公开(公告)号：US20070235744A1

公开(公告)日：2007-10-11

申请号：US11390772

申请日：2006-03-28

申请人： Dean Tran ,  Alan Hirschberg ,  Ha DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven Mass

发明人： Dean Tran ,  Alan Hirschberg ,  Ha DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven Mass

IPC分类号： H01L33/00

CPC分类号： H01L21/2007

摘要： Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.

摘要翻译： 通常非常薄且因此非常脆弱的超高速半导体仍需要连接到电路板和传热通路。 超高速电路和半导体器件具有通过各种沉积方法形成在晶片或衬底的背面上的载体板。 载体板是一系列金属层，每个金属层被选择为能够将相对厚的铜载体板附接到基板或晶片的背面。

公开(公告)号：US20070184285A1

公开(公告)日：2007-08-09

申请号：US11349609

申请日：2006-02-08

申请人： Dean Tran ,  Thomas Chung ,  Alan Hirschberg ,  Luis Rochin ,  Mark Kintis

发明人： Dean Tran ,  Thomas Chung ,  Alan Hirschberg ,  Luis Rochin ,  Mark Kintis

IPC分类号： B32B17/06 ,  B32B15/00

CPC分类号： B32B15/017 ,  B32B15/018 ,  C23C2/06 ,  C23C28/021 ,  C23C28/023 ,  C23C30/00 ,  C25D7/00 ,  H01R13/6581 ,  H01R13/6598

摘要： Protection against x-ray radiation is provided by a thin layer of a zinc-based alloy. An electronics component housing and lid are made to include a base of a lightweight alloy, a thin coating of the zinc-based alloy and an exterior finish metal layer. The zinc-based alloy provides excellent radiation protection and other advantages, without a significant weight penalty.

摘要翻译： 通过锌基合金的薄层提供对x射线辐射的保护。 电子部件壳体和盖子被制成为包括轻质合金的基底，锌基合金的薄涂层和外部精加工金属层。 锌基合金提供优异的辐射防护等优点，而没有显着的重量损失。

公开(公告)号：US07476606B2

公开(公告)日：2009-01-13

申请号：US11390772

申请日：2006-03-28

申请人： Dean Tran ,  Alan Hirschberg ,  Ha K. DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven J. Mass

发明人： Dean Tran ,  Alan Hirschberg ,  Ha K. DeMarco ,  Luis Rochin ,  Thomas Chung ,  Mark Kintis ,  Steven J. Mass

IPC分类号： H01L21/00 ,  H01L21/28

CPC分类号： H01L21/2007

摘要： Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.

摘要翻译： 通常非常薄且因此非常脆弱的超高速半导体仍需要连接到电路板和传热通路。 超高速电路和半导体器件具有通过各种沉积方法形成在晶片或衬底的背面上的载体板。 载体板是一系列金属层，每个金属层被选择为能够将相对厚的铜载体板附接到基板或晶片的背面。