-
公开(公告)号：US20230007148A1
公开(公告)日：2023-01-05
申请号：US17930048
申请日：2022-09-06
摘要： The disclosure extends to devices, systems and methods for connecting one or more sensors to one or more printed circuit boards (PCB) in the distal end or tip of a scope. The disclosure also extends to a connector assembly for an image sensor for protecting the sensor and conveying information from the sensor to the PCB.
-
公开(公告)号：US11432715B2
公开(公告)日：2022-09-06
申请号：US17088502
申请日：2020-11-03
发明人： Laurent Blanquart
IPC分类号： H01L27/146 , A61B1/05 , H04N5/369 , A61B1/00 , H04N5/374 , H04N5/3745 , H04N5/378 , H01L23/00 , A61B1/06 , H04N5/225 , H01L25/065 , H01L27/12 , H01L31/028 , H01L31/0296 , H01L31/0304
摘要： Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.
-
公开(公告)号：US20220031154A1
公开(公告)日：2022-02-03
申请号：US17505419
申请日：2021-10-19
发明人： Laurent Blanquart
IPC分类号： A61B1/05 , H01L27/146 , H04N5/369 , A61B1/00 , H04N5/374 , H04N5/3745 , H04N5/378 , H01L23/00 , A61B1/06 , H04N5/225 , H01L25/065 , H01L27/12
摘要： Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.
-
公开(公告)号：US20210160444A1
公开(公告)日：2021-05-27
申请号：US17088504
申请日：2020-11-03
发明人： Laurent Blanquart
摘要： The disclosure extends to methods, systems, and computer program products for producing an image in light deficient environments and correction of white balance and/or fixed pattern noise at startup or at any other time during a procedure.
-
公开(公告)号：US10980406B2
公开(公告)日：2021-04-20
申请号：US16730737
申请日：2019-12-30
摘要： The disclosure extends to systems and methods for reducing the area of an image sensor by reducing the imaging sensor pad count used for data transmission and clock generation.
-
公开(公告)号：US20210085159A1
公开(公告)日：2021-03-25
申请号：US17111286
申请日：2020-12-03
发明人： Laurent Blanquart
摘要： The disclosure extends to systems and methods for reducing the area of an image sensor by employing bi-directional pads used for both image data issuance and configuration command reception and internal supply voltage generation, for reducing the number of conductors in an endoscope system.
-
公开(公告)号：US10709319B2
公开(公告)日：2020-07-14
申请号：US15489588
申请日：2017-04-17
发明人： Laurent Blanquart
IPC分类号： H01L27/146 , A61B1/05 , H04N5/369 , A61B1/00 , H04N5/374 , H04N5/3745 , H04N5/378 , H01L23/00 , A61B1/06 , H04N5/225 , H01L25/065 , H01L27/12 , H01L31/028 , H01L31/0296 , H01L31/0304
摘要： Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.
-
公开(公告)号：US10701254B2
公开(公告)日：2020-06-30
申请号：US16127015
申请日：2018-09-10
发明人： Laurent Blanquart , John Richardson
IPC分类号： H04N5/225 , A61B1/00 , A61B1/05 , H04N7/18 , A61B1/313 , A61B1/317 , H04N5/235 , H04N5/374 , H04N5/378
摘要： The disclosure extends to methods, systems, and computer program products for digitally imaging with area limited image sensors, such as within a lumen of an endoscope.
-
公开(公告)号：US20200146542A1
公开(公告)日：2020-05-14
申请号：US16747116
申请日：2020-01-20
发明人： Laurent Blanquart
IPC分类号： A61B1/05 , H01L27/146 , H01L27/12 , H01L25/065 , H04N5/3745 , H04N5/225 , A61B1/06 , H01L23/00 , H04N5/378 , H04N5/374 , A61B1/00 , H04N5/369
摘要： Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.
-
公开(公告)号：US20190356867A1
公开(公告)日：2019-11-21
申请号：US16509297
申请日：2019-07-11
摘要： The disclosure extends to endoscopic devices and systems for image correction of a rotating sensor. The disclosure allows for the distal image sensor to rotate as the user rotates the lumen with respect to a fixed handpiece. The system includes an angle sensor located at the junction of the rotating lumen and the fixed handpiece. Periodic measurements of angle are used in the system's image processing chain in order to effect suitable software image rotations, thereby providing a final displayed image or video stream with the desired orientation.
-
-
-
-
-
-
-
-
-
搜索结果
123 条记录 (耗时 0.033 秒)
