公开(公告)号：US09231310B2

公开(公告)日：2016-01-05

申请号：US14035101

申请日：2013-09-24

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： George J. Purden ,  Shawn Shi

IPC: H01Q17/00 ,  H01Q1/32 ,  H01Q15/00 ,  G01S13/02 ,  H01Q1/38 ,  H01Q1/52 ,  G01S13/93

CPC classification number: H01Q17/00 ,  G01S7/038 ,  G01S13/003 ,  G01S13/02 ,  G01S13/931 ,  G01S2013/9389 ,  H01Q1/3283 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q15/0006

Abstract: An antenna for a radar sensor includes an emitter element, a receiver element, and an anti-reflection element. The emitter element is configured to direct the emitted signal along a boresight that intersects a fascia. The receiver element is configured to detect a reflected signal reflected by an object located beyond the fascia. The anti-reflection element is configured to reduce reflection by the antenna of an early-reflection portion reflected by the fascia.

Abstract translation: 用于雷达传感器的天线包括发射器元件，接收器元件和防反射元件。 发射器元件被配置为沿着与面板相交的视轴引导发射的信号。 接收器元件被配置为检测由位于面板之外的物体反射的反射信号。 防反射元件被配置为减少由面板反射的早期反射部分的天线的反射。

公开(公告)号：US20180108968A1

公开(公告)日：2018-04-19

申请号：US15292824

申请日：2016-10-13

Applicant: Delphi Technologies, Inc.

Inventor： George J. Purden ,  Shawn Shi ,  David W. Zimmerman

IPC: H01P3/10 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01P5/08 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16227 ,  H01P3/10 ,  H01P3/121 ,  H01P5/107 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/115

Abstract: A ball-grid-array printed-circuit-board assembly includes a die, a plurality of solder-balls, a substrate, a top-metal layer, and a bottom-metal layer. The die includes a signal-out-pad and a plurality of ground-pads arranged about the signal-out-pad. The top-metal layer, a plurality of vias in the substrate, and the bottom-metal layer cooperate to form a substrate-integrated-waveguide. The top-metal layer is configured to define a U-shaped-slot between a signal-portion of the top-metal layer aligned with the signal-out-pad and the substrate-integrated-waveguide, and a ground-portion of the top-metal layer aligned with the plurality of ground-pads. The U-shaped-slot is characterized by a slot-length that is selected based on the frequency of a signal, and a slot-width that is selected based on the via-height such that the signal generates an electric field directed across the U-shaped-slot whereby the signal is propagated from the signal-portion of the top-metal layer into the substrate-integrated-waveguide.

公开(公告)号：US20170271761A1

公开(公告)日：2017-09-21

申请号：US15070059

申请日：2016-03-15

Applicant: Delphi Technologies, Inc.

Inventor： George J. Purden ,  Shawn Shi

IPC: H01Q3/34 ,  H01Q1/50

Abstract: An illustrative example electronic device includes a substrate integrated wave guide (SIW) comprising a substrate and a plurality of conductive members in the substrate. An antenna member is situated at least partially in the substrate in a vicinity of at least some of the plurality of conductive members. A signal generator has a conductive output electrically coupled with the antenna member. The antenna member radiates a signal into the SIW based on operation of the signal generator.