公开(公告)号：US20110084368A1

公开(公告)日：2011-04-14

申请号：US12970705

申请日：2010-12-16

申请人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US08071431B2

公开(公告)日：2011-12-06

申请号：US12970705

申请日：2010-12-16

申请人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L21/44

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US09054115B2

公开(公告)日：2015-06-09

申请号：US13311436

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L21/56 ,  H05K3/36 ,  H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US09041168B2

公开(公告)日：2015-05-26

申请号：US13311493

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US08399972B2

公开(公告)日：2013-03-19

申请号：US11499285

申请日：2006-08-04

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L23/49

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US20120146178A1

公开(公告)日：2012-06-14

申请号：US13311493

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L27/06 ,  H01L23/48

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US20120137514A1

公开(公告)日：2012-06-07

申请号：US13311436

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H05K3/36 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US20130021219A1

公开(公告)日：2013-01-24

申请号：US13543084

申请日：2012-07-06

申请人： Anil K. Agarwal ,  Dinhphuoc Vu Hoang ,  Howard E. Chen ,  Anthony James LoBianco ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Guohao Zhang

发明人： Anil K. Agarwal ,  Dinhphuoc Vu Hoang ,  Howard E. Chen ,  Anthony James LoBianco ,  Matthew Sean Read ,  Hoang Mong Nguyen ,  Guohao Zhang

IPC分类号： H01Q1/52 ,  H05K3/30 ,  H05K9/00

CPC分类号： H05K9/0064 ,  H01L23/552 ,  H01L2224/48227 ,  H01L2924/1421 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H04B1/3838 ,  H05K3/30 ,  H05K9/0028 ,  Y10T29/4913 ,  H01L2924/00

摘要： Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.

摘要翻译： 公开了与RF模块的射频（RF）屏蔽有关的设备和方法。 在一些实施例中，调谐屏蔽可以通过利用不同的屏蔽线结构和/或布置来实现，以增加需要的区域中的屏蔽，并且在不需要的地方减少屏蔽。 通过测量具有给定设计的模块的不同位置处的RF功率电平，可以获得屏蔽要求的这种调谐。 这种调谐的RF屏蔽配置可以提高屏蔽的总体有效性，并且也可以更具成本效益地实现。

公开(公告)号：US07925211B2

公开(公告)日：2011-04-12

申请号：US12429071

申请日：2009-04-23

申请人： Anil K. Agarwal ,  Moorthy N. Hariharan

发明人： Anil K. Agarwal ,  Moorthy N. Hariharan

IPC分类号： H04B7/185

CPC分类号： H04B7/2125 ,  H04B7/18513 ,  H04B7/18543 ,  H04B7/208 ,  H04L1/0003 ,  H04L1/0007 ,  H04L1/0009 ,  H04L1/0017 ,  H04L1/0025 ,  H04L1/0083 ,  H04W52/28

摘要： A method for dynamically determining the power compression point of an amplifier in a distributed network under the control of a computer, the network having a first terminal (600) including the amplifier operatively coupled to a plurality of second terminals (500) by a communication channel including the steps for generating bit error rate (BER) messages indicative of measured BER for a signal transmitted at N power levels, the BER messages including respective tags indicative of the N power levels for that BER, at the second terminals (500), and reducing the maximum allowed power of the amplifier when it is determined that the amplifier is approaching saturation responsive to the BER messages. Also described is a method for dynamic uplink power control for an amplifier in a distributed network.

摘要翻译： 一种用于在计算机的控制下动态地确定分布式网络中的放大器的功率压缩点的方法，所述网络具有包括通过通信信道可操作地耦合到多个第二终端（500）的放大器的第一终端（600） 包括用于产生指示在N个功率电平处发送的信号的测量BER的误码率（BER）消息的步骤，所述BER消息包括在第二终端（500）处指示该BER的N个功率电平的相应标签，以及 当确定放大器响应于BER消息接近饱和时，减小放大器的最大允许功率。 还描述了用于分布式网络中的放大器的动态上行链路功率控制的方法。

公开(公告)号：US07599658B1

公开(公告)日：2009-10-06

申请号：US09529773

申请日：1998-10-20

申请人： Anil K. Agarwal ,  Moorthy N. Hariharan

发明人： Anil K. Agarwal ,  Moorthy N. Hariharan

IPC分类号： H04B7/185

CPC分类号： H04B7/2125 ,  H04B7/18513 ,  H04B7/18543 ,  H04B7/208 ,  H04L1/0003 ,  H04L1/0007 ,  H04L1/0009 ,  H04L1/0017 ,  H04L1/0025 ,  H04L1/0083 ,  H04W52/28

摘要： A method for dynamically determining the power compression point of an amplifier in a distributed network under the control of a computer, the network having a first terminal (600) including the amplifier operatively coupled to a plurality of second terminals (500) by a communication channel including the steps for generating bit error rate (BER) messages indicative of measured BER for a signal transmitted at N power levels, the BER messages including respective tags indicative of the N power levels for that BER, at the second terminals (500), and reducing the maximum allowed power of the amplifier when it is determined that the amplifier is approaching saturation responsive to the BER messages. Also described is a method for dynamic uplink power control for an amplifier in a distributed network.

摘要翻译： 一种用于在计算机的控制下动态地确定分布式网络中的放大器的功率压缩点的方法，所述网络具有包括通过通信信道可操作地耦合到多个第二终端（500）的放大器的第一终端（600） 包括用于产生指示在N个功率电平处发送的信号的测量BER的误码率（BER）消息的步骤，所述BER消息包括在第二终端（500）处指示该BER的N个功率电平的相应标签，以及 当确定放大器响应于BER消息接近饱和时，减小放大器的最大允许功率。 还描述了用于分布式网络中的放大器的动态上行链路功率控制的方法。