公开(公告)号：US11807756B2

公开(公告)日：2023-11-07

申请号：US17504970

申请日：2021-10-19

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei Yu ,  Ching-Huan Lee ,  Chen-Yu Hsieh

IPC: C08L79/08 ,  C08L71/00 ,  C08J5/24 ,  B32B15/08 ,  B32B15/20 ,  H05K1/03

CPC classification number: C08L79/08 ,  B32B15/08 ,  B32B15/20 ,  C08J5/244 ,  C08L71/00 ,  H05K1/0373 ,  B32B2457/08 ,  C08J2371/00 ,  C08J2379/08 ,  C08J2471/00 ,  C08J2479/08 ,  C08L2203/20 ,  C08L2205/035

Abstract: A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.