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公开(公告)号：US20090219681A1
公开(公告)日：2009-09-03
申请号：US12036572
申请日：2008-02-25
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US20100277865A1
公开(公告)日：2010-11-04
申请号：US12834137
申请日：2010-07-12
IPC分类号： G06F1/20
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US08018718B2
公开(公告)日：2011-09-13
申请号：US12834137
申请日：2010-07-12
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US07808783B2
公开(公告)日：2010-10-05
申请号：US12036572
申请日：2008-02-25
IPC分类号： H05K7/20
CPC分类号： G06F1/206 , F25B49/02 , F25B2400/06 , H05K7/20818 , H05K7/20836
摘要： Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
摘要翻译： 这里公开了具有第一和第二多个芯片模块（MCM）和冷却模块的计算机系统。 冷却模块包括与所述第一MCM相关联的第一冷却回路和第一蒸发器。 冷却模块还包括与所述第二MCM相关联的第二冷却回路和第二蒸发器。 每个冷却回路耦合到从每个冷却回路接收热能的公共冷凝器。 控制器耦合到第一和第二冷却回路，并响应于操作条件的变化来适应第一和第二冷却回路的操作，以提供第一和第二MCM的冷却。
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公开(公告)号：US06923014B2
公开(公告)日：2005-08-02
申请号：US10653633
申请日：2003-09-02
申请人： Gary F. Goth , Daniel J. Kearney , Robert P. Makowicki , W. David McClafferty , Donald W. Porter
发明人： Gary F. Goth , Daniel J. Kearney , Robert P. Makowicki , W. David McClafferty , Donald W. Porter
CPC分类号： F25B5/02 , F25B2341/0653 , F25B2700/2116 , F25B2700/21161 , F25B2700/21163 , F25B2700/2117 , F25B2700/21174 , F25B2700/21175 , Y02B30/72
摘要： An exemplary embodiment is a cooling system for cooling multiple logic modules. The cooling system includes a condenser, a first electrically controlled expansion valve coupled to the condenser and a first evaporator coupled to the first electrically controlled expansion valve. A second electrically controlled expansion valve is coupled to the condenser and a second evaporator coupled to the second electrically controlled expansion valve. A controller provides control signals to the first electrically controlled expansion valve and the second electrically controlled expansion valve to control operation of the first electrically controlled expansion valve and the second electrically controlled expansion valve. A compressor is coupled to the first evaporator, the second evaporator and the condenser.
摘要翻译： 示例性实施例是用于冷却多个逻辑模块的冷却系统。 冷却系统包括冷凝器，耦合到冷凝器的第一电控膨胀阀和耦合到第一电控膨胀阀的第一蒸发器。 第二电控膨胀阀联接到冷凝器和耦合到第二电控膨胀阀的第二蒸发器。 控制器向第一电控膨胀阀和第二电控膨胀阀提供控制信号，以控制第一电控膨胀阀和第二电控膨胀阀的操作。 压缩机联接到第一蒸发器，第二蒸发器和冷凝器。
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公开(公告)号：US06760221B2
公开(公告)日：2004-07-06
申请号：US10278503
申请日：2002-10-23
申请人： Gary F. Goth , Jody A. Hickey , Daniel J. Kearney , John J. Loparco , William D. McClafferty , Donald W. Porter
发明人： Gary F. Goth , Jody A. Hickey , Daniel J. Kearney , John J. Loparco , William D. McClafferty , Donald W. Porter
IPC分类号： H05K720
CPC分类号： F28D15/0266 , G06F1/20 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.
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公开(公告)号：US20070289329A1
公开(公告)日：2007-12-20
申请号：US11425164
申请日：2006-06-20
CPC分类号： F25B41/06 , F25B2341/0661 , F25B2500/04
摘要： A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.
摘要翻译： 提供了一种用于蒸汽压缩制冷系统的多端口膨胀装置，其通过防止由于其机械设计造成的孔堵塞而提高了可靠性。 此外，考虑了两个或更多个类似或不同尺寸的端口孔的多个端口阵列，其允许基于冗余孔和引脚组合的进一步的可靠性。
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公开(公告)号：US07793512B2
公开(公告)日：2010-09-14
申请号：US11425164
申请日：2006-06-20
IPC分类号： F25B41/04
CPC分类号： F25B41/06 , F25B2341/0661 , F25B2500/04
摘要： A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.
摘要翻译： 提供了一种用于蒸汽压缩制冷系统的多端口膨胀装置，其通过防止由于其机械设计造成的孔堵塞而提高了可靠性。 此外，考虑了两个或更多个类似或不同尺寸的端口孔的多个端口阵列，其允许基于冗余孔和引脚组合的进一步的可靠性。
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9.发明授权Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom 失效用于保持被测电子设备的机械夹具显示多个自由度的调整公开(公告)号：US06262582B1
公开(公告)日：2001-07-17
申请号：US09418655
申请日：1999-10-15
申请人： Dennis R. Barringer , Mark R. LaForce , Mark A. Marnell , Donald W. Porter , Roger R. Schmidt , Wade H. White
发明人： Dennis R. Barringer , Mark R. LaForce , Mark A. Marnell , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： G01R3102
CPC分类号： G01R31/2887 , Y10S269/90 , Y10S269/903
摘要： A fixture to hold an electronic substrate having probe areas on a top surface. The top surface of the electronic substrate is left open to provide a maximum area to couple interconnect wires for a device under test. In addition, a bottom surface of the substrate is left open to provide a maximum area to couple with a probe card in one embodiment, or a test head in another embodiment. This open bottom and open top minimize the mechanical interference with electrical connections. The substrate is planarized to a frame by one or more clamps that are attached to the frame. The clamps provide adjustment of the pressure down on the substrate in a Z-axis direction which is normal to the top surface of the substrate for providing a good connection with a planar card. In addition, the clamps provide adjustment in the an X-Y plane parallel to the frame and rotational correction about the Z-axis.
摘要翻译： 一种固定装置，用于固定在顶表面上具有探针区域的电子基片。 电子基板的顶表面保持打开以提供最大面积以耦合待测器件的互连线。 此外，在一个实施例中，衬底的底表面保持开放以提供与探针卡耦合的最大面积，或者在另一个实施例中提供测试头。 这个开放的底部和开口顶部最小化了电气连接的机械干扰。 衬底通过一个或多个附接到框架的夹具平坦化到框架。 夹具提供了在基板的向下的基板上的调整，Z轴方向垂直于基板的顶表面，以提供与平面卡的良好连接。 另外，夹具在平行于框架的X-Y平面和Z轴的旋转校正中提供调整。
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10.发明授权Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack 有权蒸发压缩换热系统，蒸发器盘管安装在电子机架的出口门上公开(公告)号：US07963118B2
公开(公告)日：2011-06-21
申请号：US11860634
申请日：2007-09-25
CPC分类号： H05K7/20827
摘要： A vapor-compression heat exchange system for facilitating cooling of an electronics rack. The system includes employing an evaporator coil mounted to an outlet door cover, which is hingedly affixed to an air outlet side of the rack, as well as refrigerant inlet and outlet plenums and an expansion valve also mounted to the outlet door cover and in fluid communication with the evaporator coil. The evaporator coil includes at least one heat exchange tube section and a plurality of fins extending therefrom. Respective connect couplings connect the inlet and outlet plenums in fluid communication with a vapor-compression unit which includes a compressor and a condenser disposed separate from the outlet door cover. The vapor-compression unit exhausts heat from refrigerant circulating therethrough.
摘要翻译： 一种用于促进电子机架冷却的蒸汽压缩热交换系统。 该系统包括采用安装在出口门盖上的蒸发器盘管，该出口门盖铰接地固定到机架的空气出口侧，以及制冷剂入口和出口集气室以及还安装到出口门盖并且以流体连通的膨胀阀 与蒸发器盘管。 蒸发器盘管包括至少一个热交换管部分和从其延伸的多个翅片。 各个连接联接器将入口和出口集气室与蒸汽压缩单元流体连通，蒸汽压缩单元包括压缩机和与出口门盖分离设置的冷凝器。 蒸汽压缩单元从循环的制冷剂排出热量。
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