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1.发明申请Device, Arrangement, and Method for Measuring a Current Intensity in a Primary Conductor Through which Current Flows 有权用于测量电流流过的主导体中的电流强度的装置，装置和方法公开(公告)号：US20160266172A1
公开(公告)日：2016-09-15
申请号：US15032103
申请日：2014-10-29
Applicant: EPCOS AG
Inventor： Bernhard Ostrick , Carsten Dehoff
CPC classification number: G01R15/207 , G01R19/0092
Abstract: A device, an arrangement, and a method for measuring a current intensity in a primary conductor through which current flows are disclosed. In an embodiment, an apparatus includes a magnetic field-generating element configured to generate a reference magnetic field; and a magnetic field angle-sensitive element configured to measure an orientation of a total magnetic field, the total magnetic field is produced by overlapping of the primary magnetic field and the reference magnetic field in space, wherein the primary magnetic field and the reference magnetic field are not parallel to one another at a location of the magnetic field angle-sensitive element, and wherein the current intensity of the current flowing through the primary conductor is determinable from the orientation of the total magnetic field in space.
Abstract translation: 公开了用于测量电流流过的初级导体中的电流强度的装置，装置和方法。 在一个实施例中，装置包括被配置为产生参考磁场的磁场产生元件; 以及磁场角敏感元件，被配置为测量总磁场的取向，所述总磁场是通过所述一次磁场与空间中的所述参考磁场的重叠产生的，其中所述初级磁场和所述参考磁场 在磁场角敏感元件的位置处彼此不平行，并且其中流过主导体的电流的电流强度可以从空间中的总磁场的取向来确定。
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公开(公告)号：US20170184687A1
公开(公告)日：2017-06-29
申请号：US15325418
申请日：2015-07-06
Applicant: EPCOS AG
Inventor： Bernhard Ostrick , Wolfgang Schreiber-Prillwitz
IPC: G01R33/00 , G01R33/09 , G01R33/038
CPC classification number: G01R33/0005 , G01C19/5719 , G01L1/122 , G01L5/164 , G01L9/007 , G01L9/14 , G01L19/06 , G01P15/105 , G01R33/0047 , G01R33/038 , G01R33/093
Abstract: A sensor is disclosed. In an embodiment, the sensor includes a fixed structure, a movable structure movable relative to the fixed structure, a magnet configured to generate a magnetic field and a first magnetically sensitive element configured to determine the magnetic field at a position of the first magnetically sensitive element. The magnet is fastened to the fixed structure and the first magnetically sensitive element is fastened to the movable structure. Alternatively, the magnet is fastened to the movable structure and the first magnetically sensitive element is fastened to the fixed structure.
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公开(公告)号：US20160069831A1
公开(公告)日：2016-03-10
申请号：US14786492
申请日：2014-04-09
Applicant: EPCOS AG
Inventor： Bernhard Ostrick , Peter Balzer
CPC classification number: G01N27/225 , G01D11/245 , G01N33/0032
Abstract: A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.
Abstract translation: 传感器模块具有第一传感器元件和第二传感器元件。 第一传感器元件和第二传感器元件容纳在传感器模块的公共壳体中。 传感器模块包括导体结构，其包括电极结构和单独的连接结构。 连接结构以导电方式连接到第一传感器元件，并且电极结构被分配给第二传感器元件。
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公开(公告)号：US20170089796A1
公开(公告)日：2017-03-30
申请号：US15379018
申请日：2016-12-14
Applicant: Epcos AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , C04B35/626 , G01L19/04 , C04B35/185 , G01L19/06 , G01L19/00
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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公开(公告)号：US20150047435A1
公开(公告)日：2015-02-19
申请号：US14383862
申请日：2013-02-08
Applicant: EPCOS AG
Inventor： Bernhard Ostrick , Michael Schiffer
CPC classification number: G01L9/008 , B81B3/0021 , G01L9/0054 , G01L13/025
Abstract: A micromechanical measuring element has a sensitive element that comprises a diaphragm with an underside and an upper side. The micromechanical measuring element also has a cap, which is connected directly to the sensitive element. The sensitive element and the cap form a first chamber, which has a first opening.
Abstract translation: 微机械测量元件具有包括具有下侧和上侧的隔膜的敏感元件。 微机械测量元件还具有直接连接到敏感元件的盖。 敏感元件和盖形成具有第一开口的第一腔室。
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Patent Agency Ranking
6.发明授权公开(公告)号：US10670548B2
公开(公告)日：2020-06-02
申请号：US14786492
申请日：2014-04-09
Applicant: EPCOS AG
Inventor： Bernhard Ostrick , Peter Balzer
Abstract: A sensor module has a first sensor element and a second sensor element. The first sensor element and the second sensor element are accommodated in a common housing of the sensor module. The sensor module includes a conductor structure that comprises an electrode structure and a separate connection structure. The connection structure is connected in an electrically conductive manner to the first sensor element and the electrode structure is allocated to the second sensor element.
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公开(公告)号：US10018656B2
公开(公告)日：2018-07-10
申请号：US15032103
申请日：2014-10-29
Applicant: EPCOS AG
Inventor： Bernhard Ostrick , Carsten Dehoff
CPC classification number: G01R15/207 , G01R19/0092
Abstract: A device, an arrangement, and a method for measuring a current intensity in a primary conductor through which current flows are disclosed. In an embodiment, an apparatus includes a magnetic field-generating element configured to generate a reference magnetic field; and a magnetic field angle-sensitive element configured to measure an orientation of a total magnetic field, the total magnetic field is produced by overlapping of the primary magnetic field and the reference magnetic field in space, wherein the primary magnetic field and the reference magnetic field are not parallel to one another at a location of the magnetic field angle-sensitive element, and wherein the current intensity of the current flowing through the primary conductor is determinable from the orientation of the total magnetic field in space.
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公开(公告)号：US09909946B2
公开(公告)日：2018-03-06
申请号：US15379018
申请日：2016-12-14
Applicant: EPCOS AG
Inventor： Jan Ihle , Andreas Peschka , Bert Hundertmark , Benjamin Bohl , Bernhard Ostrick
IPC: G01L19/14 , G01L19/06 , G01L19/00 , G01L19/04 , C04B35/185 , C04B35/626
CPC classification number: G01L19/141 , C04B35/185 , C04B35/626 , C04B35/64 , C04B2235/3463 , C04B2235/6022 , C04B2235/656 , G01L19/0038 , G01L19/0084 , G01L19/04 , G01L19/0627 , G01L19/0681 , G01L19/143 , H01L2224/48091 , H01L2924/00014
Abstract: A pressure sensor system having a pressure sensor chip is specified. The pressure sensor chip is mounted on a mounting receptacle of a ceramic housing body having a pressure feed guided to the pressure sensor chip. The housing body is three-dimensionally shaped and monolithically formed and is formed by a ceramic material having a coefficient of thermal expansion which deviates by less than 30% from the coefficient of thermal expansion of the pressure sensor chip in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
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公开(公告)号：US20160013112A1
公开(公告)日：2016-01-14
申请号：US14766405
申请日：2013-11-20
Applicant: EPCOS AG
Inventor： Jan Ihle , Bernhard Ostrick , Wolfgang Schreiber-Prillwitz
CPC classification number: H01L23/291 , B81B7/0048 , B81B2207/012 , B81B2207/097 , B81C1/0023 , G01D11/245 , G01D11/30 , H01L21/56 , H01L2924/0002 , H01L2924/00
Abstract: A sensor system includes a sensor chip mounted on a mounting receptacle of a ceramic housing body. The housing body is shaped three-dimensionally and embodied monolithically and is formed by a ceramic material having a coefficient of thermal expansion which deviates from the coefficient of thermal expansion of the sensor chip by less than 30% in a temperature range of greater than or equal to −40° C. and less than or equal to 150° C.
Abstract translation: 传感器系统包括安装在陶瓷壳体主体的安装座上的传感器芯片。 壳体主体是三维成形的并且整体地成形并且由在大于或等于的温度范围内具有偏离传感器芯片的热膨胀系数的热膨胀系数的陶瓷材料形成的温度小于30％ 至-40℃且小于或等于150℃
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公开(公告)号：US20180292211A1
公开(公告)日：2018-10-11
申请号：US15765581
申请日：2016-09-27
Applicant: EPCOS AG
Inventor： Marcus Besson , Bernhard Ostrick
IPC: G01C19/5747 , G01C19/5712 , G01C19/5769 , G01R33/09
Abstract: A MEMS yaw-rate sensor is disclosed. In an embodiment, the MEMS yaw-rate sensor includes a first primary mass configured to perform a primary oscillation relative to a main body, a first secondary mass connected to the first primary mass via a first suspension such that a primary movement of the first primary mass excites a primary movement of the first secondary mass and a secondary movement of the first secondary mass relative to the first primary mass is permitted, a first magnetic-field-generating element and a first magnet-sensitive element, one being arranged on the main body and one being arranged on the first primary mass, wherein the first magnet-sensitive element is configured to determine the primary movement of the first primary mass relative to the main body and a second magnetic-field-generating element and a second magnet-sensitive element.
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