摘要:
Error correction is selectively applied to data, such as repair data to be stored in a fusebay for BIST/BISR on an ASIC or other semiconductor device. Duplicate bit correction and error correction code state machines may be included, and selectors, such as multiplexers, may be used to enable one or both types of correction. Each state machine may include an indicator, such as a “sticky bit,” that may be activated when its type of correction is encountered. The indicator(s) may be used to develop quality and yield control criteria during manufacturing test of parts including embodiments of the invention.
摘要:
Error correction is selectively applied to data, such as repair data to be stored in a fusebay for BIST/BISR on an ASIC or other semiconductor device. Duplicate bit correction and error correction code state machines may be included, and selectors, such as multiplexers, may be used to enable one or both types of correction. Each state machine may include an indicator, such as a “sticky bit,” that may be activated when its type of correction is encountered. The indicator(s) may be used to develop quality and yield control criteria during manufacturing test of parts including embodiments of the invention.
摘要:
Fuse macros of identical number of pages are serially arranged to form the same number of fusebay pages each having a length equal to the sum of the respective fuse macro page lengths. Each fuse macro has an enable latch configured to allow activation of one fuse macro at a time. A fusebay control device connected to a repair register may store data in and retrieve data from the fusebay. Next available fuse location is determined in programming mode so that data from a next repair pass may start where the last data ended.
摘要:
An approach for interleaving memory repair data compression and fuse programming operations in a single fusebay architecture is described. In one embodiment, the single fusebay architecture includes a multiple of pages that are used with a partitioning and interleaving approach to handling memory repair data compression and fuse programming operations. In particular, for each page in the single fusebay architecture, a memory repair data compression operation is performed on memory repair data followed by a fuse programming operation performed on the compressed memory repair data.
摘要:
An approach for interleaving memory repair data compression and fuse programming operations in a single fusebay architecture is described. In one embodiment, the single fusebay architecture includes a multiple of pages that are used with a partitioning and interleaving approach to handling memory repair data compression and fuse programming operations. In particular, for each page in the single fusebay architecture, a memory repair data compression operation is performed on memory repair data followed by a fuse programming operation performed on the compressed memory repair data.
摘要:
Fuse macros of identical number of pages are serially arranged to form the same number of fusebay pages each having a length equal to the sum of the respective fuse macro page lengths. Each fuse macro has an enable latch configured to allow activation of one fuse macro at a time. A fusebay control device connected to a repair register may store data in and retrieve data from the fusebay. Next available fuse location is determined in programming mode so that data from a next repair pass may start where the last data ended.
摘要:
In one embodiment, the invention is a method, apparatus, and design structure for built-in self-test for embedded memory in integrated circuit chips. One embodiment of a method for built-in self-test of an embedded memory includes setting up a plurality of test patterns at a speed of a test clock, where the speed of the test clock is slow enough for a tester to directly communicate with a chip in which the memory is embedded, and where the setting up includes loading a plurality of signal states used to communicate the test patterns to one or more components of a built-in self-test system, applying the test patterns to the embedded memory as a microburst at-speed, capturing output data from the embedded memory at-speed, the output data corresponding to only one of test patterns, and comparing the output data to expected data at the speed of the test clock.
摘要:
A method for testing integrated circuits (ICs) by automatically extending addressing for shared array built-in self-test (BIST) circuitry, includes polling a plurality of memories to determine which of the plurality of memories are sharing a first comparison tree and mapping a shared array BIST address space to each of the plurality of memories using the first comparison tree. Additionally, the method includes estimating a shared array BIST completion time corresponding to a most significant bits of a maximum total memory address size under test, reconfiguring the shared array BIST circuitry to accommodate the estimated shared array BIST completion time and testing the plurality of memories sharing the first comparison tree.
摘要:
A method for testing integrated circuits (ICs) by automatically extending addressing for shared array built-in self-test (BIST) circuitry, includes polling a plurality of memories to determine which of the plurality of memories are sharing a first comparison tree and mapping a shared array BIST address space to each of the plurality of memories using the first comparison tree. Additionally, the method includes estimating a shared array BIST completion time corresponding to a most significant bits of a maximum total memory address size under test, reconfiguring the shared array BIST circuitry to accommodate the estimated shared array BIST completion time and testing the plurality of memories sharing the first comparison tree.
摘要:
The status of multiple on-chip power supply systems is indicated for use in modifying chip test flow and diagnosing chip failure. Digital compliance signals are received, each compliance signal associated with one of multiple on-chip power supplies. Each power supply has an associated compliance level, and each compliance signal indicates whether its associated power supply is operating at the associated compliance level. The compliance signals are converted into a power supply status signal indicating status of the compliance signals associated with the power supply. The power supply status signal is output. If a power supply is operating at its associated compliance level, the output power supply status signal indicates that the power supply is passing. If the power supply is not operating at its associated compliance level, the output power supply status signal indicates that the power supply is failing. If a power supply is failing, a memory test may be aborted, simplifying chip failure diagnosis.