公开(公告)号：US20150262893A1

公开(公告)日：2015-09-17

申请号：US14656429

申请日：2015-03-12

Applicant: EBARA CORPORATION

Inventor： Akira NAKAMURA ,  Hiroaki SHIBUE ,  Yasumasa HIROO ,  Hiroshi OTA ,  Taro TAKAHASHI ,  Mitsuo TADA

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/306 ,  G01B7/06 ,  B24B37/013 ,  B24B49/10

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  G01B7/105 ,  H01L22/14

Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (ΔX, ΔY) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).

Abstract translation: 抛光处理包括涡流传感器和抛光对象物不彼此相对的第一状态以及涡流传感器和抛光对象物体彼此面对的第二状态。 修正膜厚测量值的方法包括获得在第一状态下从涡流传感器输出的第一测量信号（Xout，Yout）（步骤S108），计算校正值（＆Dgr; X，＆Dgr; Y） 获取第一测量信号的基础和预先设置的参考信号（Xsd，Ysd），获得在第二状态下从涡流传感器输出的第二测量信号（X，Y）（步骤S104），并且校正所获得的第二测量信号 在进行抛光处理时，基于计算出的校正值的测量信号（步骤S105）。

公开(公告)号：US20170259394A1

公开(公告)日：2017-09-14

申请号：US15438505

申请日：2017-02-21

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Akira NAKAMURA ,  Hiroaki SHIBUE ,  Mitsuo TADA

IPC: B24B37/013 ,  H01L21/304 ,  H01L21/67 ,  B24B37/20 ,  B24B37/30

CPC classification number: B24B37/013 ,  B24B37/20 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67092 ,  H01L22/14 ,  H01L22/26

Abstract: An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.

公开(公告)号：US20190011591A1

公开(公告)日：2019-01-10

申请号：US15740626

申请日：2016-06-23

Applicant: EBARA CORPORATION

Inventor： Taro TAKAHASHI ,  Mitsuo TADA

IPC: G01V3/10 ,  G01R33/038 ,  G01N27/82 ,  G01R33/34

Abstract: The object of the present invention is to provide a small-sized metal detection sensor for detecting fine metal contaminants, using an electromagnetic induction detection technique.A metal detection sensor for 20 detecting metal 14 contained in an object under inspection moving through a passageway 18 comprises: magnets 24, 26 generating static magnetic field; and a coil 30 for detecting a magnetic field 28 generated by the metal 14. The magnets 24, 26 are located outside of the coil 30 along its axial direction, and the coil 30 is located outside of the magnets 24, 26 along the axial direction connecting the N poles and the S poles of the magnets 24, 26. The magnets 24, 26 are opposed to the coil 30.

公开(公告)号：US20150101752A1

公开(公告)日：2015-04-16

申请号：US14579292

申请日：2014-12-22

Applicant: EBARA CORPORATION

Inventor： Mitsuo TADA ,  Yasunari SUTO ,  Hirofumi ICHIHARA ,  Kenya ITO ,  Tamami TAKAHASHI

IPC: H01L21/67 ,  G01N29/44

CPC classification number: H01L21/67242 ,  B24B9/065 ,  B24B49/12 ,  G01N21/9501 ,  G01N29/44 ,  H01L21/67023 ,  H01L21/67075

Abstract: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.

Abstract translation: 投射/接收单元（52）将激光投射到周边部分（30）并且在液体被供给到基板（14）的同时接收反射光并在周边部分（30）上流动。 信号处理控制器（54）处理反射光的电信号以决定周边部分（30）的状态。 监视被抛光的周边部分的状态。 此外，检测到抛光终点。 也可以使用激光以外的透射波。 周边部分（30）也可以由通道形成部件包围，从而适当地形成通道。 即使在液体在基板周边部分上流动的情况下，也可以适当地测量周边部分。