公开(公告)号：US20120137514A1

公开(公告)日：2012-06-07

申请号：US13311436

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H05K3/36 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US09041168B2

公开(公告)日：2015-05-26

申请号：US13311493

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US08399972B2

公开(公告)日：2013-03-19

申请号：US11499285

申请日：2006-08-04

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L23/49

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US20120146178A1

公开(公告)日：2012-06-14

申请号：US13311493

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L27/06 ,  H01L23/48

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US09054115B2

公开(公告)日：2015-06-09

申请号：US13311436

申请日：2011-12-05

申请人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinhphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L21/56 ,  H05K3/36 ,  H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US08071431B2

公开(公告)日：2011-12-06

申请号：US12970705

申请日：2010-12-16

申请人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L21/44

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US20110084368A1

公开(公告)日：2011-04-14

申请号：US12970705

申请日：2010-12-16

申请人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

发明人： Dinphuoc V. Hoang ,  Thomas E. Noll ,  Anil K. Agarwal ,  Robert W. Warren ,  Matthew S. Read ,  Anthony LoBianco

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

摘要翻译： 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：US06320257B1

公开(公告)日：2001-11-20

申请号：US08312862

申请日：1994-09-27

申请人： Kumaraswamy Jayaraj ,  Thomas E. Noll ,  Harry F. Lockwood

发明人： Kumaraswamy Jayaraj ,  Thomas E. Noll ,  Harry F. Lockwood

IPC分类号： H01L2334

CPC分类号： H01L23/057 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3011

摘要： A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around the chips between the substrate and the heat sink. The substrate is either formed of or includes a layer of a thermoplastic material having low moisture permeability which material is preferably a liquid crystal polymer (LCP) and is a multiaxially oriented LCP material for preferred embodiments. Where the lid is a heat sink, the heat sink is formed of a material having high thermal conductivity and preferably a coefficient of thermal expansion which substantially matches that of the chip. A hermetic bond is formed between the side of each chip opposite that connected to the substrate and the heat sink. The thermal bond between the substrate and the lid/heat sink may be a pinched seal or may be provided, for example by an LCP frame which is hermetically bonded or sealed on one side to the substrate and on the other side to the lid/heat sink. The chips may operate in the RF or microwave bands with suitable interconnects on the substrate and the chips may also include optical components with optical fibers being sealed into the substrate and aligned with corresponding optical components to transmit light in at least one direction. A plurality of packages may be physically and electrically connected together in a stack to form a 3D array.

摘要翻译： 提供一种用于至少一个半导体芯片的密封封装，其由其上具有选择性地接合半导体芯片的电互连的基板和优选用作散热器的盖形成，其中围绕 基片和散热片之间的芯片。 基材由具有低透湿性的热塑性材料层形成或包含一层，该材料优选为液晶聚合物（LCP），并且为优选实施方式的多轴取向LCP材料。 在盖是散热器的情况下，散热器由具有高导热性并且优选地与芯片的热膨胀系数基本上匹配的热膨胀系数的材料形成。 在每个芯片的与基板连接的侧面和散热片之间形成密封。 衬底和盖/散热器之间的热粘合可以是压紧的密封件，或者可以例如通过LCP框架提供，所述LCP框架在一侧与衬底密封或密封，并且在另一侧与盖/热 水槽。 芯片可以在RF或微波带上工作，在衬底上具有合适的互连，并且芯片还可以包括光学部件，其中光纤被密封到衬底中并且与相应的光学部件对齐以在至少一个方向上透射光。 多个封装可以在堆叠中物理和电连接在一起以形成3D阵列。