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公开(公告)号：US20190287870A1
公开(公告)日：2019-09-19
申请号：US16356615
申请日：2019-03-18
摘要： The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.
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2.发明申请公开(公告)号：US20210358885A1
公开(公告)日：2021-11-18
申请号：US17387800
申请日：2021-07-28
IPC分类号： H01L23/00
摘要： Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
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公开(公告)号：US20200075535A1
公开(公告)日：2020-03-05
申请号：US16555060
申请日：2019-08-29
IPC分类号： H01L23/00
摘要： Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
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4.发明申请公开(公告)号：US20190211231A1
公开(公告)日：2019-07-11
申请号：US16221206
申请日：2018-12-14
IPC分类号： C09J7/30 , C09J167/02 , H01L21/02
CPC分类号： C09J7/30 , C08G77/16 , C08K3/346 , C08K3/36 , C08K2003/0812 , C08K2003/2237 , C08K2003/2296 , C08K2003/3045 , C09J167/02 , H01L21/02304
摘要： Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.
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