Multi-nary group IB and VIA based semiconductor
    2.
    发明授权
    Multi-nary group IB and VIA based semiconductor 有权
    多元组IB和基于VIA的半导体

    公开(公告)号:US08889469B2

    公开(公告)日:2014-11-18

    申请号:US13533761

    申请日:2012-06-26

    摘要: Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    摘要翻译: 提供用于形成多元半导体的方法和装置。 在一个实施例中,提供了一种方法,其包括将前体材料沉积到基底上,其中前体材料可以包含或可以与添加剂一起使用,以使最终半导体层的后部中的IIIA族材料(例如Ga)的浓度最小化 。 添加剂可以是元素或合金形式的非铜IB族添加剂。 一些实施方案可以同时使用硒和硫,形成一个或多个半导体合金。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。

    MULTI-NARY GROUP IB AND VIA BASED SEMICONDUCTOR
    4.
    发明申请
    MULTI-NARY GROUP IB AND VIA BASED SEMICONDUCTOR 有权
    第IBI组和第二代半导体

    公开(公告)号:US20120313200A1

    公开(公告)日:2012-12-13

    申请号:US13533761

    申请日:2012-06-26

    IPC分类号: H01L31/032 H01L31/18

    摘要: Methods and devices are provided for forming multi-nary semiconductor. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form. Some embodiments may use both selenium and sulfur, forming a senary or higher semiconductor alloy. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    摘要翻译: 提供用于形成多元半导体的方法和装置。 在一个实施例中,提供了一种方法,其包括将前体材料沉积到基底上,其中前体材料可以包含或可以与添加剂一起使用,以使最终半导体层的后部中的IIIA族材料(例如Ga)的浓度最小化 。 添加剂可以是元素或合金形式的非铜IB族添加剂。 一些实施方案可以同时使用硒和硫,形成一个或多个半导体合金。 要强调的是,该摘要被提供以符合要求抽象的规则,允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是,它不会用于解释或限制权利要求的范围或含义。

    LOW COST SOLAR CELLS FORMED USING A CHALCOGENIZATION RATE MODIFIER
    5.
    发明申请
    LOW COST SOLAR CELLS FORMED USING A CHALCOGENIZATION RATE MODIFIER 审中-公开
    低成本太阳能电池使用一个合并率改进器

    公开(公告)号:US20110294254A1

    公开(公告)日:2011-12-01

    申请号:US12980276

    申请日:2010-12-28

    IPC分类号: H01L31/0264

    摘要: Methods and devices are provided for forming an absorber layer. In one embodiment, a method is provided comprising of depositing a precursor material onto a substrate, wherein the precursor material may include or may be used with an additive to minimize concentration of group IIIA material such as Ga in the back portion of the final semiconductor layer. The additive may be a non-copper Group IB additive in elemental or alloy form.

    摘要翻译: 提供了用于形成吸收层的方法和装置。 在一个实施例中,提供了一种方法,其包括将前体材料沉积到基底上,其中前体材料可以包含或可以与添加剂一起使用,以使最终半导体层的后部中的IIIA族材料(例如Ga)的浓度最小化 。 添加剂可以是元素或合金形式的非铜IB族添加剂。

    Structures for Solar Roofing
    6.
    发明申请
    Structures for Solar Roofing 审中-公开
    太阳能屋顶结构

    公开(公告)号:US20130180575A1

    公开(公告)日:2013-07-18

    申请号:US13555033

    申请日:2012-07-20

    IPC分类号: H01L31/048 H01L31/05

    摘要: A roofing element includes a solar cell array positioned in an opening in a top surface of a roofing material. The solar cell array has a plurality of low series resistance, solar cells, where the low series resistance is based on a metallization-wrap-through solar cell architecture. Each solar cell has a cell aspect ratio, and the solar cells are electrically connected in an electrical string configuration by a low resistance cell-to-cell bonding method. The opening of the roofing material has an aperture area, and the amount of aperture area covered by the solar cell array defines an aperture fill. The cell aspect ratio and the electrical string configuration are tailored to achieve a specified total current and total voltage for the solar cell array while optimizing the aperture fill.

    摘要翻译: 屋顶元件包括位于屋顶材料的顶表面中的开口中的太阳能电池阵列。 太阳能电池阵列具有多个低串联电阻的太阳能电池,其中低串联电阻基于金属化包裹太阳能电池架构。 每个太阳能电池具有电池长宽比,并且太阳能电池通过低电阻电池到电池接合方法以电串配置电连接。 屋顶材料的开口具有开口面积,并且由太阳能电池阵列覆盖的开口面积的数量限定孔径填充物。 电池长宽比和电线串配置被定制以在优化孔径填充的同时实现太阳能电池阵列的规定的总电流和总电压。