公开(公告)号：US08808862B2

公开(公告)日：2014-08-19

申请号：US13730012

申请日：2012-12-28

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh ,  Yi-Fei Yu

IPC: B32B27/38 ,  C09D163/00 ,  C09D151/00 ,  C08L63/00 ,  C08L51/00 ,  C08K5/08 ,  C08K5/315 ,  B32B15/092

CPC classification number: C09D163/00 ,  C08L63/00 ,  Y10S428/901 ,  Y10T428/31511 ,  C08L25/10 ,  C08L79/04

Abstract: A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.

Abstract translation: 树脂组合物包含（A）100重量份的环氧树脂; （B）20〜100重量份聚丁二烯苯乙烯二乙烯基苯接枝三元共聚树脂; （C）2〜20重量份二叔丁基氢醌（DTBHQ）; （D）5〜50重量份聚苯醚改性氰酸酯树脂; 和（E）无机填料，（F）链延伸密封剂和（G）催化剂中的至少一种。 该树脂组合物的特征在于具有高耐热性，低介电常数Dk和低介电损耗因数Df的特殊成分和比例，并且是无卤素的，因此可应用于印刷电路板的保护膜，绝缘保护膜 的电子部件和引线框的树脂绝缘膜。

公开(公告)号：US11697711B2

公开(公告)日：2023-07-11

申请号：US17354729

申请日：2021-06-22

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh ,  Chien-Hsiang Chen ,  Yi-Fei Yu

IPC: C08G73/12 ,  C08L79/08 ,  C08K5/00 ,  C08K3/013 ,  C08G73/10

CPC classification number: C08G73/121 ,  C08G73/106 ,  C08G73/1071 ,  C08G73/124 ,  C08G73/126 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/0066 ,  C08L79/08

Abstract: A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US11807756B2

公开(公告)日：2023-11-07

申请号：US17504970

申请日：2021-10-19

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei Yu ,  Ching-Huan Lee ,  Chen-Yu Hsieh

IPC: C08L79/08 ,  C08L71/00 ,  C08J5/24 ,  B32B15/08 ,  B32B15/20 ,  H05K1/03

CPC classification number: C08L79/08 ,  B32B15/08 ,  B32B15/20 ,  C08J5/244 ,  C08L71/00 ,  H05K1/0373 ,  B32B2457/08 ,  C08J2371/00 ,  C08J2379/08 ,  C08J2471/00 ,  C08J2479/08 ,  C08L2203/20 ,  C08L2205/035

Abstract: A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

公开(公告)号：US11591469B2

公开(公告)日：2023-02-28

申请号：US16923340

申请日：2020-07-08

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei Yu ,  Chien-Hung Lee ,  Chen-Yu Hsieh

IPC: C08L79/08 ,  C08G73/02 ,  C08K5/00 ,  C08K5/101 ,  C08G73/10 ,  C08F36/14 ,  C08G73/06 ,  C08J5/24

Abstract: A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

公开(公告)号：US11198788B2

公开(公告)日：2021-12-14

申请号：US16224105

申请日：2018-12-18

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Yi-Fei Yu ,  Ching-Hsien Hsu

IPC: C08L79/04 ,  C08L33/08 ,  C08L67/00 ,  C08L63/00 ,  C08L33/14 ,  C08J5/24 ,  C08J5/18 ,  C08G73/06

Abstract: A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.