NAND FLASH MEMORY DEVICE AND METHOD OF OPERATING SAME
    1.
    发明申请
    NAND FLASH MEMORY DEVICE AND METHOD OF OPERATING SAME 有权
    NAND闪存存储器件及其操作方法

    公开(公告)号:US20090257280A1

    公开(公告)日:2009-10-15

    申请号:US12405826

    申请日:2009-03-17

    IPC分类号: G11C16/06

    CPC分类号: G11C16/0483 G11C16/10

    摘要: An flash memory device includes a block of NAND cell units, each NAND cell unit in the block includes n memory cell transistors MC controlled by a plurality of n wordlines, and is connected in series between a string selection transistor SST connected to a bitline and a ground selection transistor GST. While a programming voltage Vpgm is applied to a selected wordline WL , a cutoff voltage Vss is applied to a nearby unselected wordline closer to the ground selection transistor GST to isolate a first local channel Ch1 from a second local channel Ch2. As the location i of the selected wordline WL increases close to the SST, the second channel potential Vch2 tends to increase excessively, causing errors. The excessive increase of Vch2 is prevented by modifying the voltages applied to string select lines (SSL) and/or to the bit lines (BL), or the pass voltages Vpass applied to the unselected wordlines (WL location i is equal or greater than a predetermined (stored) location number x. If incremental step pulse programming (ISPP) is implemented, the applied voltages are modified only if the ISPP loop count j is equal or greater than a predetermined (stored) critical loop number y.

    摘要翻译: 闪速存储器件包括一块NAND单元单元,该块中的每个NAND单元单元包括由多个n个字线控制的n个存储单元晶体管MC,并串联连接在连接到位线的串选择晶体管SST和 接地选择晶体管GST。 当编程电压Vpgm被施加到所选字线WL时,截止电压Vss被施加到靠近接地选择晶体管GST的附近未选字线,以将第一本地信道Ch1与第二本地信道Ch2隔离。 当所选择的字线WL i的位置i增加到接近于SST时,第二通道电位Vch2会过度增加,导致错误。 通过修改施加到串选择线(SSL)和/或位线(BL)的电压或施加到未选择字线(WL ),只有当所选择的字线WL i位置i等于或大于预定(存储的)位置号码x时。 如果实现增量步进脉冲编程(ISPP),只有当ISPP循环计数j等于或大于预定(存储)的关键循环数y时,才施加电压。

    Semiconductor memory devices and methods for forming the same
    2.
    发明授权
    Semiconductor memory devices and methods for forming the same 有权
    半导体存储器件及其形成方法

    公开(公告)号:US07494871B2

    公开(公告)日:2009-02-24

    申请号:US11647671

    申请日:2006-12-29

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.

    摘要翻译: 半导体存储器件可以包括半导体衬底上的选择晶体管和单元晶体管。 绝缘层覆盖选择晶体管和单元晶体管。 位线在绝缘层中并且电连接到相应的选择晶体管。 沿着相对于半导体衬底具有不同高度的至少两个不同的平行平面布置位线。

    Non-volatile memory devices including double diffused junction regions
    3.
    发明授权
    Non-volatile memory devices including double diffused junction regions 有权
    包括双扩散连接区域的非易失性存储器件

    公开(公告)号:US07898039B2

    公开(公告)日:2011-03-01

    申请号:US11675372

    申请日:2007-02-15

    IPC分类号: H01L21/70 H01L29/76

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    Methods of fabricating non-volatile memory devices including double diffused junction regions
    4.
    发明授权
    Methods of fabricating non-volatile memory devices including double diffused junction regions 有权
    制造包括双扩散连接区域的非易失性存储器件的方法

    公开(公告)号:US08324052B2

    公开(公告)日:2012-12-04

    申请号:US13010583

    申请日:2011-01-20

    IPC分类号: H01L21/331

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS
    5.
    发明申请
    METHODS OF FABRICATING NON-VOLATILE MEMORY DEVICES INCLUDING DOUBLE DIFFUSED JUNCTION REGIONS 有权
    制造非易失性记忆装置的方法,包括双重扩散结区

    公开(公告)号:US20110111570A1

    公开(公告)日:2011-05-12

    申请号:US13010583

    申请日:2011-01-20

    IPC分类号: H01L21/8234

    摘要: A nonvolatile memory device includes a string selection gate and a ground selection gate on a semiconductor substrate, and a plurality of memory cell gates on the substrate between the string selection gate and the ground selection gate. First impurity regions extend into the substrate to a first depth between ones of the plurality of memory cell gates. Second impurity regions extend into the substrate to a second depth that is greater than the first depth between the string selection gate and a first one of the plurality of memory cell gates immediately adjacent thereto, and between the ground selection gate and a last one of the plurality of memory cell gates immediately adjacent thereto. Related fabrication methods are also discussed.

    摘要翻译: 非易失性存储器件包括半导体衬底上的串选择栅极和接地选择栅极,以及在串选择栅极和地选择栅极之间的衬底上的多个存储单元栅极。 第一杂质区域延伸到衬底中到多个存储单元门之间的第一深度。 第二杂质区域延伸到衬底中的第二深度,该第二深度大于串选择栅极与紧邻其之间的多个存储单元栅极中的第一深度之间以及在接地选择栅极和最后一个栅极选择栅极之间的第一深度 与其紧邻的多个存储单元门。 还讨论了相关的制造方法。

    NAND flash memory device and method of operating same to reduce a difference between channel potentials therein
    6.
    发明授权
    NAND flash memory device and method of operating same to reduce a difference between channel potentials therein 有权
    NAND闪存器件及其操作方法以减少其中的沟道电位之间的差异

    公开(公告)号:US08456918B2

    公开(公告)日:2013-06-04

    申请号:US12405826

    申请日:2009-03-17

    IPC分类号: G11C11/34 G11C16/06

    CPC分类号: G11C16/0483 G11C16/10

    摘要: An flash memory device includes a block of NAND cell units, each NAND cell unit in the block includes n memory cell transistors MC controlled by a plurality of n wordlines, and is connected in series between a string selection transistor SST connected to a bitline and a ground selection transistor GST. While a programming voltage Vpgm is applied to a selected wordline WL , a cutoff voltage Vss is applied to a nearby unselected wordline closer to the ground selection transistor GST to isolate a first local channel Ch1 from a second local channel Ch2. As the location i of the selected wordline WL increases close to the SST, the second channel potential Vch2 tends to increase excessively, causing errors. The excessive increase of Vch2 is prevented by modifying the voltages applied to string select lines (SSL) and/or to the bit lines (BL), or the pass voltages Vpass applied to the unselected wordlines (WL location i is equal or greater than a predetermined (stored) location number x. If incremental step pulse programming (ISPP) is implemented, the applied voltages are modified only if the ISPP loop count j is equal or greater than a predetermined (stored) critical loop number y.

    摘要翻译: 闪速存储器件包括一块NAND单元单元,该块中的每个NAND单元单元包括由多个n个字线控制的n个存储单元晶体管MC,并串联连接在连接到位线的串选择晶体管SST和 接地选择晶体管GST。 当编程电压Vpgm被施加到所选字线WL时,截止电压Vss被施加到靠近接地选择晶体管GST的附近未选字线,以将第一本地信道Ch1与第二本地信道Ch2隔离。 当所选择的字线WL i的位置i增加到接近于SST时,第二通道电位Vch2会过度增加,导致错误。 通过修改施加到串选择线(SSL)和/或位线(BL)的电压或施加到未选择字线(WL ),只有当所选择的字线WL i位置i等于或大于预定(存储的)位置号码x时。 如果实现增量步进脉冲编程(ISPP),只有当ISPP循环计数j等于或大于预定(存储)的关键循环数y时,才施加电压。

    Semiconductor memory devices and methods for forming the same
    7.
    发明申请
    Semiconductor memory devices and methods for forming the same 有权
    半导体存储器件及其形成方法

    公开(公告)号:US20080081413A1

    公开(公告)日:2008-04-03

    申请号:US11647671

    申请日:2006-12-29

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11521

    摘要: A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.

    摘要翻译: 半导体存储器件可以包括半导体衬底上的选择晶体管和单元晶体管。 绝缘层覆盖选择晶体管和单元晶体管。 位线在绝缘层中并且电连接到相应的选择晶体管。 沿着相对于半导体衬底具有不同高度的至少两个不同的平行平面布置位线。

    NAND flash memory device and method of making same
    9.
    发明授权
    NAND flash memory device and method of making same 有权
    NAND闪存器件及其制作方法

    公开(公告)号:US08654585B2

    公开(公告)日:2014-02-18

    申请号:US13553242

    申请日:2012-07-19

    IPC分类号: G11C11/34

    摘要: An integrated circuit includes a NAND string including a string selection transistor SST and a ground selection transistor GST disposed at either end of series-connected memory storage cells MC. Each of the memory storage cells is a memory transistor having a floating gate, and at least one of the string selection transistor SST and the ground selection transistor GST is a memory transistor having a floating gate. The threshold voltage Vth of programmable string selection transistors SST and the ground selection transistor GST is variable and user controllable and need not be established by implantation during manufacture. Each of the programmable string selection transistors SST and the ground selection transistors GST in a memory block may be used to store random data, thus increasing the memory storage capacity of the flash memory device.

    摘要翻译: 集成电路包括一个包括串选择晶体管SST的NAND串和设置在串联存储单元MC的任一端的接地选择晶体管GST。 每个存储器存储单元是具有浮置栅极的存储晶体管,并且串选择晶体管SST和接地选择晶体管GST中的至少一个是具有浮置栅极的存储晶体管。 可编程串选择晶体管SST和接地选择晶体管GST的阈值电压Vth是可变的并且用户可控,并且不需要在制造期间通过注入建立。 存储器块中的每个可编程串选择晶体管SST和接地选择晶体管GST可用于存储随机数据,从而增加闪存器件的存储器存储容量。

    NAND FLASH MEMORY DEVICE AND METHOD OF MAKING SAME
    10.
    发明申请
    NAND FLASH MEMORY DEVICE AND METHOD OF MAKING SAME 有权
    NAND闪存存储器件及其制造方法

    公开(公告)号:US20120281475A1

    公开(公告)日:2012-11-08

    申请号:US13553242

    申请日:2012-07-19

    IPC分类号: G11C16/06

    摘要: An integrated circuit includes a NAND string including a string selection transistor SST and a ground selection transistor GST disposed at either end of series-connected memory storage cells MC. Each of the memory storage cells is a memory transistor having a floating gate, and at least one of the string selection transistor SST and the ground selection transistor GST is a memory transistor having a floating gate. The threshold voltage Vth of programmable string selection transistors SST and the ground selection transistor GST is variable and user controllable and need not be established by implantation during manufacture. Each of the programmable string selection transistors SST and the ground selection transistors GST in a memory block may be used to store random data, thus increasing the memory storage capacity of the flash memory device.

    摘要翻译: 集成电路包括一个包括串选择晶体管SST的NAND串和设置在串联存储单元MC的任一端的接地选择晶体管GST。 每个存储器存储单元是具有浮置栅极的存储晶体管,并且串选择晶体管SST和接地选择晶体管GST中的至少一个是具有浮置栅极的存储晶体管。 可编程串选择晶体管SST和接地选择晶体管GST的阈值电压Vth是可变的并且用户可控,并且不需要在制造期间通过注入建立。 存储器块中的每个可编程串选择晶体管SST和接地选择晶体管GST可用于存储随机数据,从而增加闪存器件的存储器存储容量。