公开(公告)号：US11099546B2

公开(公告)日：2021-08-24

申请号：US17036189

申请日：2020-09-29

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: H01L21/677 ,  G05B19/418 ,  G05B19/4155 ,  H01L21/67

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US10824135B2

公开(公告)日：2020-11-03

申请号：US15868753

申请日：2018-01-11

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: G05B19/4155 ,  H01L21/677 ,  G05B19/418 ,  H01L21/67

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US11461647B2

公开(公告)日：2022-10-04

申请号：US16705356

申请日：2019-12-06

Applicant: Ebara Corporation

Inventor： Kunio Oishi ,  Masashi Shimoyama ,  Ryuya Koizumi

IPC: G06F11/00 ,  G06N3/08 ,  H01L21/67 ,  G06N3/04 ,  G06F11/07 ,  G06F11/10 ,  G06F11/22 ,  G06F11/34

Abstract: A method of the present disclosure includes: plating a plurality of substrates using a substrate holder; determining a total number of substrates that have been plated using the substrate holder until a failure occurs in the substrate holder; determining a first processable number and a second processable number; generating a first data set constituted by a combination of first condition data and the first processable number, the first condition data representing a state of a component of the substrate holder; generating a second data set constituted by a combination of second condition data and the second processable number, the second condition data representing a state of a component of the substrate holder; and optimizing a parameter of a prediction model constituted by a neural network using training data including the first data set and the second data set.

公开(公告)号：US11436392B2

公开(公告)日：2022-09-06

申请号：US15982814

申请日：2018-05-17

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Keisuke Uchiyama ,  Kunio Oishi ,  Hiroyuki Takenaka

IPC: G06F17/18 ,  G06F30/20 ,  H01L21/67 ,  G06N3/08 ,  G06N5/00 ,  G06F111/10

Abstract: A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.

公开(公告)号：US11098414B2

公开(公告)日：2021-08-24

申请号：US16664599

申请日：2019-10-25

Applicant: EBARA CORPORATION

Inventor： Takashi Mitsuya ,  Ryuya Koizumi ,  Toshio Yokoyama ,  Masashi Shimoyama ,  Kunio Oishi

IPC: C25D17/00 ,  H01L21/67 ,  H01L21/66 ,  C25D21/12 ,  H01L21/768 ,  H01L23/00 ,  C25D17/06 ,  H01L21/288

Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

公开(公告)号：US12036634B2

公开(公告)日：2024-07-16

申请号：US16338931

申请日：2017-09-07

Applicant: Ebara Corporation

Inventor： Koichi Takeda ,  Tsuneo Torikoshi ,  Kunio Oishi ,  Katsuhide Watanabe ,  Hozumi Yasuda ,  Yu Ishii

IPC: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

CPC classification number: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

Abstract: A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

公开(公告)号：US20210011462A1

公开(公告)日：2021-01-14

申请号：US17036189

申请日：2020-09-29

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: G05B19/4155 ,  H01L21/677 ,  G05B19/418 ,  H01L21/67

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US10824138B2

公开(公告)日：2020-11-03

申请号：US16258137

申请日：2019-01-25

Applicant: EBARA CORPORATION

Inventor： Koji Nonobe ,  Takashi Mitsuya ,  Ryuya Koizumi ,  Kunio Oishi

IPC: G05B19/418 ,  G05B19/4155

Abstract: A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

公开(公告)号：US20200056301A1

公开(公告)日：2020-02-20

申请号：US16664599

申请日：2019-10-25

Applicant: EBARA CORPORATION

Inventor： Takashi Mitsuya ,  Ryuya Koizumi ,  Toshio Yokoyama ,  Masashi Shimoyama ,  Kunio Oishi

IPC: C25D17/00 ,  H01L23/00 ,  H01L21/768 ,  C25D21/12 ,  H01L21/67

Abstract: A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.