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公开(公告)号：US08093690B2
公开(公告)日：2012-01-10
申请号：US12414996
申请日：2009-03-31
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译： 提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。 导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。 具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。
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公开(公告)号：US08592958B2
公开(公告)日：2013-11-26
申请号：US13315039
申请日：2011-12-08
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译： 提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。 导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。 具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。
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公开(公告)号：US20120098109A1
公开(公告)日：2012-04-26
申请号：US13315039
申请日：2011-12-08
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译： 提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。 导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。 具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。
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公开(公告)号：US20100110656A1
公开(公告)日：2010-05-06
申请号：US12388771
申请日：2009-02-19
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.
摘要翻译： 提供了包括多个导电体和用于更好的电磁干扰屏蔽的屏蔽层的芯片封装。 模制化合物上的屏蔽层与设置在基板上的导电体接触，并且屏蔽层和导电体用作EMI屏蔽。 屏蔽层通过连接到层叠基板的导电体和基板的接地平面进行电接地。
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公开(公告)号：US20100109132A1
公开(公告)日：2010-05-06
申请号：US12414996
申请日：2009-03-31
申请人： Dongkyun Ko , Jung Lee , Jaesun An
发明人： Dongkyun Ko , Jung Lee , Jaesun An
IPC分类号： H01L23/552 , H01L21/78
CPC分类号： H01L21/78 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0032 , H05K3/0052 , H05K3/284 , H05K2203/0415 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.
摘要翻译： 提供一种芯片封装，其包括具有多个用于更好的电磁干扰屏蔽的导电连接器的屏蔽层。 导电连接器可以灵活地布置在模塑料中，以更好的屏蔽性能。 具有导电连接器的屏蔽层用作EMI屏蔽，屏蔽层在封装结构内电接地。
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