Abstract:
A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.
Abstract:
A semiconductor package includes a chip, a sealing body covering the chip, and a plurality of external connection terminals connected to the chip. The external connection terminals expose from a surface of the sealing body and are arranged in a grid on the surface of the sealing body. In the grid on the surface of the sealing body, each external connection terminal is adjacent to an area vacant of an other external connection terminal in at least one direction of eight directions from each external connection terminal, the eight directions including first linear directions along a row of the grid, second linear directions along a row of the grid perpendicular to the first linear directions, and four diagonal directions defined between the first linear directions and the second linear directions.
Abstract:
An in-vehicle power supply system includes a DC power source, a steering power converter, a steering drive control unit, a plurality of voltage-reducing devices, and a voltage-reducing control unit. The steering power converter converts electric power supplied from the DC power source, and provides the electric power converted to a steering assist motor. The steering drive control unit is supplied with electric power from the DC power source, and controls the steering power converter. The voltage-reducing devices are coupled in parallel to each other between the DC power source and the steering power converter. Each of the voltage-reducing devices reduces a power source voltage of the DC power source and generates a reduced voltage when being operated. The voltage-reducing control unit determines operation state or non-operation state of each of the voltage-reducing devices such that at least one of the voltage-reducing devices is in operation at a time.
Abstract:
In a control unit, a control part is operated by electric power from an ignition power supply, and controls operations of relays and inverters. A first end of a boosting part is electrically connected between at least one relay and a corresponding inverter. A second end of the boosting part is electrically connected to the control part. The boosting part boosts a voltage at the first end, and outputs the voltage boosted from the second end. An abnormality detecting portion detects an abnormality of the boosting part. When the abnormality detecting portion detects an abnormality of the boosting part, the control part controls the at least one relay to which the first end of the boosting part is connected to shut off a flow of electric power from a main power supply to the boosting part and to the inverter corresponding to the at least one relay.
Abstract:
An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the second circuit pattern. A resin body is wrapped around the semiconductor chip. A first metal plate has a side connected to the semiconductor chip and an other side connected to the first circuit pattern. A radiator projects toward and is connected to the first circuit pattern by a first heat conductor. As a result, heat generated by the semiconductor chip is transmitted to the radiator through the first metal plate, the first circuit pattern, and the first heat conductor during operation of the semiconductor module.
Abstract:
A first drive circuit of a motor drive apparatus drives a motor by converting electric power of a battery. A relay is connected in high potential line between the battery and an inverter. A diode is connected in parallel to the relay. The diode conducts a current in a regeneration direction, which is from a high potential side of the inverter to a high potential electrode of the battery, under a state that the relay is in the off-state. Thus, an inductive voltage, which is generated by the motor when a reverse input torque is applied from a load side, is led to the battery through the diode, and switching elements forming the inverter are protected from the inductive voltage.
Abstract:
An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.
Abstract:
A heat dissipation structure includes a multilayer board and a heat dissipator for dissipating heat generated in an electronic device incorporated in the multilayer board. The multilayer board has multiple base portions layered together and made of electrically insulating material. The base portion located between the electronic device and the heat dissipator has no interlayer connection conductor made of electrically conducting material and serves as an electrically insulating layer for providing electrical isolation between the electronic device and the heat dissipator.
Abstract:
Synthesized signal generation circuits are provided to correspond to a U-coil, a V-coil, a W-coil, respectively, and generate synthesized signals by synthesizing a first command signal and a second command signal generated by a command signal generation circuit. CPU output terminals output the synthesized signals. Signal wires are provided with one ends being connected electrically to the CPU output terminals, respectively, and other ends being connected electrically to IC input terminals of a driver IC, respectively. Gate signal generation circuits separate the synthesized signals applied to the IC input terminals to generate first gate signals as gate signals for high-side FETs and second gate signals as gate signals for low-side FETs.
Abstract:
A motor drive apparatus includes a back EMF detection element and a protection control circuit. When a voltage detected by the back EMF detection element exceeds a threshold voltage of a Zener diode, a voltage signal is applied to a sensing gate through a detection signal line to sequentially turn on switching element of the low-side arm. A current caused by the back EMF applied to a drive circuit flows to the ground through the switching element of the low-side arm in an on-state. Thus a braking torque is applied to a motor, which is driven to rotate by an external force, and hence the back EMF is reduced. Switching elements in the drive circuit are thus protected from the excessive voltage.