公开(公告)号：US20180194899A1

公开(公告)日：2018-07-12

申请号：US15867942

申请日：2018-01-11

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Po-Yu HUANG ,  Chung-Jen WU ,  Meng-Yen CHOU ,  Chang-Hong HO ,  Shun-Jen CHIANG ,  Chung-Kai CHENG

IPC分类号： C08G73/12 ,  G03F7/038 ,  G03F7/004

CPC分类号： C08G73/12 ,  C08G73/101 ,  C08G73/105 ,  C08G73/1071 ,  C09D179/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0387

摘要： The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1′): wherein G, P, R, Rx, D, E and m are those as defined in the specification. The present invention also provides a polyimide precursor composition or a photosensitive polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

公开(公告)号：US20180282577A1

公开(公告)日：2018-10-04

申请号：US15650648

申请日：2017-07-14

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Chung-Kai CHENG ,  Chung-Jen WU ,  Meng-Yen CHOU ,  Chang-Hong HO ,  Po-Yu HUANG ,  Shun-Jen CHIANG

IPC分类号： C09D179/08 ,  C08G73/10 ,  C09J7/02 ,  H01L27/32 ,  C08G73/14 ,  C08L63/00

摘要： The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

公开(公告)号：US20160369053A1

公开(公告)日：2016-12-22

申请号：US15185895

申请日：2016-06-17

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Shun-Jen CHIANG ,  Chung-Jen WU ,  Po-Yu HUANG ,  Meng-Yen CHOU ,  Chang-Hong HO ,  Chun-Kai CHENG

IPC分类号： C08G73/10 ,  H05K1/02 ,  H05K1/03 ,  C09D179/08

CPC分类号： C08G73/1042 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B2250/40 ,  B32B2270/00 ,  C08G73/106 ,  C08G73/1082 ,  C09D179/08 ,  H05K1/0353 ,  H05K3/0097 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2203/0143 ,  H05K2203/1545

摘要： The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

摘要翻译： 本发明提供具有通过动态机械分析（DMA）测量的至少两个玻璃化转变温度的聚酰亚胺树脂。 而且，包括聚酰亚胺树脂的覆金属层压板。

公开(公告)号：US20210079161A1

公开(公告)日：2021-03-18

申请号：US17101491

申请日：2020-11-23

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Meng-Yen CHOU ,  Chung-Jen WU ,  Chang-Hong HO ,  Shun-Jen CHIANG ,  Po-Yu HUANG ,  Chung-Kai CHENG

IPC分类号： C08G73/10 ,  C08G73/06 ,  C08G73/18 ,  C08G73/02

摘要： The present disclosure relates to a polyimide precursor composition comprising an antic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. Also, a use of the polyimide precursor composition and a polyimide made from the polyimide precursor composition.

公开(公告)号：US20180148544A1

公开(公告)日：2018-05-31

申请号：US15825326

申请日：2017-11-29

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Chang-Hong HO ,  Chung-Jen WU ,  Meng-Yen CHOU ,  Shun-Jen CHIANG ,  Po-Yu HUANG ,  Chung-Kai CHENG

IPC分类号： C08G73/14 ,  C08G69/44 ,  C08G81/02

CPC分类号： C08G73/14 ,  C08G69/44 ,  C08G73/101 ,  C08G73/1067 ,  C08G81/028 ,  C08K5/095

摘要： The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1′): wherein G, P, R, Rx, D, E and m are as defined in the specification. The present invention also provides a polyimide precursor composition comprising the amic acid ester oligomer, as well as a polyimide prepared from the composition.

公开(公告)号：US20180148541A1

公开(公告)日：2018-05-31

申请号：US15826871

申请日：2017-11-30

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Chang-Hong HO ,  Chung-Jen WU ,  Meng-Yen CHOU ,  Shun-Jen CHIANG ,  Po-Yu HUANG ,  Chung-Kai CHENG

IPC分类号： C08G73/10 ,  C08G73/12 ,  C08G18/10 ,  C08G18/34 ,  C08L79/08 ,  B32B37/00 ,  B32B38/00 ,  B32B38/10 ,  H05K1/03 ,  H05K3/28

摘要： The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and a diamine of Formula (2) or (3): wherein G, P, R, Rx, P′, D, E and m are as defined herein.The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

公开(公告)号：US20160369056A1

公开(公告)日：2016-12-22

申请号：US15185928

申请日：2016-06-17

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Chung-Jen WU ,  Shun-Jen CHIANG ,  Po-Yu HUANG ,  Meng-Yen CHOU ,  Chang-Hong HO

IPC分类号： C08G73/12 ,  H05K1/03 ,  C08K5/3472 ,  C08G73/10 ,  C09D179/08

CPC分类号： H05K1/0326 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B2250/40 ,  B32B2270/00 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/106 ,  C08G73/1082 ,  C09D179/08 ,  H05K1/0346 ,  H05K3/0097 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2203/0143 ,  H05K2203/1545 ,  C08K5/3472

摘要： The present disclosure relates to a polyimide precursor composition including an amic acid ester oligomer of formula (I): wherein r, Rx, G, P and R are as defined in the specification. The polyimide made from the polyimide precursor composition of the present disclosure provides adhesion upon hot pressing such that a quasi double-sided two-layer metal clad laminate with an appropriate peeling strength or a double-sided two-layer metal clad laminate with a high peeling strength can be provided.

摘要翻译： 其中r，Rx，G，P和R如说明书中所定义。 由本公开的聚酰亚胺前体组合物制成的聚酰亚胺在热压时提供粘合性，使得具有适当剥离强度的准双面双层双层金属包覆层压板或具有高剥离性的双面双层金属包覆层压板 可提供强度。

公开(公告)号：US20180002567A1

公开(公告)日：2018-01-04

申请号：US15636993

申请日：2017-06-29

申请人： ETERNAL MATERIALS CO., LTD.

发明人： Po-Yu HUANG ,  Chih-Min AN ,  Chung-Jen WU ,  Meng-Yen CHOU ,  Chang-Hong HO ,  Shun-Jen CHIANG ,  Chung-Kai CHENG

IPC分类号： C09D179/08 ,  C08J5/18 ,  H05K3/28 ,  C08G73/10 ,  C08G73/12

摘要： A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.