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    Electrolyte composition and application thereof
    2.
    发明授权
    Electrolyte composition and application thereof 有权

    公开(公告)号：US11011780B2

    公开(公告)日：2021-05-18

    申请号：US16177710

    申请日：2018-11-01

    申请人： ETERNAL MATERIALS CO., LTD.

    发明人： Wei-Chih Chen ,  Tu-Yi Wu ,  Chih Hsien Wang ,  Yi-Fang Jung

    IPC分类号： H01M10/0567 ,  H01M10/0569 ,  H01M10/0568 ,  H01M10/0525

    摘要： An electrolyte composition including a heterocyclic compound, an electrolyte salt and a solvent is provided. The heterocyclic compound includes, in the heterocyclic ring: (a) at least two nitrogen atoms each of which is bonded to a —Si(R1)3 group; and (b) at least one carbonyl group (C═O) or thiocarbonyl group (C═S), wherein R1 is a C1-3 alkyl group or an aryl group.
    The electrolyte composition of the present disclosure is suitable for an electrochemical device. Electrochemical devices, in particular batteries, using the electrolyte composition of else present disclosure are capable of efficiently inhibiting the moisture and acidity therein, thereby stabilizing the electrolyte salt therein, and preventing the electrolyte salt from being further decomposed and from producing hydrogen fluoride.

    METAL CLAD LAMINATE, PREPARATION METHOD THEREOF, AND METHOD FOR PREPARING FLEXIBLE CIRCUIT BOARD BY USING THE SAME
    9.
    发明申请
    METAL CLAD LAMINATE, PREPARATION METHOD THEREOF, AND METHOD FOR PREPARING FLEXIBLE CIRCUIT BOARD BY USING THE SAME 审中-公开
    金属层压板，其制备方法和使用它制备柔性电路板的方法

    公开(公告)号：US20160374208A1

    公开(公告)日：2016-12-22

    申请号：US15185946

    申请日：2016-06-17

    申请人： ETERNAL MATERIALS CO., LTD.

    发明人： Shun-Jen CHIANG ,  Chung-Jen WU ,  Meng-Yen CHOU

    IPC分类号： H05K3/10 ,  H05K3/00 ,  C09D179/08

    CPC分类号： H05K3/0097 ,  C09D179/08 ,  H05K1/0326 ,  H05K1/0346 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2203/0143 ,  H05K2203/1545

    摘要： The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

    摘要翻译： 本公开内容提供一种金属包覆层压板，其制备方法和使用该柔性电路板的方法。 本公开的覆金属层压板包括第一金属箔，直接设置在第一金属箔上的第一聚酰亚胺层，第二金属箔和直接设置在第二金属箔上的第二聚酰亚胺层，第一聚酰亚胺层位于 与第二聚酰亚胺层接触。 本公开的金属包覆层压板相当于结构上的双面柔性覆铜层压板（FCCL），在减少翘曲方面在机械性能方面优于单面FCCL，并且具有用于 电路制造同时在其两侧。