公开(公告)号：US20130213437A1

公开(公告)日：2013-08-22

申请号：US13772031

申请日：2013-02-20

Applicant: Ebara Corporation ,  Kabushiki Kaisha Toshiba

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00

CPC classification number: B08B1/001 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68728

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract translation: 基板处理装置以高的去除效率从基板中去除异物。 基板处理装置包括：洗涤器，其通过使洗涤部件与基板的第一表面滑动接触来进行基板的表面处理;流体静力支撑机构，用于经由流体压力而不接触基板来支撑基板的第二表面 所述第二表面是所述第一表面的相对表面，用于清洁所述经处理的基底的清洁剂以及用于干燥所述经清洁的基底的干燥器。 洗涤器使洗涤构件与第一表面滑动接触，同时围绕洗涤器的中心轴旋转洗涤构件。

公开(公告)号：US10799917B2

公开(公告)日：2020-10-13

申请号：US16405559

申请日：2019-05-07

Applicant: EBARA CORPORATION ,  TOSHIBA MEMORY CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

公开(公告)号：US20190262869A1

公开(公告)日：2019-08-29

申请号：US16405559

申请日：2019-05-07

Applicant: EBARA CORPORATION ,  TOSHIBA MEMORY CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

公开(公告)号：US20190262870A1

公开(公告)日：2019-08-29

申请号：US16405631

申请日：2019-05-07

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

公开(公告)号：US10328465B2

公开(公告)日：2019-06-25

申请号：US13772031

申请日：2013-02-20

Applicant: Ebara Corporation ,  TOSHIBA MEMORY CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.