摘要:
Methods of fabricating emitter regions of solar cells are described. Methods of forming layers on substrates of solar cells, and the resulting solar cells, are also described.
摘要:
A method of fabricating a solar cell is disclosed. The method includes forming a polished surface on a silicon substrate and forming a first flowable matrix in an interdigitated pattern on the polished surface, where the polished surface allows the first flowable matrix to form an interdigitated pattern comprising features of uniform thickness and width. In an embodiment, the method includes forming the silicon substrate using a method such as, but not limited to, of diamond wire or slurry wafering processes. In another embodiment, the method includes forming the polished surface on the silicon substrate using a chemical etchant such as, but not limited to, sulfuric acid (H2SO4), acetic acid (CH3COOH), nitric acid (HNO3), hydrofluoric acid (HF) or phosphoric acid (H3PO4). In still another embodiment, the etchant is an isotropic etchant. In yet another embodiment, the method includes providing a surface of the silicon substrate with at most 500 nanometer peak-to-valley roughness.
摘要翻译:公开了一种制造太阳能电池的方法。 该方法包括在硅衬底上形成抛光表面,并在研磨表面上形成交错图案中的第一可流动基质,其中抛光表面允许第一可流动基质形成包括均匀厚度和宽度特征的叉指图案。 在一个实施例中,该方法包括使用诸如但不限于金刚石线或浆料晶片化方法的方法来形成硅衬底。 在另一个实施方案中,该方法包括使用化学蚀刻剂(例如但不限于硫酸(H 2 SO 4)),乙酸(CH 3 COOH),硝酸(HNO 3),氢氟酸(HF))在硅衬底上形成抛光表面, 或磷酸(H 3 PO 4)。 在另一个实施方案中,蚀刻剂是各向同性蚀刻剂。 在另一个实施例中,该方法包括提供硅衬底的表面至多500纳米的峰 - 谷粗糙度。
摘要:
Methods of passivating light-receiving surfaces of solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a silicon substrate having a light-receiving surface. An intrinsic silicon layer is disposed above the light-receiving surface of the silicon substrate. An N-type silicon layer is disposed on the intrinsic silicon layer. A non-conductive anti-reflective coating (ARC) layer is disposed on the N-type silicon layer. In another example, a solar cell includes a silicon substrate having a light-receiving surface. A tunneling dielectric layer is disposed on the light-receiving surface of the silicon substrate. An N-type silicon layer is disposed on the tunneling dielectric layer. A non-conductive anti-reflective coating (ARC) layer is disposed on the N-type silicon layer.
摘要:
A method of fabricating a solar cell is disclosed. The method includes forming a polished surface on a silicon substrate and forming a first flowable matrix in an interdigitated pattern on the polished surface, where the polished surface allows the first flowable matrix to form an interdigitated pattern comprising features of uniform thickness and width. In an embodiment, the method includes forming the silicon substrate using a method such as, but not limited to, of diamond wire or slurry wafering processes. In another embodiment, the method includes forming the polished surface on the silicon substrate using a chemical etchant such as, but not limited to, sulfuric acid (H2SO4), acetic acid (CH3COOH), nitric acid (HNO3), hydrofluoric acid (HF) or phosphoric acid (H3PO4). In still another embodiment, the etchant is an isotropic etchant. In yet another embodiment, the method includes providing a surface of the silicon substrate with at most 500 nanometer peak-to-valley roughness.
摘要翻译:公开了一种制造太阳能电池的方法。 该方法包括在硅衬底上形成抛光表面,并在研磨表面上形成交错图案中的第一可流动基质,其中抛光表面允许第一可流动基质形成包括均匀厚度和宽度特征的叉指图案。 在一个实施例中,该方法包括使用诸如但不限于金刚石线或浆料晶片化方法的方法来形成硅衬底。 在另一个实施方案中,该方法包括使用化学蚀刻剂(例如但不限于硫酸(H 2 SO 4)),乙酸(CH 3 COOH),硝酸(HNO 3),氢氟酸(HF))在硅衬底上形成抛光表面, 或磷酸(H 3 PO 4)。 在另一个实施方案中,蚀刻剂是各向同性蚀刻剂。 在另一个实施例中,该方法包括提供硅衬底的表面至多500纳米的峰 - 谷粗糙度。