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公开(公告)号：US11260493B2
公开(公告)日：2022-03-01
申请号：US16245989
申请日：2019-01-11
Applicant: EBARA CORPORATION
Inventor： Minoru Harada , Takahiro Nanjo , Hiroyuki Takenaka , Naoki Matsuda
Abstract: A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.
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2.发明申请METHOD OF DETECTING ABNORMALITY IN POLISHING OF A SUBSTRATE AND POLISHING APPARATUS 有权检测基板和抛光装置抛光中异常的方法公开(公告)号：US20160114455A1
公开(公告)日：2016-04-28
申请号：US14987434
申请日：2016-01-04
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/005 , B24B9/06
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
Abstract translation: 提供了检测基板的研磨异常的方法。 该方法包括：旋转衬底; 将抛光工具压靠在基板的边缘部分上以抛光边缘部分; 测量所述抛光工具相对于所述衬底的表面的位置; 从抛光工具的位置确定衬底的抛光量; 从所述基板的抛光量计算抛光速率; 并且如果抛光速率在预定范围之外，则判断出已经发生了基板边缘部分的抛光异常。
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公开(公告)号：US10830834B2
公开(公告)日：2020-11-10
申请号：US16245154
申请日：2019-01-10
Applicant: EBARA CORPORATION
Inventor： Masaki Tomita , Hiroyuki Takenaka , Mitsutoshi Yahagi
Abstract: A current measuring module for measuring a current flowing through the substrate holder using an inspection substrate is provided. The substrate holder includes a plurality of holder electric contacts. The plurality of holder electric contacts contact a substrate to supply the held substrate with a current. The substrate holder holds the inspection substrate for measuring the current flowing through the substrate holder. The plurality of holder electric contacts contact a plurality of respective independent substrate electric contacts disposed on the inspection substrate. The inspection substrate includes a plurality of measurement points connected to the plurality of respective substrate electric contacts with wirings and substrate side connectors electrically connected to the plurality of measurement points. The current measuring module includes a plurality of inspection probes configured to contact the plurality of respective measurement points on the inspection substrate.
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公开(公告)号：US10343252B2
公开(公告)日：2019-07-09
申请号：US15654594
申请日：2017-07-19
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B9/06 , B24B21/00 , B24B37/005
Abstract: An apparatus for detecting an abnormality in polishing of an edge portion of a substrate is provided. The apparatus includes: a substrate holder configured to rotate the substrate; a pressing device configured to press a polishing tool against the edge portion of the substrate to polish the edge portion; a measuring device configured to measure a position of the polishing tool relative to a surface of the substrate; and a controller configured to determine an amount of polishing of the substrate from the position of the polishing tool, calculate a polishing rate from the amount of polishing of the substrate, and judge that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
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公开(公告)号：US11436392B2
公开(公告)日：2022-09-06
申请号：US15982814
申请日：2018-05-17
Applicant: EBARA CORPORATION
Inventor： Yu Ishii , Keisuke Uchiyama , Kunio Oishi , Hiroyuki Takenaka
Abstract: A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.
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Patent Agency Ranking
公开(公告)号：US10354900B2
公开(公告)日：2019-07-16
申请号：US15356869
申请日：2016-11-21
Applicant: Ebara Corporation
Inventor： Akihiro Yazawa , Kenichi Kobayashi , Takahiro Nanjo , Hiroyuki Takenaka
IPC: H01L21/677 , H01L21/67 , H01L21/687
Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.
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公开(公告)号：US09782869B2
公开(公告)日：2017-10-10
申请号：US14987434
申请日：2016-01-04
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/00 , B24B37/005 , B24B9/06 , B24B21/00
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.
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公开(公告)号：US20190217438A1
公开(公告)日：2019-07-18
申请号：US16245989
申请日：2019-01-11
Applicant: EBARA CORPORATION
Inventor： Minoru Harada , Takahiro Nanjo , Hiroyuki Takenaka , Naoki Matsuda
CPC classification number: B24B21/004 , B24B9/065 , B24B21/002 , B24B21/20 , B24B49/006
Abstract: A substrate processing apparatus which causes a processing tape to abut against a processing object, including: a tape supply reel configured to supply the processing tape; a tape recovery reel configured to recover the processing tape; a recovery motor configured to apply a torque to the tape recovery reel; a tape feed motor configured to feed the processing tape between the tape supply reel and the tape recovery reel; and a control unit configured to control the tape feed motor, wherein the control unit controls the torque of the recovery motor depending on a change in an outer diameter of a roll of the processing tape wound by the tape recovery reel such that tension applied to the processing tape is constant, using a feed length of the tape fed by the tape feed motor and a thickness of the processing tape.
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公开(公告)号：US20170178940A1
公开(公告)日：2017-06-22
申请号：US15356869
申请日：2016-11-21
Applicant: Ebara Corporation
Inventor： Akihiro Yazawa , Kenichi Kobayashi , Takahiro Nanjo , Hiroyuki Takenaka
IPC: H01L21/677 , H01L21/67
CPC classification number: H01L21/67742 , H01L21/67173 , H01L21/67219 , H01L21/67259 , H01L21/68707
Abstract: Disclosed is a substrate transfer apparatus including: a pair of hands facing with each other; an opening/closing mechanism configured to move the pair of hands symmetrically in an opening/closing direction; a driving unit configured to transmit a power to the opening/closing mechanism; and a controller configured to control an operation of the driving unit. The opening/closing mechanism includes: a rotating body configured to rotate depending on a moving amount of the pair of hands in the opening/closing direction, and a sensor configured to detect a rotating amount of the rotating body. The controller controls an operation of the driving unit based on a signal from the sensor.
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公开(公告)号：US20170312879A1
公开(公告)日：2017-11-02
申请号：US15654594
申请日：2017-07-19
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/005 , B24B21/00 , B24B9/06
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.
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