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公开(公告)号：US20070289329A1
公开(公告)日：2007-12-20
申请号：US11425164
申请日：2006-06-20
CPC分类号： F25B41/06 , F25B2341/0661 , F25B2500/04
摘要： A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.
摘要翻译： 提供了一种用于蒸汽压缩制冷系统的多端口膨胀装置，其通过防止由于其机械设计造成的孔堵塞而提高了可靠性。 此外，考虑了两个或更多个类似或不同尺寸的端口孔的多个端口阵列，其允许基于冗余孔和引脚组合的进一步的可靠性。
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公开(公告)号：US07793512B2
公开(公告)日：2010-09-14
申请号：US11425164
申请日：2006-06-20
IPC分类号： F25B41/04
CPC分类号： F25B41/06 , F25B2341/0661 , F25B2500/04
摘要： A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.
摘要翻译： 提供了一种用于蒸汽压缩制冷系统的多端口膨胀装置，其通过防止由于其机械设计造成的孔堵塞而提高了可靠性。 此外，考虑了两个或更多个类似或不同尺寸的端口孔的多个端口阵列，其允许基于冗余孔和引脚组合的进一步的可靠性。
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3.发明申请CONDENSATION DETECTOR UTILIZING A WET BULB AND DRY BULB TEMPERATURE DIFFERENTIAL 失效冷凝检测器利用湿布和干燥温度差异公开(公告)号：US20090086789A1
公开(公告)日：2009-04-02
申请号：US11863457
申请日：2007-09-28
IPC分类号： G01N25/56
CPC分类号： G01N25/66
摘要： Apparatus, systems and methods for coordinated detecting condensation utilizing a wet bulb and dry bulb temperature differential are disclosed. According to exemplary embodiments, a condensation detector may include; a first temperature sensor which generates a first temperature signal corresponding to a temperature measured at the first temperature sensor, a second temperature sensor which generates a second temperature signal corresponding to a temperature measured at the second temperature sensor, a connector having a first end connected to the first temperature sensor, and a detector which receives the first and the second temperature signals and determines the presence of condensation at a second end of the connector based on differences between the first and second temperature signals.
摘要翻译： 公开了使用湿球和干球温度差的协调检测冷凝的装置，系统和方法。 根据示例性实施例，冷凝检测器可以包括： 第一温度传感器，其产生对应于在第一温度传感器测量的温度的第一温度信号;第二温度传感器，其产生对应于在第二温度传感器测量的温度的第二温度信号;连接器，其具有连接到 第一温度传感器和接收第一和第二温度信号的检测器，并且基于第一和第二温度信号之间的差异来确定在连接器的第二端处存在冷凝。
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4.发明授权公开(公告)号：US07762718B2
公开(公告)日：2010-07-27
申请号：US11863457
申请日：2007-09-28
CPC分类号： G01N25/66
摘要： Apparatus, systems and methods for coordinated detecting condensation utilizing a wet bulb and dry bulb temperature differential are disclosed. According to exemplary embodiments, a condensation detector may include; a first temperature sensor which generates a first temperature signal corresponding to a temperature measured at the first temperature sensor, a second temperature sensor which generates a second temperature signal corresponding to a temperature measured at the second temperature sensor, a connector having a first end connected to the first temperature sensor, and a detector which receives the first and the second temperature signals and determines the presence of condensation at a second end of the connector based on differences between the first and second temperature signals.
摘要翻译： 公开了使用湿球和干球温度差的协调检测冷凝的装置，系统和方法。 根据示例性实施例，冷凝检测器可以包括： 第一温度传感器，其产生对应于在第一温度传感器测量的温度的第一温度信号;第二温度传感器，其产生对应于在第二温度传感器测量的温度的第二温度信号;连接器，其具有连接到 第一温度传感器和接收第一和第二温度信号的检测器，并且基于第一和第二温度信号之间的差异来确定在连接器的第二端处存在冷凝。
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公开(公告)号：US07181965B2
公开(公告)日：2007-02-27
申请号：US11017604
申请日：2004-12-20
CPC分类号： G01F23/247 , G01F23/248
摘要： A liquid level sensor comprising a thermistor probe and a power source connected to the thermistor probe to heat the thermistor probe. A cover encases the thermistor probe and includes openings allowing liquid to enter and exit an interior of the cover and contact the thermistor probe. A detector detects a liquid level in response to a voltage at the thermistor probe.
摘要翻译： 液位传感器包括热敏电阻探头和连接到热敏电阻探针的电源，以加热热敏电阻探针。 盖子封装热敏电阻探头，并且包括允许液体进入和离开盖子内部并接触热敏电阻探头的开口。 检测器响应于热敏电阻探头处的电压检测液位。
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公开(公告)号：US20090219681A1
公开(公告)日：2009-09-03
申请号：US12036572
申请日：2008-02-25
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US20100277865A1
公开(公告)日：2010-11-04
申请号：US12834137
申请日：2010-07-12
IPC分类号： G06F1/20
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US08018718B2
公开(公告)日：2011-09-13
申请号：US12834137
申请日：2010-07-12
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US07808783B2
公开(公告)日：2010-10-05
申请号：US12036572
申请日：2008-02-25
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US06923014B2
公开(公告)日：2005-08-02
申请号：US10653633
申请日：2003-09-02
申请人： Gary F. Goth , Daniel J. Kearney , Robert P. Makowicki , W. David McClafferty , Donald W. Porter
发明人： Gary F. Goth , Daniel J. Kearney , Robert P. Makowicki , W. David McClafferty , Donald W. Porter
CPC分类号： F25B5/02 , F25B2341/0653 , F25B2700/2116 , F25B2700/21161 , F25B2700/21163 , F25B2700/2117 , F25B2700/21174 , F25B2700/21175 , Y02B30/72
摘要： An exemplary embodiment is a cooling system for cooling multiple logic modules. The cooling system includes a condenser, a first electrically controlled expansion valve coupled to the condenser and a first evaporator coupled to the first electrically controlled expansion valve. A second electrically controlled expansion valve is coupled to the condenser and a second evaporator coupled to the second electrically controlled expansion valve. A controller provides control signals to the first electrically controlled expansion valve and the second electrically controlled expansion valve to control operation of the first electrically controlled expansion valve and the second electrically controlled expansion valve. A compressor is coupled to the first evaporator, the second evaporator and the condenser.
摘要翻译： 示例性实施例是用于冷却多个逻辑模块的冷却系统。 冷却系统包括冷凝器，耦合到冷凝器的第一电控膨胀阀和耦合到第一电控膨胀阀的第一蒸发器。 第二电控膨胀阀联接到冷凝器和耦合到第二电控膨胀阀的第二蒸发器。 控制器向第一电控膨胀阀和第二电控膨胀阀提供控制信号，以控制第一电控膨胀阀和第二电控膨胀阀的操作。 压缩机联接到第一蒸发器，第二蒸发器和冷凝器。
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