摘要:
The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image. The standard difference image is correlated to the registered difference test image (DTR) to generate a registration offset indicative of placement efficacy.
摘要:
Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.
摘要:
Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.
摘要:
Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.
摘要:
Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include measuring the travel of a pick and place machine placement nozzle and the motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured. To properly adjust these parameters, a method of measuring the workpiece motion and nozzle travel is provided.
摘要:
A fastener to permit the capture and release by a selected medium of the wire binder on notebooks, tablets, or the like. The fastener includes a series of tabs which are profiled so that the captured medium resists removal due to ordinary stresses, but may be inserted and removed by means of an easily applied transverse force.