Radial flow micro-channel heat sink with impingement cooling
    1.
    发明申请
    Radial flow micro-channel heat sink with impingement cooling 失效
    径流微通道散热器,具有冲击冷却功能

    公开(公告)号:US20070039720A1

    公开(公告)日:2007-02-22

    申请号:US11205338

    申请日:2005-08-17

    IPC分类号: H05K7/20

    摘要: A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially inwardly a second length from an outer periphery and extend axially a second height from the top surface of the base. A confining plate extends radially above the fins and is spaced below the bottom surface of the lid whereby coolant fluid flows from an inlet opening of the lid through the center opening of the confining plate and radially outwardly through the fins and upward around the outer edge of the confining plate and into the space above the confining plate to an outlet opening. A nozzle having a throat is disposed above the lid and extends below the lid to the confining plate. A flow diverter extends upwardly from the top surface of the base and into and through the throat of the nozzle.

    摘要翻译: 散热器从电子设备移除热量,并且包括底座,盖子。 第一翅片的内环从内圆周径向向外延伸第一长度,并从基座的顶表面轴向延伸第一高度,第二翅片的外环从外周向径向向内延伸第二长度,并且轴向延伸 从基座顶面的第二高度。 限制板径向延伸在翅片的上方并且在盖的底部表面下方间隔开,从而冷却剂流体从盖的入口开口流过约束板的中心开口并径向向外通过翅片并且向上绕着 限制板并进入限制板上方的空间到出口。 具有喉部的喷嘴设置在盖的上方并在盖的下方延伸到限制板。 分流器从基座的顶表面向上延伸并且穿过喷嘴的喉部。

    Capillary-assisted compact thermosiphon
    2.
    发明申请
    Capillary-assisted compact thermosiphon 有权
    毛细管辅助紧凑型热虹吸管

    公开(公告)号:US20070251674A1

    公开(公告)日:2007-11-01

    申请号:US11412287

    申请日:2006-04-27

    IPC分类号: F28D15/04

    摘要: A thermosiphon cooling assembly cools an electronic device with a conical condensing tube disposed about a curved central axis curving upwardly from a top of the evaporating unit to an upper distal end and a shroud disposed outward of an exterior surface of the condensing tube at the upper distal end extending axially along the central axis from the upper distal end to a lower edge spaced from the top defining an air opening. An air moving device moves air about the central axis within the shroud to the air opening. A plurality of condensing fins are disposed in the condensing tube and each condensing fin forms a pair of corners with an interior surface of the condensing tube and a wick material is disposed in each of the corners to return condensed vapor to the evaporating unit.

    摘要翻译: 热虹吸冷却组件用电子装置冷却电子装置,该锥形冷凝管围绕弯曲的中心轴线设置,该中心轴线从蒸发单元的顶部向上弯曲到上部远端,并且在上部远端处设置在冷凝管外表面外侧的护罩 所述端部沿所述中心轴线从所述上远端轴向延伸到与限定空气开口的顶部间隔开的下边缘。 空气移动装置将围绕护罩的中心轴线的空气移动到空气开口。 多个冷凝翅片设置在冷凝管中,并且每个冷凝翅片与冷凝管的内表面形成一对角部,并且每个角部设置芯材以将冷凝的蒸气返回到蒸发单元。

    Liquid cooled thermosiphon for electronic components

    公开(公告)号:US20060162904A1

    公开(公告)日:2006-07-27

    申请号:US11040989

    申请日:2005-01-21

    IPC分类号: H05K7/20

    摘要: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of the housing from the lower portion and flow interrupters are disposed in the upper portion for interrupting thermal boundary layer to enhance thermal heat transfer to the flow of liquid coolant through the coolant passage of the upper portion in response to heat transferred by an electronic device to the lower portion of the housing.

    Heat dissipation element for cooling electronic devices
    4.
    发明申请
    Heat dissipation element for cooling electronic devices 失效
    用于冷却电子设备的散热元件

    公开(公告)号:US20050247432A1

    公开(公告)日:2005-11-10

    申请号:US10840410

    申请日:2004-05-06

    摘要: A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).

    摘要翻译: 公开了一种用于冷却电子设备的散热元件。 散热元件具有用于安装要冷却的电子设备的顶表面和底表面。 顶表面限定了用于从电子设备散热的散热区域,并且多个传热翅片从顶表面向上突出并且与散热区域共同延伸。 每个传热翅片限定了具有上升和下降的多个台阶,并且每个台阶延伸穿过散热区域以最大化从电子设备散发的热量。 散热元件在与液体冷却单元(LCU)一起使用的冷板组件或与热虹吸冷却单元(TCU)一起使用的锅炉板组件中的任一个中特别有用。

    Cooling assembly
    5.
    发明申请
    Cooling assembly 失效
    冷却组件

    公开(公告)号:US20050039881A1

    公开(公告)日:2005-02-24

    申请号:US10646505

    申请日:2003-08-22

    IPC分类号: F28D15/02 H01L23/427 F28F7/00

    摘要: A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and are angled downwardly toward the base plate for directing working fluid on the condenser plate down a corner of the walls toward a portion of the base plate. Preferably, the base plate defines a first circumference and the condenser plate defines a second circumference larger than the first circumference such that the outer wall has an angled configuration extending between the base plate and the condenser plate to provide a larger area within the sealed chamber for a vapor phase of the working fluid than a liquid phase of the working fluid.

    摘要翻译: 一种具有基板和冷凝板的冷却组件。 外壁将基板与冷凝器板互连以限定密封室,工作流体设置在密封室内。 相交的分隔壁安装到冷凝器板上并朝向基板向下成角度,用于将冷凝板上的工作流体沿壁的一角向下朝向基板的一部分引导。 优选地,基板限定第一圆周,并且冷凝器板限定大于第一圆周的第二圆周,使得外壁具有在基板和冷凝器板之间延伸的成角度构造,以在密封室内提供更大的面积,用于 工作流体的气相比工作流体的液相。

    Low profile thermosiphon
    6.
    发明申请
    Low profile thermosiphon 失效
    低调热虹吸

    公开(公告)号:US20070246197A1

    公开(公告)日:2007-10-25

    申请号:US11407452

    申请日:2006-04-20

    IPC分类号: H05K7/20

    摘要: A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.

    摘要翻译: 用于耗散由电子设备产生的热量的热虹吸管冷却组件包括具有壳体顶部,壳体底部和相对侧面的壳体。 相对的侧面在壳体顶部和壳体底部之间延伸以限定低轮廓入口和低轮廓出口。 制冷剂设置在一个或多个沸腾室内。 由电子装置产生的热量通过沸腾室转移至制冷剂进行液 - 气转化。 具有底端和顶端的冷凝器管从沸腾室以对角线向上的角度延伸穿过壳体底部和壳体顶部之间的侧面。 冷凝器管接收并冷凝从制冷剂中蒸发的蒸气。 空气移动装置将空气轴向移动通过壳体。 空气流过冷凝器管,以便冷凝。

    Evaporatively cooled thermosiphon
    7.
    发明申请
    Evaporatively cooled thermosiphon 审中-公开
    蒸发冷却热虹吸管

    公开(公告)号:US20070227703A1

    公开(公告)日:2007-10-04

    申请号:US11395696

    申请日:2006-03-31

    IPC分类号: F28D15/04

    摘要: A thermosiphon cooling assembly cools an electronic device with a first refrigerant disposed in the lower boiling chamber of a housing for liquid-to-vapor transformation and a second refrigerant disposed in an upper evaporating chamber of a housing for liquid-to-vapor transformation. The partition separating the lower boiling chamber of the housing from the upper evaporating chamber of the housing creates a series of vapor chambers within the lower boiling portion for condensing vapor boiled off the first refrigerant. The upper evaporating chamber contains a series of refrigerant pockets interleaved vertically with the vapor chambers to increase the surface area for heat transfer between the refrigerant vapor and the second refrigerant for absorbing heat by the second refrigerant for liquid-to-vapor transformation.

    摘要翻译: 热虹吸冷却组件用设置在壳体的低沸点室中的第一制冷剂冷却电子设备以进行液体 - 蒸汽转化,并且将第二制冷剂设置在用于液体 - 蒸汽转化的壳体的上部蒸发室中。 将壳体的下部沸腾室与壳体的上部蒸发室分开的隔板在低沸点部分内产生一系列蒸气室,用于冷凝从第一制冷剂沸腾的蒸汽。 上部蒸发室含有与蒸气室垂直交错的一系列制冷剂槽,以增加制冷剂蒸气和第二制冷剂之间的热传递的表面积,用于吸收由第二制冷剂进行液 - 气转化的热量。

    Evaporative cooler assisted automotive air conditioning system
    8.
    发明申请
    Evaporative cooler assisted automotive air conditioning system 失效
    蒸发冷却器辅助汽车空调系统

    公开(公告)号:US20070163772A1

    公开(公告)日:2007-07-19

    申请号:US11333904

    申请日:2006-01-18

    摘要: An automotive air conditioning system is disclosed comprising an evaporative cooler in series with the conventional vapor compression system. The evaporative cooler comprises an array of dry channels and a contiguous array of wet channels. The primary air stream to be conditioned by the evaporator of the conventional air conditioning system is preconditioned by the evaporative cooler by lowering its dry bulb temperature without changing its absolute humidity. An evaporator core is supported downstream of the evaporative cooler for receiving the primary air from the dry channels and thereby produces liquid condensate. The system is distinguished by conducting the liquid condensate from the evaporator core to the wicking tank for use in the wet channels of the evaporative cooler.

    摘要翻译: 公开了一种汽车空调系统,其包括与常规蒸汽压缩系统串联的蒸发冷却器。 蒸发冷却器包括干通道阵列和湿通道的连续阵列。 通过常规空调系统的蒸发器调节的一次空气流通过降低其干球温度而不改变其绝对湿度由蒸发冷却器预处理。 蒸发器芯支撑在蒸发冷却器的下游,用于从干燥通道接收一次空气,从而产生液体冷凝物。 该系统的特征在于将液体冷凝物从蒸发器核心引导到芯吸槽以用于蒸发冷却器的湿通道中。

    Cooling assembly with successively contracting and expanding coolant flow
    9.
    发明申请
    Cooling assembly with successively contracting and expanding coolant flow 审中-公开
    冷却组件随着冷却剂流动逐渐缩小和膨胀

    公开(公告)号:US20070144707A1

    公开(公告)日:2007-06-28

    申请号:US11527054

    申请日:2006-09-26

    IPC分类号: H05K7/20

    摘要: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.

    摘要翻译: 一种流体热交换器组件,其具有在入口和出口之间延伸的上壁和下壁,用于建立冷却电子设备的流动方向。 多个突起沿着流动方向线性地横向延伸,以在相邻的突起之间限定具有线性空腔的突出部分,使得当流体流过突起排时,流体流入和流出空腔,以使冷却剂流的收缩和膨胀 以最大限度地传热。 如横截面所示,突起可以是矩形,三角形或凸形。

    High performance thermosiphon with internally enhanced condensation
    10.
    发明申请
    High performance thermosiphon with internally enhanced condensation 有权
    高性能热虹吸内部增强冷凝

    公开(公告)号:US20070246196A1

    公开(公告)日:2007-10-25

    申请号:US11406621

    申请日:2006-04-19

    IPC分类号: H05K7/20

    摘要: A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.

    摘要翻译: 热虹吸管冷却组件包括设置在壳体的下部以进行液 - 蒸 - 冷循环的制冷剂。 混合装置设置在壳体的下部,用于在液体 - 蒸气 - 冷凝循环期间增加从电子装置的热传递。 混合装置可以包括设置在制冷剂的液体上方的蒸气搅拌器和/或设置在制冷剂液体中的液体搅拌器,用于将制冷剂的液体移动到锅炉板上。