公开(公告)号：US20140218869A1

公开(公告)日：2014-08-07

申请号：US14167007

申请日：2014-01-29

Applicant: Denso Corporation

Inventor： Takahiro YAMANAKA ,  Yoshimichi HARA ,  Toshihisa YAMAMOTO ,  Kouji KAMEYAMA ,  Yuuji KOBAYASHI

IPC: H05K7/20 ,  H05K3/00 ,  H05K3/30 ,  H05K3/22 ,  H05K3/10

CPC classification number: H05K7/2039 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/5389 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/0265 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/10 ,  H05K3/22 ,  H05K3/303 ,  H05K3/4614 ,  H05K7/209 ,  H05K2201/10166 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.

Abstract translation: 电气装置的散热结构包括：至少一个多层基板，包括由绝缘材料制成的多个基部和导体图案，多个基底部分以多层结构堆叠，使得导体图案与 基部的层间连接部; 所述电气装置具有内置在所述至少一个多层基板中的第一电气元件和不设置在所述多层基板中的第二电气元件中的至少一个; 以及与电气装置相对的低耐热元件。 低耐热元件的耐热性低于绝缘材料。

公开(公告)号：US20140111944A1

公开(公告)日：2014-04-24

申请号：US14059809

申请日：2013-10-22

Applicant: DENSO CORPORATION

Inventor： Yoshimichi HARA ,  Toshihisa YAMAMOTO ,  Takahiro YAMANAKA ,  Kouji KAMEYAMA ,  Yuuji KOBAYASHI

IPC: H05K7/20 ,  H05K3/00

CPC classification number: H05K7/2039 ,  H01L23/3677 ,  H01L23/5389 ,  H01L2924/0002 ,  H02M7/003 ,  H02M2001/327 ,  H05K1/186 ,  H05K3/0011 ,  H05K3/0061 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/10166 ,  Y10T29/49227 ,  H01L2924/00

Abstract: A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.

Abstract translation: 散热结构包括多层板和散热器，用于散发在多层板中所包含的电子器件中产生的热量。 多层基板具有层叠在一起并由电绝缘材料制成的多个基部。 位于电子设备和散热器之间的基座部分没有由导电材料制成的层间连接导体，并且用作用于在电子设备和散热器之间提供电隔离的电绝缘层。