公开(公告)号：US5831555A

公开(公告)日：1998-11-03

申请号：US819016

申请日：1997-03-17

申请人： Der-Jang Yu ,  Wen-Chi Lin ,  Yi-Kai Wang ,  Chun-Pin Huang

发明人： Der-Jang Yu ,  Wen-Chi Lin ,  Yi-Kai Wang ,  Chun-Pin Huang

IPC分类号： H03M11/02 ,  H04B1/20 ,  H03K17/94 ,  H03M11/00

CPC分类号： H03M11/02 ,  H04B1/202

摘要： A cover-actuated keyboard encoding system is disclosed which can be used either alone or as a part of a universal remote control unit. It contains (a) a keyboard; (b) a memory for storing a plurality of control codes; (c) a special keyboard cover for covering the first keyboard; and (d) a computer program to convert the covered keys of the first keyboard into a control code. The keyboard cover is designed such that it contains one or more key-seat protrusions which are arranged such that they will be pressing against one or more of the first keys when the keyboard cover is closed. A CPU is programmed to scan the key board and convert the scanned keyboard value to a control code, in accordance with the number and locations of the keys that are being pressed during a power-on or a reset. This control code can be utilized as an initial code for identifying the brand and product type of the appliance to controlled by the universal remote control unit, thus allowing the universal remote control unit to operate as a conventional remote controller. The CPU can be further programmed to modify at least a portion of the initial control code if it detects that a universal key is pressed.

摘要翻译： 公开了一种盖式致动键盘编码系统，其可以单独使用或作为通用遥控单元的一部分使用。 它包含（a）键盘; （b）存储多个控制码的存储器; （c）用于覆盖第一键盘的专用键盘盖; 和（d）将第一键盘的被覆盖键转换为控制代码的计算机程序。 键盘盖被设计成使得其包含一个或多个键座突起，其被布置成当键盘盖关闭时它们将被按压在一个或多个第一键上。 CPU被编程为根据在上电或复位期间按下的键的数量和位置，扫描键盘并将扫描的键盘值转换为控制代码。 该控制代码可以用作用于识别由通用遥控单元控制的设备的品牌和产品类型的初始代码，从而允许通用遥控单元作为常规遥控器操作。 如果CPU检测到通用键被按下，则CPU可进一步被编程为修改初始控制代码的至少一部分。

公开(公告)号：US20080006602A1

公开(公告)日：2008-01-10

申请号：US11825984

申请日：2007-07-09

申请人： Chun-Pin Huang

发明人： Chun-Pin Huang

IPC分类号： C23C14/22 ,  B05B7/24 ,  B05D5/06

CPC分类号： G03F7/0043 ,  G03F7/16

摘要： An exemplary coating apparatus (40) for fabricating a color filter (3) includes a supporting table (44) and a dispenser (48). The supporting table supports a substrate (30) that serves as a foundation of the color filter. The dispenser includes plural first nozzles (412) for spraying a first color photo-resist onto the substrate, plural second nozzles (422) for spraying a second color photo-resist onto the substrate, and plural third nozzles (432) for spraying a third color photo-resist onto the substrate. The first, second and third nozzles simultaneously spray the first, second and third color photo-resists onto respective different locations on the substrate. Therefore three corresponding color resins can be formed on the substrate in a single coating step. Thus, a cost of fabricating the color filter is reduced.

摘要翻译： 用于制造滤色器（3）的示例性涂覆装置（40）包括支撑台（44）和分配器（48）。 支撑台支撑用作滤色器基础的基板（30）。 分配器包括用于将第一彩色光致抗蚀剂喷射到基板上的多个第一喷嘴（412），用于将第二彩色光致抗蚀剂喷射到基板上的多个第二喷嘴（422）和用于喷射第三颜色光刻胶 彩色光致抗蚀剂。 第一，第二和第三喷嘴同时将第一，第二和第三颜色光致抗蚀剂喷射到基板上相应的不同位置上。 因此，可以在单个涂布步骤中在基板上形成三种相应的着色树脂。 因此，制造滤色器的成本降低。

公开(公告)号：US20090004367A1

公开(公告)日：2009-01-01

申请号：US12172478

申请日：2008-07-14

申请人： Shih-Kwan LIU ,  Chun-Pin Huang ,  Yu-Chin Shu

发明人： Shih-Kwan LIU ,  Chun-Pin Huang ,  Yu-Chin Shu

IPC分类号： B05D3/14

CPC分类号： H01G4/30 ,  H01G2/22 ,  H01G4/2325 ,  H01G4/255 ,  Y10T428/24926

摘要： A ceramic glaze-coating structure of a chip element and a method of forming the same are provided. In the ceramic glaze-coating structure, a high-density, smooth, and high-impedance ceramic glaze is coated on the body of an element. As for the terminal electrode part, the unique firing characteristics between the material of the terminal electrode (e.g., conductive compositions) and the ceramic glaze are utilized, such that the ceramic glaze layer between the surface of the terminal electrode or the terminal electrode and the ceramic body is absorbed and then removed by sintering; thus, the ceramic glaze coating structure of a chip element with only the element body being coated is formed.

摘要翻译： 提供了一种芯片元件的陶瓷釉面结构及其形成方法。 在陶瓷釉面结构中，高密度，平滑和高阻抗的陶瓷釉料涂覆在元件的主体上。 对于端子电极部分，利用端子电极（例如，导电组合物）的材料和陶瓷釉料之间的独特的烧制特性，使得在端子电极或端子电极的表面之间的陶瓷釉层和 陶瓷体被吸收，然后通过烧结除去; 因此，形成仅具有被涂覆元件体的芯片元件的陶瓷釉涂层结构。

公开(公告)号：US20060234022A1

公开(公告)日：2006-10-19

申请号：US11403777

申请日：2006-04-13

申请人： Shih-Kwan Liu ,  Chun-Pin Huang ,  Yu-Chin Shu

发明人： Shih-Kwan Liu ,  Chun-Pin Huang ,  Yu-Chin Shu

IPC分类号： H01G4/228 ,  H01G4/06 ,  B32B18/00

CPC分类号： H01G4/30 ,  H01G2/22 ,  H01G4/2325 ,  H01G4/255 ,  Y10T428/24926

摘要： A ceramic glaze-coating structure of a chip element and a method of forming the same are provided. In the ceramic glaze-coating structure, a high-density, smooth, and high-impedance ceramic glaze is coated on the body of an element. As for the terminal electrode part, the unique firing characteristics between the material of the terminal electrode (e.g., conductive compositions) and the ceramic glaze are utilized, such that the ceramic glaze layer between the surface of the terminal electrode or the terminal electrode and the ceramic body is absorbed and then removed by sintering; thus, the ceramic glaze coating structure of a chip element with only the element body being coated is formed.

摘要翻译： 提供了一种芯片元件的陶瓷釉面结构及其形成方法。 在陶瓷釉面结构中，高密度，平滑和高阻抗的陶瓷釉料涂覆在元件的主体上。 对于端子电极部分，利用端子电极（例如，导电组合物）的材料和陶瓷釉料之间的独特的烧制特性，使得在端子电极或端子电极的表面之间的陶瓷釉层和 陶瓷体被吸收，然后通过烧结除去; 因此，形成仅具有被涂覆元件体的芯片元件的陶瓷釉涂层结构。