公开(公告)号：US20110083318A1

公开(公告)日：2011-04-14

申请号：US12967717

申请日：2010-12-14

申请人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

发明人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

IPC分类号： B23P11/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568 ,  Y10T29/49002

摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.

摘要翻译： 一种电极组件和使外环围绕用于半导体衬底处理的等离子体反应室中的电极组件对中的方法。 该方法包括将外环围绕电极组件的背衬构件的外表面定位，并且在外环和背衬构件之间插入至少一个定心元件。 定心元件可以是容纳在背衬构件的外表面上的空腔中的多个弹簧加载的定心元件，定心元件具有适于接触外圈的第一端和适于容纳弹簧的第二端。 外环围绕背衬构件的外表面，使得多个弹簧加载的定心元件位于背衬构件的外表面和外环的内表面之间。

公开(公告)号：US07875824B2

公开(公告)日：2011-01-25

申请号：US11701507

申请日：2007-02-02

申请人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

发明人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

IPC分类号： B23K10/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568 ,  Y10T29/49002

摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.

摘要翻译： 一种电极组件和使外环围绕用于半导体衬底处理的等离子体反应室中的电极组件对中的方法。 该方法包括将外环围绕电极组件的背衬构件的外表面定位，并且在外环和背衬构件之间插入至少一个定心元件。 定心元件可以是容纳在背衬构件的外表面上的空腔中的多个弹簧加载的定心元件，定心元件具有适于接触外圈的第一端和适于容纳弹簧的第二端。 外环围绕背衬构件的外表面，使得多个弹簧加载的定心元件位于背衬构件的外表面和外环的内表面之间。

公开(公告)号：US20080099120A1

公开(公告)日：2008-05-01

申请号：US11701507

申请日：2007-02-02

申请人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

发明人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

IPC分类号： B31B1/60

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568 ,  Y10T29/49002

摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.

摘要翻译： 一种电极组件和使外环围绕用于半导体衬底处理的等离子体反应室中的电极组件对中的方法。 该方法包括将外环围绕电极组件的背衬构件的外表面定位，并且在外环和背衬构件之间插入至少一个定心元件。 定心元件可以是容纳在背衬构件的外表面上的空腔中的多个弹簧加载的定心元件，定心元件具有适于接触外圈的第一端和适于容纳弹簧的第二端。 外环围绕背衬构件的外表面，使得多个弹簧加载的定心元件位于背衬构件的外表面和外环的内表面之间。

公开(公告)号：US08084705B2

公开(公告)日：2011-12-27

申请号：US12967717

申请日：2010-12-14

申请人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

发明人： Dean J. Larson ,  Daniel Brown ,  Keith Comendant ,  Victor Wang

IPC分类号： B23K10/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568 ,  Y10T29/49002

摘要： An electrode assembly and method of centering an outer ring around an electrode assembly in a plasma reaction chamber used in semiconductor substrate processing. The method includes positioning the outer ring around an outer surface of a backing member of the electrode assembly, and inserting at least one centering element between the outer ring and the backing member. The centering element can be a plurality of spring-loaded centering elements received in a cavity on the outer surface of the backing member, the centering elements having a first end adapted to contact the outer ring and a second end adapted to receive a spring. The outer ring surrounds an outer surface of the backing member, such that the plurality of spring-loaded centering elements are positioned between the outer surface of the backing member and an inner surface of the outer ring.

公开(公告)号：US20100304571A1

公开(公告)日：2010-12-02

申请号：US12746810

申请日：2008-12-18

申请人： Dean J. Larson ,  Tom Stevenson ,  Victor Wang

发明人： Dean J. Larson ,  Tom Stevenson ,  Victor Wang

IPC分类号： H01L21/3065 ,  H01L21/306 ,  C23F1/08 ,  B05C13/00 ,  C23C14/34 ,  C23C16/00 ,  B32B37/02 ,  B32B38/04 ,  B32B38/10

CPC分类号： H01L21/67069 ,  B32B37/12 ,  H01L21/67103 ,  H01L21/68757 ,  Y10T156/10 ,  Y10T156/1062 ,  Y10T428/31504

摘要： A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of ≧800% at a temperature range between room temperature and 300° C. such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

摘要翻译： 提供了一种用于减少诸如等离子体处理装置的半导体真空室中的颗粒污染的粘合组件，包括在部件的配合表面和支撑构件之间的弹性片粘合剂粘合以适应热应力。 弹性体片材包括硅氧烷粘合剂，以在室温和300℃之间的温度范围内承受≥800％的高剪切应变，例如具有任选填料的可热固化的高分子量二甲基硅氧烷。 片材形式具有用于粘结表面平行度的粘结厚度控制。 片状粘合剂可以被切割成预成型形状以符合规则或不规则形状的特征，使与配合部件的表面接触面积最大化，并且可以安装到空腔中。 安装可以手动，手动安装工具或自动化机械。 具有不同物理性质的片状粘合剂的复合层可以层压或共面。

公开(公告)号：US08449786B2

公开(公告)日：2013-05-28

申请号：US12746810

申请日：2008-12-18

申请人： Dean J. Larson ,  Tom Stevenson ,  Victor Wang

发明人： Dean J. Larson ,  Tom Stevenson ,  Victor Wang

IPC分类号： B44C1/22 ,  C23F1/00

CPC分类号： H01L21/67069 ,  B32B37/12 ,  H01L21/67103 ,  H01L21/68757 ,  Y10T156/10 ,  Y10T156/1062 ,  Y10T428/31504

摘要： A bonded assembly to reduce particle contamination in a semiconductor vacuum chamber such as a plasma processing apparatus is provided, including an elastomeric sheet adhesive bond between mating surfaces of a component and a support member to accommodate thermal stresses. The elastomeric sheet comprises a silicone adhesive to withstand a high shear strain of ≧800% at a temperature range between room temperature and 300° C. such as heat curable high molecular weight dimethyl silicone with optional fillers. The sheet form has bond thickness control for parallelism of bonded surfaces. The sheet adhesive may be cut into pre-form shapes to conform to regularly or irregularly shaped features, maximize surface contact area with mating parts, and can be installed into cavities. Installation can be manually, manually with installation tooling, or with automated machinery. Composite layers of sheet adhesive having different physical properties can be laminated or coplanar.

摘要翻译： 提供了一种用于减少诸如等离子体处理装置的半导体真空室中的颗粒污染的粘合组件，包括在部件的配合表面和支撑构件之间的弹性片粘合剂粘合以适应热应力。 弹性体片材包含硅氧烷粘合剂，以在室温至300℃的温度范围内承受≥800％的高剪切应变，例如具有任选填料的可热固化的高分子量二甲基硅氧烷。 片材形式具有用于粘结表面平行度的粘结厚度控制。 片状粘合剂可以被切割成预成型形状以符合规则或不规则形状的特征，使与配合部件的表面接触面积最大化，并且可以安装到空腔中。 安装可以手动，手动安装工具或自动化机械。 具有不同物理性质的片状粘合剂的复合层可以层压或共面。

公开(公告)号：US07939778B2

公开(公告)日：2011-05-10

申请号：US12357989

申请日：2009-01-22

申请人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

发明人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

IPC分类号： B23K10/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568

摘要： A plasma processing chamber, which includes an upper electrode assembly, a lower electrode assembly, and a plasma confinement assembly. The upper electrode assembly includes an upper electrode, a backing member, the backing member attachable to an upper surface of the upper electrode, and a guard ring surrounding an outer surface of the backing member and located above the upper surface of the upper electrode, wherein the guard ring is configured to provide an inner gap between the outer surface of the backing member and an inner periphery of the guard ring. The lower electrode assembly is adapted to receive a semiconductor substrate. The plasma confinement assembly is separated from an outer periphery of the upper electrode and the backing member by the guard ring.

摘要翻译： 一种等离子体处理室，其包括上电极组件，下电极组件和等离子体限制组件。 上部电极组件包括上部电极，背衬构件，可附着到上部电极的上表面的背衬构件和围绕背衬构件的外表面并位于上部电极的上表面上的保护环，其中 保护环被构造成在背衬构件的外表面和保护环的内周之间提供内部间隙。 下电极组件适于接收半导体衬底。 等离子体限制组件通过防护环与上电极和背衬构件的外周分离。

公开(公告)号：US20090127234A1

公开(公告)日：2009-05-21

申请号：US12357989

申请日：2009-01-22

申请人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

发明人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

IPC分类号： H01L21/3065 ,  B23K10/00 ,  C23F1/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568

摘要： A plasma processing chamber, which includes an upper electrode assembly, a lower electrode assembly, and a plasma confinement assembly. The upper electrode assembly includes an upper electrode, a backing member, the backing member attachable to an upper surface of the upper electrode, and a guard ring surrounding an outer surface of the backing member and located above the upper surface of the upper electrode, wherein the guard ring is configured to provide an inner gap between the outer surface of the backing member and an inner periphery of the guard ring. The lower electrode assembly is adapted to receive a semiconductor substrate. The plasma confinement assembly is separated from an outer periphery of the upper electrode and the backing member by the guard ring.

摘要翻译： 一种等离子体处理室，其包括上电极组件，下电极组件和等离子体限制组件。 上部电极组件包括上部电极，背衬构件，可附着到上部电极的上表面的背衬构件和围绕背衬构件的外表面并位于上部电极的上表面上的保护环，其中 保护环被构造成在背衬构件的外表面和保护环的内周之间提供内部间隙。 下电极组件适于接收半导体衬底。 等离子体限制组件通过防护环与上电极和背衬构件的外周分离。

公开(公告)号：US07482550B2

公开(公告)日：2009-01-27

申请号：US11701430

申请日：2007-02-02

申请人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

发明人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

IPC分类号： B23K10/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568

摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper electrode, a backing member attachable to an upper surface of the upper electrode, and an outer ring. The outer ring surrounds an outer surface of the backing member and is located above the upper surface of the upper electrode.

摘要翻译： 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上电极，可附接到上电极的上表面的背衬构件和外环。 外环围绕背衬构件的外表面并且位于上电极的上表面上方。

公开(公告)号：US20080099448A1

公开(公告)日：2008-05-01

申请号：US11701430

申请日：2007-02-02

申请人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

发明人： Dean J. Larson ,  Daniel Brown ,  Saurabh J. Ullal

IPC分类号： B23K9/00

CPC分类号： H01J37/3255 ,  H01J37/32009 ,  H01J37/32568

摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper electrode, a backing member attachable to an upper surface of the upper electrode, and an outer ring. The outer ring surrounds an outer surface of the backing member and is located above the upper surface of the upper electrode.

摘要翻译： 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上电极，可附接到上电极的上表面的背衬构件和外环。 外环围绕背衬构件的外表面并且位于上电极的上表面上方。