公开(公告)号：US07672590B2

公开(公告)日：2010-03-02

申请号：US11191765

申请日：2005-07-28

申请人： Daniel S. Niedrich ,  David S. Brown ,  Robert S. Minowicz, Jr.

发明人： Daniel S. Niedrich ,  David S. Brown ,  Robert S. Minowicz, Jr.

IPC分类号： H04B10/20

CPC分类号： G06F1/189 ,  G06F1/20 ,  H05K7/1492

摘要： Data processing devices in a data center are more easily relocated by consolidating the data and power connections to the data processing devices within a mobile data cabinet. The mobile data cabinet includes an access switch to consolidate communications and connections among computing devices in the mobile cabinet and to consolidate communications to a central communication service through a main communication cable. A single data communication connection through the main communication cable and a single electrical power connection through a power delivery cable to the mobile cabinet reduces and simplifies number and difficulty of the disconnections and connections that must be made to move the mobile cabinet.

摘要翻译： 通过将数据和电源连接合并到移动数据柜内的数据处理设备，数据中心中的数据处理设备更容易重新定位。 移动数据柜包括接入交换机，用于整合移动柜中的计算设备之间的通信和连接，并且通过主通信电缆将与中央通信服务的通信合并。 通过主通信电缆和通过电力输送电缆到移动机柜的单个电力连接的单个数据通信连接减少并简化了移动机柜必须进行的断开和连接的数量和难度。

公开(公告)号：US5011658A

公开(公告)日：1991-04-30

申请号：US359315

申请日：1989-05-31

申请人： Daniel S. Niedrich

发明人： Daniel S. Niedrich

IPC分类号： B23K35/26 ,  C22C13/00 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/262

摘要： Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

公开(公告)号：US5316788A

公开(公告)日：1994-05-31

申请号：US736380

申请日：1991-07-26

申请人： Eric P. Dibble ,  Steven L. Hanakovic ,  Voya R. Markovich ,  Daniel S. Niedrich ,  Gary P. Vlasak ,  Richard S. Zarr ,  Richard C. Senger

发明人： Eric P. Dibble ,  Steven L. Hanakovic ,  Voya R. Markovich ,  Daniel S. Niedrich ,  Gary P. Vlasak ,  Richard S. Zarr ,  Richard C. Senger

IPC分类号： H01L21/52 ,  B23K1/00 ,  B23K1/08 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/34 ,  B05D1/00

CPC分类号： B23K1/085 ,  B23K1/0016 ,  H01L21/4853 ,  H01L23/49816 ,  H05K3/243 ,  H05K3/3468 ,  B23K2201/36 ,  H01L2924/0002 ,  H05K2201/0305 ,  H05K2203/043 ,  H05K2203/044 ,  H05K2203/054 ,  H05K3/067 ,  H05K3/3452

摘要： Process is described for applying large quantities of solder to small areas, such as the lands in a high density card, to which it is intended to surface mount electronic devices or directly attach circuitized chips. The land area is temporarily extended by depositing a relatively thin layer of metal beyond the perimeter of the land, wave soldering to deposit excess solder on the extended land region, and reflow, whereby the thin layer of metal dissolves into the solder, causing the solder to retract to the dimensions of the original land. Because the volume of solder is increased, the strength and reliability of the solder joint is greatly improved.

摘要翻译： 描述了用于将大量焊料应用于小面积，例如高密度卡片的焊盘，其旨在表面安装电子器件或直接附接电路化芯片。 通过在陆地周边沉积相对较薄的金属层，波峰焊接，将多余的焊料沉积在延伸的焊盘区域上，并回流焊接，由此金属薄层溶解到焊料中，引起焊料的临时扩展。 缩小到原始土地的尺寸。 因为焊料的体积增加，焊点的强度和可靠性大大提高。