公开(公告)号：US20240100963A1

公开(公告)日：2024-03-28

申请号：US18175257

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: B60L50/51 ,  B60L15/08 ,  H01L29/66 ,  H02P27/08

CPC classification number: B60L50/51 ,  B60L15/08 ,  H01L29/66553 ,  H02P27/08 ,  B60L2210/40

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first substrate and the second substrate; and a flex layer between the first substrate and the second substrate, the flex layer electrically connected to the power switch.

公开(公告)号：US20240106339A1

公开(公告)日：2024-03-28

申请号：US18175295

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: H02M7/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H02M7/003 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10166

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.

公开(公告)号：US20240105533A1

公开(公告)日：2024-03-28

申请号：US18175133

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: H01L23/15 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/15 ,  H01L23/3735 ,  H01L24/32 ,  H01L2224/32225

Abstract: A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate.

公开(公告)号：US20240107675A1

公开(公告)日：2024-03-28

申请号：US18175270

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: H05K1/18 ,  B60R16/02 ,  H01L23/495 ,  H01L23/538 ,  H01L25/07 ,  H02M7/00

CPC classification number: H05K1/182 ,  B60R16/02 ,  H01L23/49562 ,  H01L23/5383 ,  H01L25/072 ,  H02M7/003

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.

公开(公告)号：US20240106338A1

公开(公告)日：2024-03-28

申请号：US18175285

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: H02M7/00 ,  B60L53/22 ,  H01L23/495 ,  H01L23/538 ,  H01L25/07 ,  H02M1/08 ,  H02M7/5395 ,  H02P27/08

CPC classification number: H02M7/003 ,  B60L53/22 ,  H01L23/49562 ,  H01L23/5383 ,  H01L25/072 ,  H02M1/08 ,  H02M7/5395 ,  H02P27/08 ,  B60L2210/40

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module, the first power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first conductive layer and the second conductive layer, the power switch including a gate connection, wherein the power switch is configured to selectively electrically connect the first conductive layer to the second conductive layer based on a signal to the gate connection; and a point-of-use controller between the first conductive layer and the second conductive layer, the point-of-use controller configured to provide the signal to the gate connection to control the power switch.

公开(公告)号：US20200315030A1

公开(公告)日：2020-10-01

申请号：US16366909

申请日：2019-03-27

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： David W. Ihms

IPC: H05K3/34 ,  H05K1/18 ,  H05K3/28 ,  B23K1/00

Abstract: A conformal coating control method includes arranging at least one conformal control surface feature on a surface of a printed circuit board proximate perimeter pads of an integrated circuit. The method also includes soldering, to the printed circuit board, the integrated circuit. The method also includes applying a conformal coating material to the printed circuit board, wherein the conformal coating material is at least partially restricted from flowing between the integrated circuit and the printed circuit board by solder flux residue accumulated proximate the conformal control surface feature.

公开(公告)号：US20190172649A1

公开(公告)日：2019-06-06

申请号：US16190477

申请日：2018-11-14

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Manuel R. Fairchild ,  Ralph S. Taylor ,  David W. Ihms ,  Celine W. Wong

IPC: H01G4/32 ,  H01G4/005 ,  H01G4/12 ,  H01G13/00 ,  C04B35/491 ,  C04B35/622

Abstract: A ceramic-wound-capacitor includes a first-electrically-conductive-layer, a dielectric-layer, a second-electrically-conductive-layer, and a protective-coating. The dielectric-layer is formed of an antiferroelectric lead-lanthanum-zirconium-titanate. The protective-coating has a thickness of less than ten micrometers (10 μm) and provides electrical isolation between the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor. A method for fabricating the ceramic-wound-capacitor includes the steps of feeding a carrier-strip, depositing a sacrificial layer, depositing a first-electrically-conductive-layer, depositing a dielectric-layer, and depositing a second-electrically-conductive-layer to form an arrangement coupled to the carrier-strip by the sacrificial-layer, separating the arrangement from the carrier-strip and sacrificial-layer, creating an exposed-surface of the first-electrically-conductive-layer, applying a protective-coating to the exposed-surface of the first-electrically-conductive-layer, winding the arrangement with the protective-coating to form a ceramic-wound-capacitor, where the protective-coating is in direct contact with the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor.

公开(公告)号：US12087659B2

公开(公告)日：2024-09-10

申请号：US17005376

申请日：2020-08-28

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Binghua Pan ,  Wai Kwan Wong ,  David W. Ihms

IPC: H01L23/373 ,  B22D19/04 ,  H01L23/367

CPC classification number: H01L23/3735 ,  B22D19/04 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/3738

Abstract: An automotive power package includes a heat sink layer fabricated onto at least one surface of the automotive power package. The heat sink layer includes a material having a thermal conductivity higher than 130 W/m-K and a coefficient of thermal expansion between 5 and 15 ppm/° C.

公开(公告)号：US20240105534A1

公开(公告)日：2024-03-28

申请号：US18175240

申请日：2023-02-27

Applicant: Delphi Technologies IP Limited

Inventor： David Paul Buehler ,  Kevin M. Gertiser ,  David W. Ihms ,  Mark Wendell Gose

IPC: H01L23/15 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/15 ,  H01L23/3735 ,  H01L24/32 ,  H01L2224/32225

Abstract: A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.

公开(公告)号：US10163572B2

公开(公告)日：2018-12-25

申请号：US15447857

申请日：2017-03-02

Applicant: DELPHI TECHNOLOGIES IP LIMITED

Inventor： Manuel Ray Fairchild ,  Ralph S. Taylor ,  David W. Ihms ,  Celine Wk Wong

IPC: H01G4/008 ,  H01G4/32 ,  H01G4/12 ,  H01G13/02 ,  H01G4/224

Abstract: A ceramic-wound-capacitor includes a first-electrically-conductive-layer, a dielectric-layer, a second-electrically-conductive-layer, and a protective-coating. The dielectric-layer is formed of lead-lanthanum-zirconium-titanate (PLZT). The protective-coating has a thickness of less than ten micrometers (10 μm) and provides electrical isolation between the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor. A method for fabricating the ceramic-wound-capacitor includes the steps of feeding a carrier-strip, depositing a sacrificial layer, depositing a first-electrically-conductive-layer, depositing a dielectric-layer, and depositing a second-electrically-conductive-layer to form an arrangement coupled to the carrier-strip by the sacrificial-layer, separating the arrangement from the carrier-strip and sacrificial-layer, creating an exposed-surface of the first-electrically-conductive-layer, applying a protective-coating to the exposed-surface of the first-electrically-conductive-layer, winding the arrangement with the protective-coating to form a ceramic-wound-capacitor, where the protective-coating is in direct contact with the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor.