公开(公告)号：US20110067751A1

公开(公告)日：2011-03-24

申请号：US12905921

申请日：2010-10-15

申请人： David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy ,  John Telle ,  Andrew Mark Mitchell

发明人： David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy ,  John Telle ,  Andrew Mark Mitchell

IPC分类号： H01L31/048

CPC分类号： H01L31/0201 ,  H01L31/02013 ,  H01L31/048 ,  H01L31/049 ,  H01L31/0516 ,  H02S40/34 ,  Y02E10/50

摘要： Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

摘要翻译： 包括使用整体模块组装技术制造的背接触式太阳能电池的光伏模块，该技术包括包含背板和图案化金属化的柔性电路。 模块可以包括与图案化的金属化物电接触以提取电流的母线。 该模块可以替代地包括多层金属化。 包含岛或点的层间电介质减轻了由于热失配引起的应力。 使用多个电缆板可实现灵活的电路布局，从而优化模块。 模块优选地包括热塑性密封剂和/或混合粘合剂/焊料材料。 超薄防潮屏障可实现卷对卷加工。

公开(公告)号：US20120167986A1

公开(公告)日：2012-07-05

申请号：US13419250

申请日：2012-03-13

申请人： David H. MEAKIN ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy ,  John Telle ,  Andrew Mark Mitchell

发明人： David H. MEAKIN ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy ,  John Telle ,  Andrew Mark Mitchell

IPC分类号： H01L31/05

CPC分类号： H01L31/0201 ,  H01L31/02013 ,  H01L31/048 ,  H01L31/049 ,  H01L31/0516 ,  H02S40/34 ,  Y02E10/50

摘要： Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

摘要翻译： 包括使用整体模块组装技术制造的背接触式太阳能电池的光伏模块，该技术包括包含背板和图案化金属化的柔性电路。 模块可以包括与图案化的金属化物电接触以提取电流的母线。 该模块可以替代地包括多层金属化。 包含岛或点的层间电介质减轻了由于热失配引起的应力。 使用多个电缆板可实现灵活的电路布局，从而优化模块。 模块优选地包括热塑性密封剂和/或混合粘合剂/焊料材料。 超薄防潮屏障可实现卷对卷加工。

公开(公告)号：US20100012172A1

公开(公告)日：2010-01-21

申请号：US12432706

申请日：2009-04-29

申请人： David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy ,  John Telle ,  Andrew Mark Mitchell

发明人： David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy ,  John Telle ,  Andrew Mark Mitchell

IPC分类号： H01L31/048 ,  H01L31/042

CPC分类号： H01L31/0201 ,  H01L31/02013 ,  H01L31/048 ,  H01L31/049 ,  H01L31/0516 ,  H02S40/34 ,  Y02E10/50

摘要： Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

摘要翻译： 包括使用整体模块组装技术制造的背接触式太阳能电池的光伏模块，该技术包括包含背板和图案化金属化的柔性电路。 模块可以包括与图案化的金属化物电接触以提取电流的母线。 该模块可以替代地包括多层金属化。 包含岛或点的层间电介质减轻了由于热失配引起的应力。 使用多个电缆板可实现灵活的电路布局，从而优化模块。 模块优选地包括热塑性密封剂和/或混合粘合剂/焊料材料。 超薄防潮屏障可实现卷对卷加工。

公开(公告)号：US20080216887A1

公开(公告)日：2008-09-11

申请号：US11963841

申请日：2007-12-23

申请人： Peter Hacke ,  David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy

发明人： Peter Hacke ,  David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy

IPC分类号： H01L31/05 ,  H01L31/18

CPC分类号： H01L31/022441 ,  H01L31/0516 ,  Y02E10/50 ,  Y10T29/49171

摘要： Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

摘要翻译： 用于互连背接触太阳能电池的方法和系统。 太阳能电池优选地具有减小的面积母线，或者完全无母线，并且电流从电池表面内部的各种点提取。 互连优选地减轻由于焊料回流和其它热效应引起的应力。 互连可以被冲压并且包括结合到太阳能电池上的焊盘的外部或内部结构。 这些结构被设计成使互连和太阳能电池之间的热应力最小化。 互连可以可选地包括多孔金属，例如金属丝网，金属丝布或多孔金属，或波纹状或指形条。 互连优选地通过绝缘体与太阳能电池电隔离，所述绝缘体沉积在电池上，作为离散层放置在电池上，或者直接层压到互连的期望区域。

公开(公告)号：US20120204938A1

公开(公告)日：2012-08-16

申请号：US13419264

申请日：2012-03-13

申请人： Peter HACKE ,  David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy

发明人： Peter HACKE ,  David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy

IPC分类号： H01L31/052 ,  H01L31/048 ,  H01L31/0203 ,  H01L31/0224 ,  H01L31/05

CPC分类号： H01L31/022441 ,  H01L31/0516 ,  Y02E10/50 ,  Y10T29/49171

摘要： Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

摘要翻译： 用于互连背接触太阳能电池的方法和系统。 太阳能电池优选地具有减小的面积母线，或者完全是无母线的，并且电流从电池表面内部的各种点提取。 互连优选地减轻由于焊料回流和其它热效应引起的应力。 互连可以被冲压并且包括结合到太阳能电池上的焊盘的外部或内部结构。 这些结构被设计成使互连和太阳能电池之间的热应力最小化。 互连可以可选地包括多孔金属，例如金属丝网，金属丝布或多孔金属，或波纹状或指形条。 互连优选地通过绝缘体与太阳能电池电隔离，所述绝缘体沉积在电池上，作为离散层放置在电池上，或者直接层压到互连的期望区域。

公开(公告)号：US20110126878A1

公开(公告)日：2011-06-02

申请号：US12952018

申请日：2010-11-22

申请人： Peter Hacke ,  David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy

发明人： Peter Hacke ,  David H. Meakin ,  James M. Gee ,  Sysavanh Southimath ,  Brian Murphy

IPC分类号： H01L31/05

CPC分类号： H01L31/022441 ,  H01L31/0516 ,  Y02E10/50 ,  Y10T29/49171

摘要： Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

摘要翻译： 用于互连背接触太阳能电池的方法和系统。 太阳能电池优选地具有减小的面积母线，或者完全无母线，并且电流从电池表面内部的各种点提取。 互连优选地减轻由于焊料回流和其它热效应引起的应力。 互连可以被冲压并且包括结合到太阳能电池上的焊盘的外部或内部结构。 这些结构被设计成使互连和太阳能电池之间的热应力最小化。 互连可以可选地包括多孔金属，例如金属丝网，金属丝布或多孔金属，或波纹状或指形条。 互连优选地通过绝缘体与太阳能电池电隔离，所述绝缘体沉积在电池上，作为离散层放置在电池上，或者直接层压到互连的期望区域。

公开(公告)号：US20100024881A1

公开(公告)日：2010-02-04

申请号：US12563040

申请日：2009-09-18

申请人： Peter Hacke ,  David H. Meakin ,  James M. Gee ,  Brian Murphy

发明人： Peter Hacke ,  David H. Meakin ,  James M. Gee ,  Brian Murphy

IPC分类号： H01L31/00

CPC分类号： H01L31/022441 ,  H01L31/0516 ,  Y02E10/50 ,  Y10T29/49171

摘要： Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

摘要翻译： 用于互连背接触太阳能电池的方法和系统。 太阳能电池优选地具有减小的面积母线，或者完全是无母线的，并且电流从电池表面内部的各种点提取。 互连优选地减轻由于焊料回流和其它热效应引起的应力。 互连可以被冲压并且包括结合到太阳能电池上的焊盘的外部或内部结构。 这些结构被设计成使互连和太阳能电池之间的热应力最小化。 互连可以可选地包括多孔金属，例如金属丝网，金属丝布或多孔金属，或波纹状或指形条。 互连优选地通过绝缘体与太阳能电池电隔离，所述绝缘体沉积在电池上，作为离散层放置在电池上，或者直接层压到互连的期望区域。

公开(公告)号：US08829532B2

公开(公告)日：2014-09-09

申请号：US11702011

申请日：2007-02-02

申请人： Brian Murphy ,  Maik Häberlen ,  Jörg Lindner ,  Bernd Stritzker

发明人： Brian Murphy ,  Maik Häberlen ,  Jörg Lindner ,  Bernd Stritzker

IPC分类号： H01L29/15 ,  H01L31/0312 ,  H01L21/265 ,  H01L21/02

CPC分类号： H01L21/02694 ,  H01L21/02381 ,  H01L21/02447 ,  H01L21/02532 ,  H01L21/02538 ,  H01L21/02551 ,  H01L21/02658 ,  H01L21/26506

摘要： Semiconductor layer structure and a method for producing a structure are provided, including a substrate made of semiconductor material, on which a layer made of a second semiconductor material is situated, furthermore a region (3) enriched with impurity atoms, which region is situated either in layer (2) or at a specific depth below the interface between layer (2) and substrate (1), additionally a layer (4) within the region (3) enriched with impurity atoms, which layer comprises cavities produced by ion implantation, furthermore at least one epitaxial layer (6) applied to layer (2) and also a defect region (5) comprising dislocations and stacking faults within the layer (4) comprising cavities, the at least one epitaxial layer (6) being largely crack-free, and a residual strain of the at least one epitaxial layer (6) being less than or equal to 1 GPa.

摘要翻译： 提供半导体层结构和制造结构的方法，包括由半导体材料制成的基板，在其上设置由第二半导体材料制成的层，此外还包括富含杂质原子的区域（3），该区域位于 在层（2）中或在层（2）和衬底（1）之间的界面下方的特定深度处，另外在区域（3）内富含杂质原子的层（4），该层包括通过离子注入产生的空穴， 此外，施加到层（2）的至少一个外延层（6）还包括在包括空腔的层（4）内的位错和层叠缺陷的缺陷区域（5），所述至少一个外延层（6） 所述至少一个外延层（6）的残余应变小于或等于1GPa。

公开(公告)号：US20130340770A1

公开(公告)日：2013-12-26

申请号：US13530279

申请日：2012-06-22

申请人： Karen P. Starr ,  Alexander Flamm ,  Brian Murphy ,  Erik Askin

发明人： Karen P. Starr ,  Alexander Flamm ,  Brian Murphy ,  Erik Askin

IPC分类号： A61F5/37

CPC分类号： A61F5/37 ,  A45F3/04 ,  A47D13/02 ,  A47D15/008 ,  A61F5/3776 ,  A61G1/01 ,  A61G7/1023 ,  A61G7/1038 ,  A61G2200/14 ,  A61G2200/32 ,  A61M25/02

摘要： A patient transfer device is utilized to transport infant patients between locations within a hospital environment. The patient transfer device includes a center, support section and a pair of side sections that can be moved into contact with each other to surround the infant patient. The first and second side sections each include a handle that can be brought into close proximity to each other and can be grasped by a single hand of a clinician. The patient transfer device includes a stiffening device that is positioned within the center section to provide support for the infant patient during transport. A hold down device is included on one or both of the first and second side sections to securely hold tubes and wires connected to the infant patient during transport of the infant patient.

公开(公告)号：US08492243B2

公开(公告)日：2013-07-23

申请号：US12863506

申请日：2009-01-21

申请人： Maik Haeberlen ,  Brian Murphy

发明人： Maik Haeberlen ,  Brian Murphy

IPC分类号： H01L21/30

CPC分类号： H01L21/26506 ,  H01L21/02378 ,  H01L21/0254 ,  H01L21/0445 ,  H01L33/0079 ,  H01L33/46

摘要： Semiconductor structures are produced by providing a 3C—SiC semiconductor layer containing a monocrystalline 3C—SiC layer by implantation of carbon in silicon on a first silicon substrate and applying an epitaxial layer of nitride compound semiconductor suitable for the generation of optoelectronic components onto the 3C—SiC semiconductor layer structure, wherein the epitaxial layer of nitride semiconductor is transferred onto a second substrate by bonding the nitride layer onto the second substrate surface and mechanically or chemically removing silicon and layers containing SiC, the second substrate being a metal with a reflectivity ≧80% or being substantially transparent.

摘要翻译： 通过在第一硅衬底上通过在硅中注入碳来提供包含单晶3C-SiC层的3C-SiC半导体层来制造半导体结构，并将适于产生光电子部件的氮化物半导体外延层施加到3C- SiC半导体层结构，其中氮化物半导体的外延层通过将氮化物层粘合到第二衬底表面上并机械地或化学地去除硅和含有SiC的层而转移到第二衬底上，第二衬底是具有反射率> 80％或基本透明。