利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

3 条记录 (耗时 0.014 秒)

    RADIATION CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING OF PARTS WITH HIGH IMPACT RESISTANCE, HIGH DUCTILITY AND HIGH HEAT RESISTANCE
    1.
    发明公开
    RADIATION CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING OF PARTS WITH HIGH IMPACT RESISTANCE, HIGH DUCTILITY AND HIGH HEAT RESISTANCE 审中-公开

    公开(公告)号：US20240352172A1

    公开(公告)日：2024-10-24

    申请号：US18686003

    申请日：2022-08-17

    申请人： EVONIK OPERATIONS GMBH

    发明人： Yili WU ,  Erwin PENG ,  Soumya SARKAR ,  Ma Monica Carlos DELA CRUZ ,  Christel GOH ,  Shao Wen NG ,  Dinesh Kumar BASKER

    IPC分类号： C08F290/06 ,  B33Y70/00

    CPC分类号： C08F290/067 ,  B33Y70/00

    摘要： A liquid radiation curable composition comprising component a) 20 to 60 weight percent of one or more reactive oligomer(s) containing at least two urethane and/or urea linkages in the backbone and at least two ethylenic unsaturated group(s) which can form polymeric crosslink networks with the other components in the composition in the presence of radicals, anions, nucleophiles or combinations thereof, with a weight average molecular weight (Mw) of greater than 3000 g/mol and glass transition temperature Tg of the cured reactive oligomer(s) itself is greater than 25° C., component b) 20 to 60 weight percent of one or more reactive oligomer(s) containing at least two urethane and/or urea linkages in the backbone and at least two ethylenic unsaturated group(s) which can form multiple polymeric crosslink networks with the other components in the composition in the presence of radicals, anions, nucleophiles or combinations thereof and with component b) having a weight average molecular weight (Mw) average of 1000 g/mol or less and a glass transition temperature Tg of the cured reactive oligomer(s) is greater than 130° C., component c) 20 to 60 weight percent of one or more reactive monomer(s) containing at least one ethylenic unsaturated group capable of forming polymeric crosslinked networks with the other components in the composition in the presence of radicals, anions, nucleophiles or combinations thereof, the said reactive monomer(s) having at least one polar group and the glass transition temperature Tg of the cured monomer(s) is greater than 50° C., component d) 0.01 to 10 weight percent of one or more photoinitiator(s) capable of producing radicals when irradiated with actinic radiation, component e) 0.01 to 30 weight percent of one or more additive(s) selected from the group consisting of filler(s), pigment(s), dispersant(s), defoamer(s), antioxidant(s), light stabilizer(s), light absorber(s) or radical inhibitor(s), with the provision that the liquid radiation curable composition has a viscosity of no more than 10000 mPa.s at 25° C.

    RADIATION CURABLE RESIN
    3.
    发明公开
    RADIATION CURABLE RESIN 审中-公开

    公开(公告)号：US20240301111A1

    公开(公告)日：2024-09-12

    申请号：US18039246

    申请日：2021-11-19

    申请人： EVONIK OPERATIONS GMBH

    发明人： Dinesh Kumar BASKER ,  Soumya SARKAR ,  Yili WU ,  Erwin PENG

    IPC分类号： C08F265/06 ,  B33Y70/00 ,  C08F2/50

    CPC分类号： C08F265/06 ,  C08F2/50 ,  B33Y70/00

    摘要： A liquid, radiation curable composition with a viscosity of 1500 cps or lower, said composition comprising 5 to 50 weight percent of monomeric or oligomeric component a) with at least two aromatic (meth)acrylate groups, 0 to 20 weight percent of monomeric or oligomeric component b) with at least two (meth)acrylate groups comprising an alicyclic moiety having at least three rings that are fused or condensed, 10 to 45 weight percent of aliphatic oligomeric or polymeric component c) with at least two (meth)acrylate groups comprising at least one urethane linkage, 10 to 30 weight percent of monomeric component d) with one (meth)acrylate group having at least one hydroxyl moiety, 0.5 to 6 weight percent of one or more photo-initiators capable of forming radicals and 0 to 5 weight percent of color pigments, with components a), b), c) and d) being different from each other.