Wafer level optical packaging system, and associated method of aligning optical wafers
    5.
    发明授权
    Wafer level optical packaging system, and associated method of aligning optical wafers 有权
    晶圆级光学封装系统以及对准光学晶片的相关方法

    公开(公告)号:US09035406B2

    公开(公告)日:2015-05-19

    申请号:US13113857

    申请日:2011-05-23

    摘要: An optical system has a first relief-type diffraction grating fiducial, or alignment mark, on a transparent surface of a first optical wafer or plate, the grating arranged to deflect light away from an optical path and appear black. The first wafer may have lenses. The first fiducial is aligned to another fiducial on a second wafer having further optical devices as part of system assembly; or the fiducials are aligned to alignment marks or fiducials on an underlying photosensor. Once the optical devices are aligned and the wafers bonded, they are diced to provide aligned optical structures for a completed camera system. Alternatively, an optical wafer is made by aligning a second relief-type diffraction grating fiducial on a first master to a first relief-type diffraction grating fiducial on an optical wafer preform, pressing the first master into a blob to form optical shapes and adhere the blob to the optical wafer preform.

    摘要翻译: 光学系统在第一光学晶片或板的透明表面上具有第一浮雕型衍射光栅基准或对准标记,所述光栅布置成使光偏离光路并且显现为黑色。 第一晶片可以具有透镜。 第一个基准与第二个晶片上的另一个基准对准,其另外的光学装置作为系统组件的一部分; 或者基准面与底层光电传感器上的对准标记或基准对齐。 一旦光学器件对准并且晶片结合,它们被切割以提供用于完成的相机系统的对准的光学结构。 或者,光学晶片是通过将第一母版上的第二浮雕型衍射光栅基准与光学晶片预制件上的第一浮雕型衍射光栅基准对准而制成的,将第一母版压入斑块以形成光学形状, 斑点到光学晶片预制件。

    Wafer Level Optical Packaging System, And Associated Method Of Aligning Optical Wafers
    6.
    发明申请
    Wafer Level Optical Packaging System, And Associated Method Of Aligning Optical Wafers 有权
    晶圆级光学包装系统以及对准光学晶片的关联方法

    公开(公告)号:US20120299138A1

    公开(公告)日:2012-11-29

    申请号:US13113857

    申请日:2011-05-23

    摘要: An optical system has a first relief-type diffraction grating fiducial, or alignment mark, on a transparent surface of a first optical wafer or plate, the grating arranged to deflect light away from an optical path and appear black. The first wafer may have lenses. The first fiducial is aligned to another fiducial on a second wafer having further optical devices as part of system assembly; or the fiducials are aligned to alignment marks or fiducials on an underlying photosensor. Once the optical devices are aligned and the wafers bonded, they are diced to provide aligned optical structures for a completed camera system. Alternatively, an optical wafer is made by aligning a second relief-type diffraction grating fiducial on a first master to a first relief-type diffraction grating fiducial on an optical wafer preform, pressing the first master into a blob to form optical shapes and adhere the blob to the optical wafer preform.

    摘要翻译: 光学系统在第一光学晶片或板的透明表面上具有第一浮雕型衍射光栅基准或对准标记,所述光栅布置成使光偏离光路并且显现为黑色。 第一晶片可以具有透镜。 第一个基准与第二个晶片上的另一个基准对准,其另外的光学装置作为系统组件的一部分; 或者基准面与底层光电传感器上的对准标记或基准对齐。 一旦光学器件对准并且晶片结合,它们被切割以提供用于完成的相机系统的对准的光学结构。 或者,光学晶片是通过将第一母版上的第二浮雕型衍射光栅基准与光学晶片预制件上的第一浮雕型衍射光栅基准对准而制成的,将第一母版按压成斑块以形成光学形状, 斑点到光学晶片预制件。