositing various metal layers adjacent to a ferroelectric polymer layer are disclosed. In one embodiment, a collimator may be used during a sputtering process to filter out charged particles from the material that may be deposited as a metal layer. In various embodiments, a metal layer may contain at least one of an intermetallic layer, an amorphous intermetallic layer, and an amorphized intermetallic layer.
摘要翻译： 公开了沉积与铁电聚合物层相邻的各种金属层的方法。 在一个实施例中，可以在溅射过程期间使用准直器来从可以作为金属层沉积的材料中滤出带电粒子。 在各种实施例中，金属层可以包含金属间化合物层，非晶态金属间化合物层和非晶化金属间化合物层中的至少一个。
-
公开(公告)号：US20050070032A1
公开(公告)日：2005-03-31
申请号：US10676795
申请日：2003-09-30
申请人： Mark Richards , Daniel Diana , Hitesh Windlass , Wayne Ford , Ebrahim Andideh
发明人： Mark Richards , Daniel Diana , Hitesh Windlass , Wayne Ford , Ebrahim Andideh
IPC分类号： G03C5/00 , G11C13/00 , H01L21/00 , H01L21/336 , H01L29/94 , H01L31/113
摘要： According to one aspect of the invention, a memory array and a method of constructing a memory array are provided. An insulating layer is formed on a semiconductor substrate. A first metal stack is then formed on the insulating layer. The first metal stack is etched to form first metal lines. A polymeric layer is formed over the first metal lines and the insulating layer. The polymeric layer has a surface with a plurality of roughness formations. A second metal stack is formed on the polymeric layer with an interface layer, which is thicker than the heights of the roughness formations. Then the second metal stack is etched to form second metal lines. Memory cells are formed wherever a second metal line extends over a first metal line.
-
公开(公告)号：US20050104106A1
公开(公告)日：2005-05-19
申请号：US11015841
申请日：2004-12-17
申请人： Mark Richards , Daniel Diana , Hitesh Windlass , Wayne Ford , Ebrahim Andideh
发明人： Mark Richards , Daniel Diana , Hitesh Windlass , Wayne Ford , Ebrahim Andideh
IPC分类号： G03C5/00 , G11C13/00 , H01L21/00 , H01L21/336 , H01L29/94 , H01L31/113
摘要： According to one aspect of the invention, a memory array and a method of constructing a memory array are provided. An insulating layer is formed on a semiconductor substrate. A first metal stack is then formed on the insulating layer. The first metal stack is etched to form first metal lines. A polymeric layer is formed over the first metal lines and the insulating layer. The polymeric layer has a surface with a plurality of roughness formations. A second metal stack is formed on the polymeric layer with an interface layer, which is thicker than the heights of the roughness formations. Then the second metal stack is etched to form second metal lines. Memory cells are formed wherever a second metal line extends over a first metal line.
摘要翻译： 根据本发明的一个方面，提供了存储器阵列和构造存储器阵列的方法。 绝缘层形成在半导体衬底上。 然后在绝缘层上形成第一金属叠层。 第一金属叠层被蚀刻以形成第一金属线。 在第一金属线和绝缘层之上形成聚合物层。 聚合物层具有多个粗糙结构的表面。 在聚合物层上形成第二金属叠层，其界面层比粗糙结构层的高度厚。 然后蚀刻第二金属叠层以形成第二金属线。 存储单元形成在第二金属线在第一金属线上延伸的地方。
-
8.发明申请公开(公告)号：US20050106760A1
公开(公告)日：2005-05-19
申请号：US10713307
申请日：2003-11-14
申请人： Hitesh Windlass , Ebrahim Andideh , Daniel Diana
发明人： Hitesh Windlass , Ebrahim Andideh , Daniel Diana
IPC分类号： G11C11/22 , H01L21/00 , H01L21/31 , H01L21/469
摘要： Methods for improving the net remnant polarization of a polymer memory cell are disclosed. In one embodiment, the polymer material is heated above the Curie temperature of the polymer material, and the domains of the polymer material are aligned with an externally applied electric field.
摘要翻译： 公开了改善聚合物存储单元净残余极化的方法。 在一个实施方案中，将聚合物材料加热到聚合物材料的居里温度以上，并且聚合物材料的区域与外部施加的电场对准。
-
公开(公告)号：US06974984B2
公开(公告)日：2005-12-13
申请号：US10749500
申请日：2003-12-31
CPC分类号： C23C14/5833 , C23C14/205 , H01L28/55
摘要： Methods of depositing various metal layers adjacent to a ferroelectric polymer layer are disclosed. In one embodiment, a collimator may be used during a sputtering process to filter out charged particles from the material that may be deposited as a metal layer. In various embodiments, a metal layer may contain at least one of an intermetallic layer, an amorphous intermetallic layer, and an amorphized intermetallic layer.
-
10.发明授权公开(公告)号：US07396692B2
公开(公告)日：2008-07-08
申请号：US10713307
申请日：2003-11-14
IPC分类号： H01L21/312 , H01L21/47
摘要： Methods for improving the net remnant polarization of a polymer memory cell are disclosed. In one embodiment, the polymer material is heated above the Curie temperature of the polymer material, and the domains of the polymer material are aligned with an externally applied electric field.
摘要翻译： 公开了改善聚合物存储单元净残余极化的方法。 在一个实施方案中，将聚合物材料加热到聚合物材料的居里温度以上，并且聚合物材料的区域与外部施加的电场对准。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.023 秒)
