公开(公告)号：US20170072528A1

公开(公告)日：2017-03-16

申请号：US15341534

申请日：2016-11-02

申请人： EBARA CORPORATION

发明人： Tamami TAKAHASHI ,  Masaya SEKI ,  Hiroaki KUSA ,  Kenji YAMAGUCHI ,  Masayuki NAKANISHI

IPC分类号： B24B21/00 ,  B24B49/00 ,  B24B27/00 ,  B24B41/06 ,  B24B9/06 ,  B24B21/20

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

公开(公告)号：US20150104620A1

公开(公告)日：2015-04-16

申请号：US14577101

申请日：2014-12-19

申请人： EBARA CORPORATION

发明人： Tamami TAKAHASHI ,  Masaya SEKI ,  Hiroaki KUSA ,  Kenji YAMAGUCHI ,  Masayuki NAKANISHI

IPC分类号： B24B21/00 ,  B24B9/06

CPC分类号： B24B21/002 ,  B24B9/065 ,  B24B21/004 ,  B24B21/008 ,  B24B21/20 ,  B24B27/0076 ,  B24B37/042 ,  B24B37/30 ,  B24B41/068 ,  B24B49/00 ,  Y10T428/24777

摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。

公开(公告)号：US20160172221A1

公开(公告)日：2016-06-16

申请号：US15015484

申请日：2016-02-04

申请人： Ebara Corporation

发明人： Tamami TAKAHASHI ,  Mitsuhiko SHIRAKASHI ,  Kenya ITO ,  Kazuyuki INOUE ,  Kenji YAMAGUCHI ,  Masaya SEKI

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67219 ,  B24B9/065 ,  B24B49/04 ,  H01L21/302 ,  H01L21/461 ,  H01L21/67253 ,  H01L21/68707 ,  H01L21/68728

摘要： A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

摘要翻译： 基板处理装置包括：第一抛光单元，用于抛光基板周边部分;第一清洗单元，用于清洁基板;二次清洁和干燥单元，用于干燥在主清洗单元中清洁的基板;以及测量单元， 测量衬底的周边部分。 测量单元包括用于在第一和第二抛光单元中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构。