Silicon Based Quantum Dot Structure And Quantum Dot Arrays Incorporating Blind Contacts

    公开(公告)号:US20240113240A1

    公开(公告)日:2024-04-04

    申请号:US18374687

    申请日:2023-09-29

    CPC classification number: H01L31/035218 G06N10/40 H01L29/66439 H01L29/66977

    Abstract: A novel and useful mechanism of improving the controllability of the electrostatic potential profile and electric field between barrier/control gates separating quantum dots (QD) in a quantum dot array (QDA) and creating elongated double quantum dot array 2D structures each having capability for a continuous tunneling within the array structure. Plunger gates implemented as blind contacts improve electric field control between barrier gates in a quantum dot array. Blind contacts create a dedicated control potential under multiple blind contact electrodes placed on a metal layer of a standard FDSOI process. They function to control potential well depths independently for neighboring quantum dots. Two or more coupled quantum dots within one elongated active area enables interconnection of neighboring quantum dot chains using a conductive semiconductor well. The blind contacts enable the implementation of charge sensors, precise precharge transistors, and linear and 2D quantum dot array.

    Quantum dot digital radiographic detection system

    公开(公告)号:US11869918B2

    公开(公告)日:2024-01-09

    申请号:US18082499

    申请日:2022-12-15

    Inventor: Leigh E. Colby

    Abstract: A digital quantum dot radiographic detection system described herein includes: a scintillation subsystem 202 and a semiconductor light detection subsystem 200, 200′ (including a plurality of quantum dot image sensors 200a, 200b). In a first preferred digital quantum dot radiographic detection system, the plurality of quantum dot image sensors 200 is in substantially direct contact with the scintillation subsystem 202. In a second preferred digital quantum dot radiographic detection system, the scintillation subsystem has a plurality of discrete scintillation packets 212a, 212b, at least one of the discrete scintillation packets communicating with at least one of the quantum dot image sensors. The quantum dot image sensors 200 may be associated with semiconductor substrate 210 made from materials such as silicon (and variations thereof) or graphene. An optically opaque layer 220 is preferably positioned between the discrete scintillation packets, 212a, 212b.

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