中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

14 records (took 0.014 seconds)

    Liquid ring vacuum pump
    1.
    发明授权
    Liquid ring vacuum pump 有权

    公开(公告)号：US11143186B2

    公开(公告)日：2021-10-12

    申请号：US16473915

    申请日：2017-12-08

    Applicant: Ebara Corporation

    Inventor： Hiroyuki Kawasaki ,  Nozomu Sasaki

    IPC: F04C19/00 ,  F04C27/00 ,  F04C25/02

    Abstract: The present invention relates to a two-stage liquid ring vacuum pump in which two-stage impellers are attached to an axial end portion of a main shaft (rotating shaft) of a motor. The two-stage liquid ring vacuum pump includes a first-stage impeller (4) provided in a first-stage pump chamber (1), a second-stage impeller (5) provided in a second-stage pump chamber (2), a single rotating shaft (7) to which the first-stage impeller (4) and the second-stage impeller (5) are fixed, and an exhaust port (Pd) of the first-stage pump chamber (1) and an intake port (Ps) of the second-stage pump chamber (2) which communicate with each other. An outer diameter of the first-stage impeller (4) is larger than an outer diameter of the second-stage impeller (5).

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
    基板处理装置和基板处理方法

    公开(公告)号：US20130213437A1

    公开(公告)日：2013-08-22

    申请号：US13772031

    申请日：2013-02-20

    Applicant: Ebara Corporation ,  Kabushiki Kaisha Toshiba

    Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

    IPC: B08B1/00

    CPC classification number: B08B1/001 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68728

    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

    Abstract translation: 基板处理装置以高的去除效率从基板中去除异物。 基板处理装置包括：洗涤器，其通过使洗涤部件与基板的第一表面滑动接触来进行基板的表面处理;流体静力支撑机构，用于经由流体压力而不接触基板来支撑基板的第二表面 所述第二表面是所述第一表面的相对表面，用于清洁所述经处理的基底的清洁剂以及用于干燥所述经清洁的基底的干燥器。 洗涤器使洗涤构件与第一表面滑动接触，同时围绕洗涤器的中心轴旋转洗涤构件。

    Abrasive film fabrication method and abrasive film
    4.
    发明授权
    Abrasive film fabrication method and abrasive film 有权
    研磨膜制造方法和研磨膜

    公开(公告)号：US09393595B2

    公开(公告)日：2016-07-19

    申请号：US13950066

    申请日：2013-07-24

    Applicant: EBARA CORPORATION

    Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Masayuki Nakanishi ,  Kenya Ito

    IPC: B05D5/02 ,  B24D11/00

    CPC classification number: B24D11/003 ,  B05D5/02 ,  B24D11/00 ,  B24D11/001

    Abstract: A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

    Abstract translation: 制造磨料制品的方法包括制备基膜，用不含磨粒但含有粘合剂树脂的第一涂料涂覆基膜，并干燥涂料以形成第一层。 该方法还包括用含有磨料颗粒和粘合剂树脂的第二种涂料涂覆第一层，并干燥涂料以形成第二层。 该方法还包括加热第一层和第二层以进行酰亚胺化。

    VACUUM EVACUATION APPARATUS
    5.
    发明申请
    VACUUM EVACUATION APPARATUS 审中-公开
    真空灭火装置

    公开(公告)号：US20130259712A1

    公开(公告)日：2013-10-03

    申请号：US13849719

    申请日：2013-03-25

    Applicant: EBARA CORPORATION

    Inventor： Hiroyuki Kawasaki ,  Hiroshi Sobukawa ,  Atsushi Oyama

    IPC: F04B25/00

    CPC classification number: F04B25/00 ,  F04C23/00 ,  F04D19/042 ,  F04D19/046 ,  F04D25/16

    Abstract: The present invention relates to a vacuum evacuation apparatus which can be mounted in a posture that can freely be selected a vacuum evacuation apparatus for evacuating a container from an atmospheric pressure to a high vacuum or less includes a first vacuum pump for evacuating the container to a high vacuum or less, and a second vacuum pump for evacuating the container from an atmospheric pressure to a medium or low vacuum the first vacuum pump and the second vacuum pump are integrally connected to each other into an integral unit.

    Abstract translation: 本发明涉及一种可以以可自由选择的用于将容器从大气压抽出到高真空的真空排气装置的姿势安装的真空排气装置，包括用于将容器抽空到第一真空泵的第一真空泵 高真空度以下的第一真空泵和第二真空泵将第一真空泵和第二真空泵一体地连接成一体的单元，第二真空泵将容器从大气压抽出至中，低真空。

    Double-suction centrifugal pump
    7.
    发明授权
    Double-suction centrifugal pump 有权

    公开(公告)号：US11441576B2

    公开(公告)日：2022-09-13

    申请号：US17252932

    申请日：2019-05-29

    Applicant: EBARA CORPORATION

    Inventor： Soichiro Ogawa ,  Hiroyuki Kawasaki ,  Takayuki Miyamoto

    IPC: F04D29/42 ,  F04D1/00 ,  F04D29/28

    Abstract: The present invention relates to a reinforcing structure for a casing accommodating an impeller. A double-suction centrifugal pump includes: a rotational shaft (1); an impeller (2) secured to the rotational shaft (1); a casing (3) that accommodates the impeller (2) therein; and legs (5) secured to the casing (3). The casing (3) includes a suction volute (20) that communicates with a suction port (6), the casing (3) includes an upper casing (3a) and a lower casing (3b) fastened to each other, at least one rib (28A, 28B, 28C) is provided on each of both side surfaces of the lower casing (3b) constituting the suction volute (20), the rib (28A, 28B, 28C) extends in a radial direction of the rotational shaft (1) when viewed from an axial direction of the rotational shaft (1), and the rib (28A, 28B, 28C) is separated from the legs (5).

    Vertical multi-stage pump
    9.
    发明授权
    Vertical multi-stage pump 有权

    公开(公告)号：US12110909B2

    公开(公告)日：2024-10-08

    申请号：US17762437

    申请日：2020-09-25

    Applicant: EBARA CORPORATION

    Inventor： Masaki Watanabe ,  Hiroyuki Kawasaki ,  Shuyu Hsu

    IPC: F04D1/08 ,  F04D29/28 ,  F04D29/44 ,  F04D29/66

    CPC classification number: F04D29/661 ,  F04D1/08 ,  F04D29/28 ,  F04D29/441

    Abstract: A vertical multi-stage pump includes a rotation shaft extending in a vertical direction, a plurality of impellers fixed to the rotation shaft, a multi-stage pump chamber accommodating the plurality of impellers and comprising a suction port for a first-stage impeller at a lower end, a lower casing comprising a suction nozzle extending in a horizontal direction and forming a communication space communicating the suction nozzle and the suction port, and an inner cylinder member interposed between the multi-stage pump chamber and a lower casing and expanding the communication space in a vertical direction.

Patent Agency Ranking