公开(公告)号：US20150262893A1

公开(公告)日：2015-09-17

申请号：US14656429

申请日：2015-03-12

Applicant: EBARA CORPORATION

Inventor： Akira NAKAMURA ,  Hiroaki SHIBUE ,  Yasumasa HIROO ,  Hiroshi OTA ,  Taro TAKAHASHI ,  Mitsuo TADA

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/306 ,  G01B7/06 ,  B24B37/013 ,  B24B49/10

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  G01B7/105 ,  H01L22/14

Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (ΔX, ΔY) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).

Abstract translation: 抛光处理包括涡流传感器和抛光对象物不彼此相对的第一状态以及涡流传感器和抛光对象物体彼此面对的第二状态。 修正膜厚测量值的方法包括获得在第一状态下从涡流传感器输出的第一测量信号（Xout，Yout）（步骤S108），计算校正值（＆Dgr; X，＆Dgr; Y） 获取第一测量信号的基础和预先设置的参考信号（Xsd，Ysd），获得在第二状态下从涡流传感器输出的第二测量信号（X，Y）（步骤S104），并且校正所获得的第二测量信号 在进行抛光处理时，基于计算出的校正值的测量信号（步骤S105）。