公开(公告)号：US09554485B2

公开(公告)日：2017-01-24

申请号：US14446138

申请日：2014-07-29

Applicant: EchoStar Technologies L.L.C.

Inventor： Jerome A. LaPalme ,  William T. Roberts

IPC: H05K7/20 ,  H01L23/40 ,  H01L23/367 ,  H01L23/00

CPC classification number: H05K7/20 ,  H01L23/367 ,  H01L23/4093 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3512 ,  H01L2924/014

Abstract: A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.

Abstract translation: 散热器实施例具有从散热器的主体部分的边缘向外和向下延伸的至少一个防摇摆片。 当散热器通过倒装芯片固定到母板上时，防摇摆片的前沿较低的边缘位于母板的顶表面之上。 在将散热器安装到母板的过程中，防摇摆片的前下边​​缘施加行程距离限制，从而限制施加到倒装芯片的模具的力，使得边缘和/或 倒装芯片的芯片的角部不被压碎，或者使得倒装芯片的芯片不会破裂。

公开(公告)号：US20160035642A1

公开(公告)日：2016-02-04

申请号：US14446138

申请日：2014-07-29

Applicant: EchoStar Technologies L.L.C.

Inventor： Jerome A. LaPalme ,  William T. Roberts

IPC: H01L23/367 ,  H01L23/40

CPC classification number: H05K7/20 ,  H01L23/367 ,  H01L23/4093 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3512 ,  H01L2924/014

Abstract: A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.

Abstract translation: 散热器实施例具有从散热器的主体部分的边缘向外和向下延伸的至少一个防摇摆片。 当散热器通过倒装芯片固定到母板上时，防摇摆片的前沿较低的边缘位于母板的顶表面之上。 在将散热器安装到母板的过程中，防摇摆片的前下边​​缘施加行程距离限制，从而限制施加到倒装芯片的模具的力，使得边缘和/或 倒装芯片的芯片的角部不被压碎，或者使得倒装芯片的芯片不会破裂。